81. Electrical Appliances and Equipment
Chapter Editor: N. A. Smith
General Profile
N. A. Smith
Lead-Acid Battery Manufacture
Barry P. Kelley
Batteries
N. A. Smith
Electric Cable Manufacture
David A. O’Malley
Electric Lamp and Tube Manufacture
Albert M. Zielinski
Domestic Electrical Appliance Manufacture
N. A. Smith and W. Klost
Environmental and Public Health Issues
Pittman, Alexander
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1. Composition of common batteries
2. Manufacture: domestic electrical appliances
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82. Metal Processing and Metal Working Industry
Chapter Editor: Michael McCann
Smelting and Refining
Pekka Roto
Copper, Lead and Zinc Smelting and Refining
Aluminium Smelting and Refining
Bertram D. Dinman
Gold Smelting and Refining
I.D. Gadaskina and L.A. Ryzik
Foundries
Franklin E. Mirer
Forging and Stamping
Robert M. Park
Welding and Thermal Cutting
Philip A. Platcow and G.S. Lyndon
Lathes
Toni Retsch
Grinding and Polishing
K. Welinder
Industrial Lubricants, Metal Working Fluids and Automotive Oils
Richard S. Kraus
Surface Treatment of Metals
J.G. Jones, J.R. Bevan, J.A. Catton, A. Zober, N. Fish, K.M. Morse, G. Thomas, M.A. El Kadeem and Philip A. Platcow
Metal Reclamation
Melvin E. Cassady and Richard D. Ringenwald, Jr.
Environmental Issues in Metal Finishing and Industrial Coatings
Stewart Forbes
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1. Inputs & outputs for copper smelting
2. Inputs & outputs for lead smelting
3. Inputs & outputs for zinc smelting
4. Inputs & outputs for aluminium smelting
5. Types of foundry furnaces
6. Process materials inputs and pollution outputs
7. Welding processes: Description & hazards
8. Summary of the hazards
9. Controls for aluminium, by operation
10. Controls for copper, by operation
11. Controls for lead, by operation
12. Controls for zinc, by operation
13. Controls for magnesium, by operation
14. Controls for mercury, by operation
15. Controls for nickel, by operation
16. Controls for precious metals
17. Controls for cadmium, by operation
18. Controls for selenium, by operation
19. Controls for cobalt, by operation
20. Controls for tin, by operation
21. Controls for titanium, by operation
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83. Microelectronics and Semiconductors
Chapter Editor: Michael E. Williams
General Profile
Michael E. Williams
Silicon Semiconductor Manufacturing
David G. Baldwin, James R. Rubin and Afsaneh Gerami
Liquid Crystal Displays
David G. Baldwin, James R. Rubin and Afsaneh Gerami
III-V Semiconductor Manufacturing
David G. Baldwin, Afsaneh Gerami and James R. Rubin
Printed Circuit Board and Computer Assembly
Michael E. Williams
Health Effects and Disease Patterns
Donald V. Lassiter
Environmental and Public Health Issues
Corky Chew
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1. Photoresist systems
2. Photoresist strippers
3. Wet chemical etchants
4. Plasma etching gases & etched materials
5. Junction formation dopants for diffusion
6. Major categories of silicon epitaxy
7. Major categories of CVD
8. Cleaning of flat panel displays
9. PWB process: Environmental, health & safety
10. PWB waste generation & controls
11. PCB waste generation & controls
12. Waste generation & controls
13. Matrix of priority needs
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84. Glass, Pottery and Related Materials
Chapter Editors: Joel Bender and Jonathan P. Hellerstein
Glass, Ceramics and Related Materials
Jonathan P. Hellerstein, Joel Bender, John G. Hadley and Charles M. Hohman
Case Study: Optical Fibres
George R. Osborne
Case Study: Synthetic Gems
Basil Dolphin
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1. Typical body constituents
2. Manufacturing processes
3. Selected chemical additives
4. Refractory usage by industry in the USA
5. Potential health & safety hazards
6. Nonfatal occupational injury & illness
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85. Printing, Photography and Reproduction Industry
Chapter Editor: David Richardson
Printing and Publication
Gordon C. Miller
Reproduction and Duplicating Services
Robert W. Kilpper
Health Issues and Disease Patterns
Barry R. Friedlander
Overview of Environmental Issues
Daniel R. English
Commercial Photographic Laboratories
David Richardson
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1. Exposures in the printing industry
2. Printing trade mortality risks
3. Chemical exposure in processing
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86. Woodworking
Chapter Editor: Jon Parish
General Profile
Debra Osinsky
Woodworking Processes
Jon K. Parish
Routing Machines
Beat Wegmüller
Wood Planing Machines
Beat Wegmüller
Health Effects and Disease Patterns
Leon J. Warshaw
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1. Poisonous, allergenic & biologically active wood varieties
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This article is a revision of the 3rd edition of the Encyclopaedia of Occupational Health and Safety article “Welding and thermal cutting” by G.S. Lyndon.
Process Overview
Welding is a generic term referring to the union of pieces of metal at joint faces rendered plastic or liquid by heat or pressure, or both. The three common direct sources of heat are:
Other sources of heat for welding are discussed below (see table 1).
Table 1. Process materials inputs and pollution outputs for lead smelting and refining
Process |
Material input |
Air emissions |
Process wastes |
Other wastes |
Lead sintering |
Lead ore, iron, silica, limestone flux, coke, soda, ash, pyrite, zinc, caustic, baghouse dust |
Sulphur dioxide, particulate matter contain-ing cadmium and lead |
||
Lead smelting |
Lead sinter, coke |
Sulphur dioxide, particulate matter contain-ing cadmium and lead |
Plant washdown wastewater, slag granulation water |
Slag containing impurities such as zinc, iron, silica and lime, surface impoundment solids |
Lead drossing |
Lead bullion, soda ash, sulphur, baghouse dust, coke |
Slag containing such impurities as copper, surface impoundment solids |
||
Lead refining |
Lead drossing bullion |
In gas welding and cutting, oxygen or air and a fuel gas are fed to a blowpipe (torch) in which they are mixed prior to combustion at the nozzle. The blowpipe is usually hand held (see figure 1). The heat melts the metal faces of the parts to be joined, causing them to flow together. A filler metal or alloy is frequently added. The alloy often has a lower melting point than the parts to be joined. In this case, the two pieces are generally not brought to fusion temperature (brazing, soldering). Chemical fluxes may be used to prevent oxidation and facilitate the joining.
Figure 1. Gas welding with a torch & rod of filter metal. The welder is protected by a leather apron, gauntlets and goggles
In arc welding, the arc is struck between an electrode and the workpieces. The electrode can be connected to either an alternating current (AC) or direct current (DC) electric supply. The temperature of this operation is about 4,000°C when the workpieces fuse together. Usually it is necessary to add molten metal to the joint either by melting the electrode itself (consumable electrode processes) or by melting a separate filler rod which is not carrying current (non-consumable electrode processes).
Most conventional arc welding is done manually by means of a covered (coated) consumable electrode in a hand-held electrode holder. Welding is also accomplished by many semi or fully automatic electric welding processes such as resistance welding or continuous electrode feed.
During the welding process, the welding area must be shielded from the atmosphere in order to prevent oxidation and contamination. There are two types of protection: flux coatings and inert gas shielding. In flux-shielded arc welding, the consumable electrode consists of a metal core surrounded by a flux coating material, which is usually a complex mixture of mineral and other components. The flux melts as welding progresses, covering the molten metal with slag and enveloping the welding area with a protective atmosphere of gases (e.g., carbon dioxide) generated by the heated flux. After welding, the slag must be removed, often by chipping.
In gas-shielded arc welding, a blanket of inert gas seals off the atmosphere and prevents oxidation and contamination during the welding process. Argon, helium, nitrogen or carbon dioxide are commonly used as the inert gases. The gas selected depends upon the nature of the materials to be welded. The two most popular types of gas-shielded arc welding are metal- and tungsten inert gas (MIG and TIG).
Resistance welding involves using the electrical resistance to the passage of a high current at low voltage through components to be welded to generate heat for melting the metal. The heat generated at the interface between the components brings them to welding temperatures.
Hazards and Their Prevention
All welding involves hazards of fire, burns, radiant heat (infrared radiation) and inhalation of metal fumes and other contaminants. Other hazards associated with specific welding processes include electrical hazards, noise, ultraviolet radiation, ozone, nitrogen dioxide, carbon monoxide, fluorides, compressed gas cylinders and explosions. See table 2 for additional detail.
Table 2. Description and hazards of welding processes
Welding Process |
Description |
Hazards |
Gas welding and cutting |
||
Welding |
The torch melts the metal surface and filler rod, causing a joint to be formed. |
Metal fumes, nitrogen dioxide, carbon monoxide, noise, burns, infrared radiation, fire, explosions |
Brazing |
The two metal surfaces are bonded without melting the metal. The melting temperature of the filler metal is above 450 °C. Heating is done by flame heating, resistance heating and induction heating. |
Metal fumes (especially cadmium), fluorides, fire, explosion, burns |
Soldering |
Similar to brazing, except the melting temperature of the filler metal is below 450 °C. Heating is also done using a soldering iron. |
Fluxes, lead fumes, burns |
Metal cutting and flame gouging |
In one variation, the metal is heated by a flame, and a jet of pure oxygen is directed onto the point of cutting and moved along the line to be cut. In flame gouging, a strip of surface metal is removed but the metal is not cut through. |
Metal fumes, nitrogen dioxide, carbon monoxide, noise, burns, infrared radiation, fire, explosions |
Gas pressure welding |
The parts are heated by gas jets while under pressure, and become forged together. |
Metal fumes, nitrogen dioxide, carbon monoxide, noise, burns, infrared radiation, fire, explosions |
Flux-shielded arc welding |
||
Shielded metal arc welding (SMAC); “stick” arc welding; manual metal arc welding (MMA); open arc welding |
Uses a consumable electrode consisting of a metal core surrounded by a flux coating |
Metal fumes, fluorides (especially with low-hydrogen electrodes), infrared and ultraviolet radiation, burns, electrical, fire; also noise, ozone, nitrogen dioxide |
Submerged arc welding (SAW) |
A blanket of granulated flux is deposited on the workpiece, followed by a consumable bare metal wire electrode. The arc melts the flux to produce a protective molten shield in the welding zone. |
Fluorides, fire, burns, infrared radiation, electrical; also metal fumes, noise, ultraviolet radiation, ozone, and nitrogen dioxide |
Gas-shielded arc welding |
||
Metal inert gas (MIG); gas metal arc welding (GMAC) |
The electrode is normally a bare consumable wire of similar composition to the weld metal and is fed continuously to the arc. |
Ultraviolet radiation, metal fumes, ozone, carbon monoxide (with CO2 gas), nitrogen dioxide, fire, burns, infrared radiation, electrical, fluorides, noise |
Tungsten inert gas (TIG); gas tungsten arc welding (GTAW); heliarc |
The tungsten electrode is non-consumable, and filler metal is introduced as a consumable into the arc manually. |
Ultraviolet radiation, metal fumes, ozone, nitrogen dioxide, fire, burns, infrared radiation, electrical, noise, fluorides, carbon monoxide |
Plasma arc welding (PAW) and plasma arc spraying; tungsten arc cutting |
Similar to TIG welding, except that the arc and stream of inert gases pass through a small orifice before reaching the workpiece, creating a “plasma” of highly ionized gas which can achieve temperatures of over 33,400°C.This is also used for metallizing. |
Metal fumes, ozone, nitrogen dioxide, ultraviolet and infrared radiation, noise; fire, burns, electrical, fluorides, carbon monoxide, possible x rays |
Flux core arc welding (FCAW); metal active gas welding (MAG) |
Uses a flux-cored consumable electrode; may have carbon dioxide shield (MAG) |
Ultraviolet radiation, metal fumes, ozone, carbon monoxide (with CO2 gas), nitrogen dioxide, fire, burns, infrared radiation, electrical, fluorides, noise |
Electric resistance welding |
||
Resistance welding (spot, seam, projection or butt welding) |
A high current at low voltage flows through the two components from electrodes. The heat generated at the interface between the components brings them to welding temperatures. During the passage of the current, pressure by the electrodes produces a forge weld. No flux or filler metal is used. |
Ozone, noise (sometimes), machinery hazards, fire, burns, electrical, metal fumes |
Electro-slag welding |
Used for vertical butt welding. The workpieces are set vertically, with a gap between them, and copper plates or shoes are placed on one or both sides of the joint to form a bath. An arc is established under a flux layer between one or more continuously fed electrode wires and a metal plate. A pool of molten metal is formed, protected by molten flux or slag, which is kept molten by resistance to the current passing between the electrode and the workpieces. This resistance-generated heat melts the sides of the joint and the electrode wire, filling the joint and making a weld. As welding progresses, the molten metal and slag are retained in position by shifting the copper plates. |
Burns, fire, infrared radiation, electrical, metal fumes |
Flash welding |
The two metal parts to be welded are connected to a low-voltage, high-current source. When the ends of the components are brought into contact, a large current flows, causing “flashing” to occur and bringing the ends of the components to welding temperatures. A forge weld is obtained by pressure. |
Electrical, burns, fire, metal fumes |
Other welding processes |
||
Electron beam welding |
A workpiece in an vacuum chamber is bombarded by a beam of electrons from an electron gun at high voltages. The energy of the electrons is transformed into heat upon striking the workpiece, thus melting the metal and fusing the workpiece. |
X rays at high voltages, electrical, burns, metal dusts, confined spaces |
Arcair cutting |
An arc is struck between the end of a carbon electrode (in a manual electrode holder with its own supply of compressed air) and the workpiece. The molten metal produced is blown away by jets of compressed air. |
Metal fumes, carbon monoxide, nitrogen dioxide, ozone, fire, burns, infrared radiation, electrical |
Friction welding |
A purely mechanical welding technique in which one component remains stationary while the other is rotated against it under pressure. Heat is generated by friction, and at forging temperature the rotation ceases. A forging pressure then effects the weld. |
Heat, burns, machinery hazards |
Laser welding and drilling |
Laser beams can be used in industrial applications requiring exceptionally high precision, such as miniature assemblies and micro techniques in the electronics industry or spinnerets for the artificial fibre industry. The laser beam melts and joins the workpieces. |
Electrical, laser radiation, ultraviolet radiation, fire, burns, metal fumes, decomposition products of workpiece coatings |
Stud welding |
An arc is struck between a metal stud (acting as the electrode) held in a stud welding gun and the metal plate to be joined, and raises the temperature of the ends of the components to melting point. The gun forces the stud against the plate and welds it. Shielding is provided by a ceramic ferrule surrounding the stud. |
Metal fumes, infrared and ultraviolet radiation, burns, electrical, fire, noise, ozone, nitrogen dioxide |
Thermite welding |
A mixture of aluminium powder and a metal oxide powder (iron, copper, etc.) is ignited in a crucible, producing molten metal with the evolution of intense heat. The crucible is tapped and the molten metal flows into the cavity to be welded (which is surrounded by a sand mould). This is often used to repair castings or forgings. |
Fire, explosion, infrared radiation, burns |
Much welding is not done in shops where conditions can generally be controlled, but in the field in the construction or repair of large structures and machinery (e.g., frameworks of buildings, bridges and towers, ships, railroad engines and cars, heavy equipment and so on). The welder may have to carry all his or her equipment to the site, set it up and work in confined spaces or on scaffolds. Physical strain, inordinate fatigue and musculoskeletal injuries may follow being required to reach, kneel or work in other uncomfortable and awkward positions. Heat stress may result from working in warm weather and the occlusive effects of the personal protective equipment, even without the heat generated by the welding process.
Compressed gas cylinders
In high-pressure gas welding installations, oxygen and the fuel gas (acetylene, hydrogen, town gas, propane) are supplied to the torch from cylinders. The gases are stored in these cylinders at high pressure. The special fire and explosion hazards and precautions for the safe use and storage of the fuel gases are also discussed elsewhere in this Encyclopaedia. The following precautions should be observed:
Acetylene generators
In the low-pressure gas welding process, acetylene is generally produced in generators by reaction of calcium carbide and water. The gas is then piped to the welding or cutting torch into which oxygen is fed.
Stationary generating plants should be installed either in the open air or in a well-ventilated building away from the main workshops. The ventilation of the generator house should be such as to prevent the formation of an explosive or toxic atmosphere. Adequate lighting should be provided; switches, other electrical gear and electrical lamps should either be located outside the building or be explosion-proof. Smoking, flames, torches, welding plant or flammable materials must be excluded from the house or from the vicinity of an open-air generator. Many of these precautions also apply to portable generators. Portable generators should be used, cleaned and recharged only in the open air or in a well-ventilated shop, away from any flammable material.
Calcium carbide is supplied in sealed drums. The material should be stored and kept dry, on a platform raised above the floor level. Stores must be situated under cover, and if they adjoin another building the party wall must be fireproof. The storeroom should be suitably ventilated through the roof. Drums should be opened only immediately before the generator is charged. A special opener should be provided and used; a hammer and chisel should never be used to open drums. It is dangerous to leave calcium carbide drums exposed to any source of water.
Before a generator is dismantled, all calcium carbide must be removed and the plant filled with water. The water should remain in the plant for at least half an hour to ensure that every part is free from gas. The dismantling and servicing should be carried out only by the manufacturer of the equipment or by a specialist. When a generator is being recharged or cleaned, none of the old charge must be used again.
Pieces of calcium carbide wedged in the feed mechanism or adhering to parts of the plant should be carefully removed, using non-sparking tools made of bronze or another suitable non-ferrous alloy.
All concerned should be fully conversant with the manufacturer’s instructions, which should be conspicuously displayed. The following precautions should also be observed:
Fire and explosion prevention
In locating welding operations, consideration should be given to surrounding walls, floors, nearby objects and waste material. The following procedures should be followed:
Protection from heat and burn hazards
Burns of the eyes and exposed parts of the body may occur due to contact with hot metal and spattering of incandescent metal particles or molten metal. In arc welding, a high-frequency spark used to initiate the arc can cause small, deep burns if concentrated at a point on the skin. Intense infrared and visible radiation from a gas welding or cutting flame and incandescent metal in the weld pool can cause discomfort to the operator and persons in the vicinity of the operation. Each operation should be considered in advance, and necessary precautions designed and implemented. Goggles made specifically for gas welding and cutting should be worn to protect the eyes from heat and light radiated from the work. Protective covers over filter glass should be cleaned as required and replaced when scratched or damaged. Where molten metal or hot particles are emitted, the protective clothing being worn should deflect spatter. The type and thickness of fire-resistant clothing worn should be chosen according to the degree of hazard. In cutting and arc welding operations, leather shoe coverings or other suitable spats should be worn to prevent hot particles from falling into boots or shoes. For protecting the hands and forearms against heat, spatter, slag and so on, the leather gauntlet type of glove with canvas or leather cuffs is sufficient. Other types of protective clothing include leather aprons, jackets, sleeves, leggings and head covering. In overhead welding, a protective cape and cap are necessary. All protective clothing should be free from oil or grease, and seams should be inside, so as not to trap globules of molten metal. Clothing should not have pockets or cuffs that could trap sparks, and it should be worn so sleeves overlap gloves, leggings overlap shoes and so on. Protective clothing should be inspected for burst seams or holes through which molten metal or slag may enter. Heavy articles left hot on completion of welding should always be marked “hot” as a warning to other workers. With resistance welding, the heat produced may not be visible, and burns can result from handling of hot assemblies. Particles of hot or molten metal should not fly out of spot, seam or projection welds if conditions are correct, but non-flammable screens should be used and precautions taken. Screens also protect passers-by from eye burns. Loose parts should not be left in the throat of the machine because they are liable to be projected with some velocity.
Electrical safety
Although no-load voltages in manual arc welding are relatively low (about 80 V or less), welding currents are high, and transformer primary circuits present the usual hazards of equipment operated at power supply line voltage. The risk of electric shock should therefore not be ignored, especially in cramped spaces or in insecure positions.
Before welding commences, the grounding installation on arc welding equipment should always be checked. Cables and connections should be sound and of adequate capacity. A proper grounding clamp or bolted terminal should always be used. Where two or more welding machines are grounded to the same structure, or where other portable electric tools are also in use, grounding should be supervised by a competent person. The working position should be dry, secure and free from dangerous obstructions. A well-arranged, well-lighted, properly ventilated and tidy workplace is important. For work in confined spaces or dangerous positions, additional electrical protection (no-load, low-voltage devices) can be installed in the welding circuit, ensuring that only extremely low-voltage current is available at the electrode holder when welding is not taking place. (See discussion of confined spaces below.) Electrode holders in which the electrodes are held by a spring grip or screw thread are recommended. Discomfort due to heating can be reduced by effective heat insulation on that part of the electrode holder which is held in the hand. Jaws and connections of electrode holders should be cleaned and tightened periodically to prevent overheating. Provision should be made to accommodate the electrode holder safely when not in use by means of an insulated hook or a fully insulated holder. The cable connection should be designed so that continued flexing of the cable will not cause wear and failure of the insulation. Dragging of cables and plastic gas supply tubes (gas-shielded processes) across hot plates or welds must be avoided. The electrode lead should not come in contact with the job or any other earthed object (ground). Rubber tubes and rubber-covered cables must not be used anywhere near the high-frequency discharge, because the ozone produced will rot the rubber. Plastic tubes and polyvinyl chloride (PVC) covered cables should be used for all supplies from the transformer to the electrode holder. Vulcanized or tough rubber-sheathed cables are satisfactory on the primary side. Dirt and metallic or other conducting dust can cause a breakdown in the high-frequency discharge unit. To avoid this condition, the unit should be cleaned regularly by blowing-out with compressed air. Hearing protection should be worn when using compressed air for more than a few seconds. For electron-beam welding, the safety of the equipment used must be checked prior to each operation. To protect against electric shock, a system of interlocks must be fitted to the various cabinets. A reliable system of grounding of all units and control cabinets is necessary. For plasma welding equipment used for cutting heavy thicknesses, the voltages may be as high as 400 V and danger should be anticipated. The technique of firing the arc by a high-frequency pulse exposes the operator to the dangers of an unpleasant shock and a painful, penetrating high-frequency burn.
Ultraviolet radiation
The brilliant light emitted by an electric arc contains a high proportion of ultraviolet radiation. Even momentary exposure to bursts of arc flash, including stray flashes from other workers’ arcs, may produce a painful conjunctivitis (photo-ophthalmia) known as “arc eye” or “eye flash”. If any person is exposed to arc flash, immediate medical attention must be sought. Excessive exposure to ultraviolet radiation may also cause overheating and burning of the skin (sunburn effect). Precautions include:
Chemical hazards
Airborne contaminants from welding and flame cutting, including fumes and gases, arise from a variety of sources:
Fumes and gases should be removed at the source by LEV. This can be provided by partial enclosure of the process or by the installation of hoods which supply sufficiently high air velocity across the weld position so as to ensure capture of the fumes.
Special attention should be paid to ventilation in the welding of non-ferrous metals and certain alloy steels, as well as to protection from the hazard of ozone, carbon monoxide and nitrogen dioxide which may be formed. Portable as well as fixed ventilation systems are readily available. In general, the exhausted air should not be recirculated. It should be recirculated only if there are not hazardous levels of ozone or other toxic gases and the exhaust air is filtered through a high-efficiency filter.
With electron-beam welding and if materials being welded are of a toxic nature (e.g., beryllium, plutonium and so on), care must be taken to protect the operator from any dust cloud when opening the chamber.
When there is a risk to health from toxic fumes (e.g., lead) and LEV is not practicable—for example, when lead-painted structures are being demolished by flame cutting—the use of respiratory protective equipment is necessary. In such circumstances, an approved, high-efficiency full-facepiece respirator or ahigh-efficiency positive pressure powered air-purified respirator (PAPR) should be worn. A high standard of maintenance of the motor and the battery is necessary, especially with the original high-efficiency positive pressure power respirator. The use of positive pressure compressed air line respirators should be encouraged where a suitable supply of breathing-quality compressed air is available. Whenever respiratory protective equipment is to be worn, the safety of the workplace should be reviewed to determine whether extra precautions are necessary, bearing in mind the restricted vision, entanglement possibilities and so on of persons wearing respiratory protective equipment.
Metal fume fever
Metal fume fever is commonly seen in workers exposed to the fumes of zinc in the galvanizing or tinning process, in brass founding, in the welding of galvanized metal and in metallizing or metal spraying, as well as from exposure to other metals such as copper, manganese and iron. It occurs in new workers and those returning to work after a weekend or holiday hiatus. It is an acute condition that occurs several hours after the initial inhalation of particles of a metal or its oxides. It starts with a bad taste in the mouth followed by dryness and irritation of the respiratory mucosa resulting in cough and occasionally dyspnoea and “tightness” of the chest. These may be accompanied by nausea and headache and, some 10 to 12 hours after the exposure, chills and fever which may be quite severe. These last several hours and are followed by sweating, sleep and often by polyuria and diarrhoea. There is no particular treatment, and recovery is usually complete in about 24 hours with no residua. It can be prevented by keeping exposure to the offending metallic fumes well within the recommended levels through the use of efficient LEV.
Confined spaces
For entry into confined spaces, there may be a risk of the atmosphere being explosive, toxic, oxygen deficient or combinations of the above. Any such confined space must be certified by a responsible person as safe for entry and for work with an arc or flame. A confined-space entry programme, including an entry permit system, may be required and is highly recommended for work that must be carried out in spaces that are typically not constructed for continuous occupancy. Examples include, but are not limited to, manholes, vaults, ship holds and the like. Ventilation of confined spaces is crucial, since gas welding not only produces airborne contaminants but also uses up oxygen. Gas-shielded arc welding processes can decrease the oxygen content of the air. (See figure 2.)
Figure 2. Welding in an enclosed space
S. F. Gilman
Noise
Noise is a hazard in several welding processes, including plasma welding, some types of resistance welding machines and gas welding. In plasma welding, the plasma jet is ejected at very high speeds, producing intense noise (up to 90 dBA), particularly in the higher frequency bands. The use of compressed air to blow off dust also creates high noise levels. To prevent hearing damage, ear plugs or muffs must be worn and a hearing conservation programme should be instituted, including audiometric (hearing capacity) examinations and employee training.
Ionizing radiation
In welding shops where welds are inspected radiographically with x-ray or gamma-ray equipment, the customary warning notices and instructions must be strictly observed. Workers must be kept at a safe distance from such equipment. Radioactive sources must be handled only with the required special tools and subject to special precautions.
Local and governmental regulations must be followed. See the chapter Radiation, ionizing elsewhere in this Encyclopaedia.
Sufficient shielding must be provided with electron-beam welding to prevent x rays from penetrating the walls and windows of the chamber. Any parts of the machine providing shields against x-ray radiation should be interlocked so that the machine cannot be energized unless they are in position. Machines should be checked at the time of installation for leaks of x-ray radiation, and regularly thereafter.
Other hazards
Resistance welding machines have at least one electrode, which moves with considerable force. If a machine is operated while a finger or hand is lying between the electrodes, severe crushing will result. Where possible, a suitable means of guarding must be devised to safeguard the operator. Cuts and lacerations can be minimized by first deburring components and by wearing protective gloves or gauntlets.
Lockout/tagout procedures should be used when machinery with electrical, mechanical or other energy sources is being maintained or repaired.
When slag is being removed from welds by chipping and so on, the eyes should be protected by goggles or other means.
Adapted from the 3rd edition, Encyclopaedia of Occupational Health and Safety.
The important part lathes play in metalworking shops is best illustrated by the fact that 90 to 95% of the swarf (metal shavings) produced in the valves and fittings industry originates from lathes. About one-tenth of the accidents reported in this industry are due to lathes; this corresponds to one-third of all machine accidents. According to a study of the relative accident frequency per machine unit carried out in a plant manufacturing small precision parts and electrical equipment, lathes rank fifth after woodworking machines, metal-cutting saws, power presses and drilling machines. The need for protective measures on lathes is therefore beyond doubt.
Turning is a machine process in which the diameter of material is reduced by a tool with a special cutting edge. The cutting movement is produced by rotating the workpiece, and the feed and traverse movements are produced by the tool. By varying these three basic movements, and also by choosing the appropriate tool cutting-edge geometry and material, it is possible to influence the rate of stock removal, surface quality, shape of the chip formed and tool wear.
Structure of Lathes
A typical lathe consists of:
Figure 1. Lathes and similar machines
This basic model of a lathe can be infinitely varied, from the universal machine to the special automatic lathe designed for one type of work only.
The most important types of lathe are as follows:
The future development of the lathe will probably concentrate on control systems. Contact controls will be increasingly replaced by electronic control systems. As regards the latter, there is a trend in evolution from interpolation-programmed to memory-programmed controls. It is foreseeable in the long run that the use of increasingly efficient process computers will tend to optimize the machining process.
Accidents
Lathe accidents are generally caused by:
Accident Prevention
The prevention of lathe accidents starts at the design stage. Designers should give special attention to control and transmission elements.
Control elements
Each lathe must be equipped with a power disconnect (or isolating) switch so that maintenance and repair work may be carried out safely. This switch must disconnect the current on all poles, reliably cut the pneumatic and hydraulic power and vent the circuits. On large machines, the disconnect switch should be so designed that it can be padlocked in its out position—a safety measure against accidental reconnection.
The layout of the machine controls should be such that the operator can easily distinguish and reach them, and that their manipulation presents no hazard. This means that controls must never be arranged at points which can be reached only by passing the hand over the working zone of the machine or where they may be hit by flying chips.
Switches which monitor guards and interlock them with the machine drive should be chosen and installed in such a way that they positively open the circuit as soon as the guard is shifted from its protecting position.
Emergency stop devices must cause the immediate standstill of the dangerous movement. They must be designed and located in such a way that they can be easily operated by the threatened worker. Emergency stop buttons must be easily reached and should be in red.
The actuating elements of control gear which may trip a dangerous machine movement must be guarded so as to exclude any inadvertent operation. For instance, the clutch engaging levers on the headstock and apron should be provided with safety locking devices or screens. A push-button can be made safe by lodging it in a recess or by shrouding it with a protective collar.
Hand-operated controls should be designed and located in such a way that the hand movement corresponds to the controlled machine movement.
Controls should be identified with easily readable and understandable markings. To avoid misunderstandings and linguistic difficulties, it is advisable to use symbols.
Transmission elements
All moving transmission elements (belts, pulleys, gears) must be covered with guards. An important contribution to the prevention of lathe accidents can be made by the persons responsible for the installation of the machine. Lathes should be so installed that the operators tending them do not hinder or endanger each other. The operators should not turn their backs towards passageways. Protective screens should be installed where neighbouring workplaces or passageways are within the range of flying chips.
Passageways must be clearly marked. Enough space should be left for materials-handling equipment, for stacking workpieces and for tool boxes. Bar-stock guides must not protrude into the passageways.
The floor on which the operator stands must be insulated against cold. Care should be taken that the insulation forms no stumbling obstacle, and the flooring should not become slippery even when covered with a film of oil.
Conduit and pipework should be installed in such a way that they do not become obstacles. Temporary installations should be avoided.
Safety engineering measures on the shop floor should be directed in particular at the following points:
It is important to provide for auxiliary lifting equipment to facilitate mounting and removing of heavy chucks and faceplates. To prevent chucks from running off the spindle when the lathe is suddenly braked, they must be securely fixed. This can be achieved by putting a retaining nut with left-hand thread on the spindle nose, by using a “Camlock” quick-action coupling, by fitting the chuck with a locking key or by securing it with a two-part locking ring.
When powered work-holding fixtures are used, such as hydraulically operated chucks, collets and tailstock centres, measures must be taken which make it impossible for the hands to be introduced into the danger zone of closing fixtures. This can be achieved by limiting the travel of the clamping element to 6 mm, by choosing the location of deadman’s controls so as to exclude the introduction of the hands into the danger zone or by providing a moving guard which has to be closed before the clamping movement can be started.
If starting the lathe while the chuck jaws are open presents a danger, the machine should be equipped with a device which prevents the spindle rotation being started before the jaws are closed. The absence of power must not cause the opening or closure of a powered work-holding fixture.
If the gripping force of a power chuck diminishes, the spindle rotation must be stopped, and it must be impossible to start the spindle. Reversing the gripping direction from inside to outside (or vice versa) while the spindle rotates must not cause the chuck to be dislodged from the spindle. Removal of holding fixtures from the spindle should be possible only when the spindle has ceased rotating.
When machining bar stock, the portion projecting beyond the lathe must be enclosed by bar-stock guides. Bar feed weights must be guarded by hinged covers extending to the floor.
Carriers
To prevent serious accidents—in particular, when filing work in a lathe—unprotected carriers must not be used. A centring safety carrier should be used, or a protective collar should be fitted to a conventional carrier. It is also possible to use self-locking carriers or to provide the carrier disc with a protective cover.
Working zone of the lathe
Universal-lathe chucks should be guarded by hinged covers. If possible, protective covers should be interlocked with spindle drive circuits. Vertical boring and turning mills should be fenced with bars or plates to prevent injury from revolving parts. To enable the operator to watch the machining process safely, platforms with railings must be provided. In certain cases, TV cameras can be installed so that the operator may monitor the tool edge and tool in-feed.
The working zones of automatic lathes, NC and CNC lathes should be completely enclosed. Enclosures of fully automatic machines should only have openings through which the stock to be machined is introduced, the turned part ejected and the swarf removed from the working zone. These openings must not constitute a hazard when work passes through them, and it must be impossible to reach through them into the danger zone.
The working zones of semi-automatic, NC and CNC lathes must be enclosed during the machining process. The enclosures are generally sliding covers with limit switches and interlocking circuit.
Operations requiring access to the working zone, such as change of work or tools, gauging and so on, must not be carried out before the lathe has been safely stopped. Zeroing a variable-speed drive is not considered a safe standstill. Machines with such drives must have locked protective covers that cannot be unlocked before the machine is safely stopped (e.g., by cutting the spindle-motor power supply).
If special tool-setting operations are required, an inching control is to be provided which enables certain machine movements to be tripped while the protective cover is open. In such cases, the operator can be protected by special circuit designs (e.g., by permitting only one movement to be tripped at a time). This can be achieved by using two-hand controls.
Turning swarf
Long turning chips are dangerous because they may get entangled with arms and legs and cause serious injury. Continuous and ravelled chips can be avoided by choosing appropriate cutting speeds, feeds and chip thicknesses or by using lathe tools with chip breakers of the gullet or step type. Swarf hooks with handle and buckle should be used for removing chips.
Ergonomics
Every machine should be so designed that it enables a maximal output to be obtained with a minimum of stress on the operator. This can be achieved by adapting the machine to the worker.
Ergonomic factors must be taken into account when designing the human-machine interface of a lathe. Rational workplace design also includes providing for auxiliary handling equipment, such as loading and unloading attachments.
All controls must be located within the physiological sphere or reach of both hands. The controls must be clearly laid out and should be logical to operate. Pedal-operated controls should be avoided in machines tended by standing operators.
Experience has shown that good work is performed when the workplace is designed for both standing and sitting postures. If the operator has to work standing up, he or she should be given the possibility of changing posture. Flexible seats are in many cases a welcome relief for strained feet and legs.
Measures should be taken to create optimal thermal comfort, taking into account the air temperature, relative humidity, air movement and radiant heat. The workshop should be adequately ventilated. There should be local exhaust devices to eliminate gaseous emanations. When machining bar stock, sound-absorbent-lined guide tubes should be used.
The workplace should preferably be provided with uniform lighting, affording an adequate level of illumination.
Work Clothing and Personal Protection
Overalls should be close fitting and buttoned or zipped to the neck. They should be without breast pockets, and the sleeves must be tightly buttoned at the wrists. Belts should not be worn. No finger rings and bracelets should be worn when working on lathes. Wearing of safety spectacles should be obligatory. When heavy workpieces are machined, safety shoes with steel toe caps must be worn. Protective gloves must be worn whenever swarf is being collected.
Training
The lathe operator’s safety depends to a large extent on working methods. It is therefore important that he or she should receive thorough theoretical and practical training to acquire skills and develop a behaviour affording the best possible safeguards. Correct posture, correct movements, correct choice and handling of tools should become routine to such an extent that the operator works correctly even if his or her concentration is temporarily relaxed.
Important points in a training programme are an upright posture, the proper mounting and removal of the chuck and the accurate and secure fixing of workpieces. Correct holding of files and scrapers and safe working with abrasive cloth must be intensively practised.
Workers must be well informed about the hazards of injury which may be caused when gauging work, checking adjustments and cleaning lathes.
Maintenance
Lathes must be regularly maintained and lubricated. Faults must be corrected immediately. If safety is at stake in the event of a fault, the machine should be put out of operation until corrective action has been taken.
Repair and maintenance work must be carried out only after the machine has been isolated from the power supply
.
Adapted from the 3rd edition, Encyclopaedia of Occupational Health and Safety.
Grinding generally involves the use of a bonded abrasive to wear away parts of a workpiece. The aim is to give the work a certain shape, correct its dimensions, increase the smoothness of a surface or improve the sharpness of cutting edges. Examples include removal of sprues and rough edges from a foundry casting, removal of surface scale from metals before forging or welding and deburring of parts in sheet metal and machine shops. Polishing is used to remove surface imperfections such as tool marks. Buffing does not remove metal, but uses a soft abrasive blended in a wax or grease base to produce a high-lustre surface.
Grinding is the most comprehensive and diversified of all machining methods and is employed on many materials—predominantly iron and steel but also other metals, wood, plastics, stone, glass, pottery and so on. The term covers other methods of producing very smooth and glossy surfaces, such as polishing, honing, whetting and lapping.
The tools used are wheels of varying dimensions, grinding segments, grinding points, sharpening stones, files, polishing wheels, belts, discs and so on. In grinding wheels and the like, the abrasive material is held together by bonding agents to form a rigid, generally porous body. In the case of abrasive belts, the bonding agent holds the abrasive secured to a flexible base material. Buffing wheels are made from cotton or other textile disks sewn together.
The natural abrasives—natural corundum or emery (aluminium oxides), diamond, sandstone, flint and garnet—have been largely superseded by artificial abrasives including aluminium oxide (fused alumina), silicon carbide (carborundum) and synthetic diamonds. A number of fine-grained materials such as chalk, pumice, tripoli, tin putty and iron oxide are also used, especially for polishing and buffing.
Aluminium oxide is most widely used in grinding wheels, followed by silicon carbide. Natural and artificial diamonds are used for important special applications. Aluminium oxide, silicon carbide, emery, garnet and flint are used in grinding and polishing belts.
Both organic and inorganic bonding agents are used in grinding wheels. The main type of inorganic bonds are vitrified silicate and magnesite. Notable among organic bonding agents are phenol- or urea- formaldehyde resin, rubber and shellac. The vitrified bonding agents and phenolic resin are completely dominating within their respective groups. Diamond grinding wheels can also be metal bonded. The various bonding agents give the wheels different grinding properties, as well as different properties with regard to safety.
Abrasive and polishing belts and discs are composed of a flexible base of paper or fabric to which the abrasive is bonded by means of a natural or synthetic adhesive.
Different machines are used for different types of operations, such as surface grinding, cylindrical (including centreless) grinding, internal grinding, rough grinding and cutting. The two main types are: those where either the grinder or the work is moved by hand and machines with mechanical feeds and chucks. Common equipment types include: surface-type grinders; pedestal-type grinders, polishers and buffers; disk grinders and polishers; internal grinders; abrasive cut-off machines; belt polishers; portable grinders, polishers and buffers; and multiple polishers and buffers.
Hazards and Their Prevention
Bursting
The major injury risk in the use of grinding wheels is that the wheel may burst during grinding. Normally, grinding wheels operate at high speeds. There is a trend towards ever-increasing speeds. Most industrialized nations have regulations limiting the maximum speeds at which the various types of grinding wheels may be run.
The fundamental protective measure is to make the grinding wheel as strong as possible; the nature of the bonding agent is most important. Wheels with organic bonds, in particular phenolic resin, are tougher than those with inorganic bonds and more resistant to impacts. High peripheral speeds may be permissible for wheels with organic bonds.
Very high-speed wheels, in particular, often incorporate various types of reinforcement. For example, certain cup wheels are fitted with steel hubs to increase their strength. During rotation the major stress develops around the centre hole. To strengthen the wheel, the section around the centre hole, which takes no part in the grinding, can thus be made of an especially strong material which is not suitable for grinding. Large wheels with a centre section reinforced in this way are used particularly by the steel works for grinding slabs, billets and the like at speeds up to 80 m/s.
The most common method of reinforcing grinding wheels, however, is to include glass fibre fabric in their construction. Thin wheels, such as those used for cutting, may incorporate glass fibre fabric at the centre or at each side, while thicker wheels have a number of fabric layers depending on the thickness of the wheel.
With the exception of some grinding wheels of small dimensions, either all wheels or a statistical sampling of them must be given speed tests by the manufacturer. In tests the wheels are run over a certain period at a speed exceeding that permitted in grinding. Test regulations vary from country to country, but usually the wheel has to be tested at a speed 50% above the working speed. In some countries, regulations require special testing of wheels that are to operate at higher speeds than normal at a central testing institute. The institute may also cut specimens from the wheel and investigate their physical properties. Cutting wheels are subjected to certain impact tests, bending tests and so on. The manufacturer is also obliged to ensure that the grinding wheel is well balanced prior to delivery.
The bursting of a grinding wheel may cause fatal or very serious injuries to anyone in the vicinity and heavy damage to plant or premises. In spite of all precautions taken by the manufacturers, occasional wheel bursts or breaks may still occur unless proper care is exercised in their use. Precautionary measures include:
Figure 1. A well guarded, vitrified abrasive wheel mounted in a surface grinder and operating at a peripheral speed of 33 m/s
Eye injuries
Dust, abrasives, grains and splinters are a common hazard to the eyes in all dry-grinding operations. Effective eye protection by goggles or spectacles and fixed eye shields at the machine are essential; fixed eye shields are particularly useful when wheels are in intermittent use—for example, for tool grinding.
Fire
Grinding of magnesium alloys carries a high fire risk unless strict precautions are taken against accidental ignition and in the removal and drenching of dust. High standards of cleanliness and maintenance are required in all exhaust ducting to prevent risk of fire and also to keep ventilation working efficiently. Textile dust released from buffing operations is a fire hazard requiring good housekeeping and LEV.
Vibration
Portable and pedestal grinders carry a risk of hand-arm vibration syndrome (HAVS), also known as “white finger” from its most noticeable sign. Recommendations include limiting intensity and duration of exposure, redesigning tools, protective equipment and monitoring exposure and health.
Health hazards
Although modern grinding wheels do not themselves create the serious silicosis hazard associated in the past with sandstone wheels, highly dangerous silica dust may still be given off from the materials being ground—for example, sand castings. Certain resin-bonded wheels may contain fillers which create a dangerous dust. In addition, formaldehyde-based resins can emit formaldehyde during grinding. In any event, the volume of dust produced by grinding makes efficient LEV essential. It is more difficult to provide local exhaust for portable wheels, although some success in this direction has been achieved by use of low-volume, high-velocity capture systems. Prolonged work should be avoided and respiratory protective equipment provided if necessary. Exhaust ventilation is also required for most belt sanding, finishing, polishing and similar operations. With buffing in particular, combustible textile dust is a serious concern.
Protective clothing and good sanitary and washing facilities with showers should be provided, and medical supervision is desirable, especially for metal grinders.
The industrial revolution could not have occurred without the development of refined petroleum-based industrial oils, lubricants, cutting oils and greases. Prior to the discovery in the 1860s that a superior lubricant could be produced by distilling crude oil in a vacuum, industry depended on naturally occurring oils and animal fats such as lard and whale sperm oil for lubricating moving parts. These oils and animal products were especially susceptible to melting, oxidation and breakdown from exposure to heat and moisture produced by the steam engines which powered almost all industrial equipment at that time. The evolution of petroleum-based refined products has continued from the first lubricant, which was used to tan leather, to modern synthetic oils and greases with longer service life, superior lubricating qualities and better resistance to change under varying temperatures and climatic conditions.
Industrial Lubricants
All moving parts on machinery and equipment require lubrication. Although lubrication may be provided by dry materials such as Teflon or graphite, which are used in parts such as small electrical motor bearings, oils and greases are the most commonly used lubricants. As the complexity of the machinery increases, the requirements for lubricants and metal process oils become more stringent. Lubricating oils now range from clear, very thin oils used to lubricate delicate instruments, to thick, tar-like oils used on large gears such as those which turn steel mills. Oils with very specific requirements are used both in the hydraulic systems and to lubricate large computer-operated machine tools such as those used in the aerospace industry to produce parts with extremely close tolerances. Synthetic oils, fluids and greases, and blends of synthetic and petroleum-based oils, are used where extended lubricant life is desired, such as sealed-for-life electric motors, where the increased time between oil changes offsets the difference in cost; where extended temperature and pressure ranges exist, such as in aerospace applications; or where it is difficult and expensive to re-apply the lubricant.
Industrial Oils
Industrial oils such as spindle and lubricating oils, gear lubricants, hydraulic and turbine oils and transmission fluids are designed to meet specific physical and chemical requirements and to operate without discernible change for extended periods under varying conditions. Lubricants for aerospace use must meet entirely new conditions, including cleanliness, durability, resistance to cosmic radiation and the ability to operate in extremely cold and hot temperatures, without gravity and in a vacuum.
Transmissions, turbines and hydraulic systems contain fluids which transfer force or power, reservoirs to hold the fluids, pumps to move the fluids from one place to another and auxiliary equipment such as valves, piping, coolers and filters. Hydraulic systems, transmissions and turbines require fluids with specific viscosities and chemical stability to operate smoothly and provide the controlled transfer of power. The characteristics of good hydraulic and turbine oils include a high viscosity index, thermal stability, long life in circulating systems, deposit resistance, high lubricity, anti-foam capabilities, rust protection and good demulsibility.
Gear lubricants are designed to form strong, tenacious films which provide lubrication between gears under extreme pressure. The characteristics of gear oils include good chemical stability, demulsibility and resistance to viscosity increase and deposit formation. Spindle oils are thin, extremely clean and clear oils with lubricity additives. The most important characteristics for way oils—used to lubricate two flat sliding surfaces where there is high pressure and slow speed—are lubricity and tackiness to resist squeezing out and resistance to extreme pressure.
Cylinder and compressor oils combine the characteristics of both industrial and automotive oils. They should resist accumulation of deposits, act as a heat transfer agent (internal combustion engine cylinders), provide lubrication for cylinders and pistons, provide a seal to resist blow-back pressure, have chemical and thermal stability (especially vacuum pump oil), have a high viscosity index and resist water wash (steam-operated cylinders) and detergency.
Automotive Engine Oils
Manufacturers of internal combustion engines and organizations, such as the Society of Automotive Engineers (SAE) in the United States and Canada, have established specific performance criteria for automotive engine oils. Automotive gasoline and diesel engine oils are subjected to a series of performance tests to determine their chemical and thermal stability, corrosion resistance, viscosity, wear protection, lubricity, detergency and high and low temperature performance. They are then classified according to a code system which allows consumers to determine their suitability for heavy-duty use and for different temperatures and viscosity ranges.
Oils for automotive engines, transmissions and gear cases are designed with high viscosity indexes to resist changes in viscosity with temperature changes. Automotive engine oils are especially formulated to resist breakdown under heat as they lubricate internal combustion engines. Internal combustion engine oils must not be too thick to lubricate the internal moving parts when an engine starts up in cold weather, and they must not thin out as the engine heats up when operating. They should resist carbon build-up on valves, rings and cylinders and the formation of corrosive acids or deposits from moisture. Automotive engine oils contain detergents designed to hold carbon and metallic wear particles in suspension so that they can be filtered out as the oil circulates and not accumulate on internal engine parts and cause damage.
Cutting Fluids
The three types of cutting fluids used in industry are mineral oils, soluble oils and synthetic fluids. Cutting oils are typically a blend of high-quality, high-stability mineral oils of various viscosities together with additives to provide specific characteristics depending on the type of material being machined and the work performed. Soluble water-in-oil cutting fluids are mineral oils (or synthetic oils) which contain emulsifiers and special additives including defoamants, rust inhibitors, detergents, bactericides and germicides. They are diluted with water in varying ratios before being used. Synthetic cutting fluids are solutions of non-petroleum-based fluids, additives and water, rather than emulsions, some of which are fire resistant for machining specific metals. Semi-synthetic fluids contain 10 to 15% mineral oil. Some special fluids have both lubricating oil and cutting fluid characteristics due to the tendency of fluids to leak and intermix in certain machine tools such as multi-spindle, automatic screw machines.
The desired characteristics of cutting fluids depend on the composition of the metal being worked on, the cutting tool being used and the type of cutting, planing or shaping operation performed. Cutting fluids improve and enhance the metal working process by cooling and lubrication (i.e., protecting the edge of the cutting tool). For example, when working on a soft metal which creates a lot of heat, cooling is the most important criterion. Improved cooling is provided by using a light oil (such as kerosene) or water-based cutting fluid. Control of the built-up edge on cutting tools is provided by anti-weld or anti-wear additives such as sulphur, chlorine or phosphorus compounds. Lubricity, which is important when working on steel to overcome the abrasiveness of iron sulphide, is provided by synthetic and animal fats or sulphurized sperm oil additives.
Other Metal Working and Process Oils
Grinding fluids are designed to provide cooling and prevent metal build-up on grinding wheels. Their characteristics include thermal and chemical stability, rust protection (soluble fluids), preventing gummy deposits upon evaporation and a safe flashpoint for the work performed.
Quench oils, which require high stability, are used in metal treating to control the change of the molecular structure of steel as it cools. Quenching in lighter oil is used to case harden small, inexpensive steel parts. A slower quench rate is used to produce machine tool steels which are fairly hard on the outside with lower internal stress. A gapped or multi-phase quenching oil is used to treat high carbon and alloy steels.
Roll oils are specially formulated mineral or soluble oils which lubricate and provide a smooth finish to metal, particularly aluminium, copper and brass, as it goes through hot and cold rolling mills. Release oils are used to coat dies and moulds to facilitate the release of the formed metal parts. Tanning oils are still used in the felt and leather-making industry. Transformer oils are specially formulated dielectric fluids used in transformers and large electric breakers and switches.
Heat transfer oils are used in open or closed systems and may last up to 15 years in service. The primary characteristics are good thermal stability as systems operate at temperatures from 150 to 315°C, oxidation stability and high flashpoint. Heat transfer oils are normally too viscous to be pumped at ambient temperatures and must be heated to provide fluidity.
Petroleum solvents are used to clean parts by spraying, dripping or dipping. The solvents remove oil and emulsify dirt and metal particles. Rust preventive oils may be either solvent or water based. They are applied to stainless steel coils, bearings and other parts by dipping or spraying, and leave polarized or wax films on the metal surfaces for fingerprint and rust protection and water displacement.
Greases
Greases are mixtures of fluids, thickeners and additives used to lubricate parts and equipment which cannot be made oil-tight, which are hard to reach or where leaking or splashed liquid lubricants might contaminate products or create a hazard. They have a wide range of applications and performance requirements, from lubricating jet engine bearings at sub-zero temperatures to hot rolling mill gears, and resisting acid or water washout, as well as the continuous friction created by railroad car wheel roller bearings.
Grease is made by the blending of metallic soaps (salts of long-chained fatty acids) into a lubricating oil medium at temperatures of 205 to 315°C. Synthetic greases may use di-esters, silicone or phosphoric esters and polyalkyl glycols as fluids. The characteristics of the grease depend to a great extent upon the particular fluid, metallic element (e.g., calcium, sodium, aluminium, lithium and so on) in the soap and the additives used to improve performance and stability and to reduce friction. These additives include extreme-pressure additives which coat the metal with a thin layer of non-corrosive metallic sulphur compounds, lead naphthenate or zinc dithiophosphate, rust inhibitors, anti-oxidants, fatty acids for added lubricity, tackiness additives, colour dyes for identification and water inhibitors. Some greases may contain graphite or molybdenum fillers which coat the metallic parts and provide lubrication after the grease has run out or decomposed.
Industrial Lubricants, Grease and Automotive Engine Oil Additives
In addition to using high-quality lubricant base stocks with chemical and thermal stability and high viscosity indexes, additives are needed to enhance the fluid and provide specific characteristics required in industrial lubricants, cutting fluids, greases and automotive engine oils. The most commonly used additives include but are not limited to the following:
Manufacturing Industrial Lubricants and Automotive Oils
Industrial lubricants and oils, grease, cutting fluids and automotive engine oils are manufactured in blending and packaging facilities, also called “lube plants” or “blending plants”. These facilities may be located either in or adjacent to refineries which produce lubricant base stocks, or they may be some distance away and receive the base stocks by marine tankers or barges, railroad tank cars or tank trucks. Blending and packaging plants blend and compound additives into lubricating oil base stocks to manufacture a wide range of finished products, which are then shipped in bulk or in containers.
The blending and compounding processes used to manufacture lubricants, fluids and greases depend on the age and sophistication of the facility, the equipment available, the types and formulation of the additives used and the variety and volume of products produced. Blending may require only physical mixing of base stocks and additive packages in a kettle using mixers, paddles or air agitation, or auxiliary heat from electric or steam coils may be needed to help dissolve and blend in the additives. Other industrial fluids and lubricants are produced automatically by mixing base stocks and pre-blended additive and oil slurries through manifold systems. Grease may be either batch produced or continuously compounded. Lube plants may compound their own additives from chemicals or purchase pre-packaged additives from specialty companies; a single plant may use both methods. When lube plants manufacture their own additives and additive packages, there may be a need for high temperatures and pressures in addition to chemical reactions and physical agitation to compound the chemicals and materials.
After production, fluids and lubricants may be held in the blending kettles or placed in holding tanks to ensure that the additives remain in suspension or solution, to allow time for testing to determine whether the product meets quality specifications and certification requirements, and to allow process temperatures to return to ambient levels before products are packaged and shipped. When testing is completed, finished products are released for bulk shipment or packaging into containers.
Finished products are shipped in bulk in railroad tank cars or in tank trucks directly to consumers, distributors or outside packaging plants. Finished products also are shipped to consumers and distributors in railroad box cars or package delivery trucks in a variety of containers, as follows:
Some blending and packaging plants may ship pallets of mixed products and mixed sizes of containers and packages directly to small consumers. For example, a single-pallet shipment to a service station could include 1 drum of transmission fluid, 2 kegs of grease, 8 cases of automotive engine oil and 4 pails of gear lubricant.
Product Quality
Lubricant product quality is important to keep machines and equipment operating properly and to produce quality parts and materials. Blending and packaging plants manufacture finished petroleum products to strict specifications and quality requirements. Users should maintain the level of quality by establishing safe practices for the handling, storage, dispensing and transfer of lubricants from their original containers or tanks to the dispensing equipment and to the point of application on the machine or equipment to be lubricated or the system to be filled. Some industrial facilities have installed centralized dispensing, lubrication and hydraulic systems which minimize contamination and exposure. Industrial oils, lubricants, cutting oils and grease will deteriorate from water or moisture contamination, exposure to excessively high or low temperatures, inadvertent mixing with other products and long-term storage which allows additive drop-out or chemical changes to occur.
Health and Safety
Because they are used and handled by consumers, finished industrial and automotive products must be relatively free of hazards. There is a potential for hazardous exposures when blending and compounding products, when handling additives, when using cutting fluids and when operating oil mist lubrication systems.
The chapter Oil and natural gas refineries in this Encyclopaedia gives information regarding potential hazards associated with auxiliary facilities at blending and packaging plants such as boiler rooms, laboratories, offices, oil-water separators and waste treatment facilities, marine docks, tank storage, warehouse operations, railroad tank car and tank truck loading racks and railroad box car and package truck loading and unloading facilities.
Safety
Manufacturing additives and slurries, batch compounding, batch blending and in-line blending operations require strict controls to maintain desired product quality and, along with the use of PPE, to minimize exposure to potentially hazardous chemicals and materials as well as contact with hot surfaces and steam. Additive drums and containers should be stored safely and kept tightly sealed until ready for use. Additives in drums and bags need to be handled properly to avoid muscular strain. Hazardous chemicals should be properly stored, and incompatible chemicals should not be stored where they can mix with one another. Precautions to be taken when operating filling and packaging machinery include using gloves and avoiding catching fingers in devices which crimp covers on kegs and pails. Machine guards and protective systems should not be removed, disconnected or by-passed to expedite work. Intermediate bulk containers and drums should be inspected before filling to make sure they are clean and suitable.
A confined-space permit system should be established for entry into storage tanks and blending kettles for cleaning, inspection, maintenance or repair. A lockout/tagout procedure should be established and implemented before working on packaging machinery, blending kettles with mixers, conveyors, palletizers and other equipment with moving parts.
Leaking drums and containers should be removed from the storage area and spills cleaned up to prevent slips and falls. Recycling, burning and disposal of waste, spilled and used lubricants, automotive engine oils and cutting fluids should be in accordance with government regulations and company procedures. Workers should use appropriate PPE when cleaning spills and handling used or waste products. Drained motor oil, cutting fluids or industrial lubricants which may be contaminated with gasoline and flammable solvents should be stored in a safe place away from sources of ignition, until proper disposal.
Fire protection
While the potential for fire is less in industrial and automotive lubricant blending and compounding than in refining processes, care must be taken when manufacturing metal working oils and greases due to the use of high blending and compounding temperatures and lower flashpoint products. Special precautions should be taken to prevent fires when products are dispensed or containers filled at temperatures above their flashpoints. When transferring flammable liquids from one container to another, proper bonding and grounding techniques should be applied to prevent static build-up and electrostatic discharge. Electrical motors and portable equipment should be properly classified for the hazards present in the area in which they are installed or used.
The potential for fire exists if a leaking product or vapour release in the lube blending and grease processing or storage areas reaches a source of ignition. The establishment and implementation of a hot-work permit system should be considered to prevent fires in blending and packaging facilities. Storage tanks installed inside buildings should be constructed, vented and protected in accordance with government requirements and company policy. Products stored on racks and in piles should not block fire protection systems, fire doors or exit routes.
Storage of finished products, both in bulk and in containers and packages, should be in accordance with recognized practices and fire prevention regulations. For example, flammable liquids and additives which are in solutions of flammable liquids may be stored in outside buildings or separate, specially designed inside or attached storage rooms. Many additives are stored in warm rooms (38 to 65°C) or in hot rooms (over 65°C) in order to keep the ingredients in suspension, to reduce the viscosity of thicker products or to provide for easier blending or compounding. These storage rooms should comply with electrical classification, drainage, ventilation and explosion venting requirements, especially when flammable liquids or combustible liquids are stored and dispensed at temperatures above their flashpoints.
Health
When blending, sampling and compounding, personal and respiratory protective equipment should be considered to prevent exposures to heat, steam, dusts, mists, vapours, fumes, metallic salts, chemicals and additives. Safe work practices, good hygiene and appropriate personal protection may be needed for exposure to oil mists, fumes and vapours, additives, noise and heat when conducting inspection and maintenance activities while sampling and handling hydrocarbons and additives during the production and packaging and when cleaning up spills and releases:
Oil is a common cause of dermatitis, which can be controlled through the use of PPE and good personal hygiene practices. Direct skin contact with any formulated greases or lubricants should be avoided. Lighter oils such as kerosene, solvents and spindle oils defat the skin and cause rashes. Thicker products, such as gear oils and greases, block the pores of the skin, leading to folliculitis.
Health hazards due to microbial contamination of oil may be summarized as follows:
Contact dermatitis may occur when employees are exposed to cutting fluids during production, work or maintenance and when they wipe oil-covered hands with rags embedded with minute metal particles. The metal causes small lacerations in the skin which may become infected. Water-based cutting fluids on skin and clothing may contain bacteria and cause infections, and the emulsifiers may dissolve fats from the skin. Oil folliculitis is caused by prolonged exposure to oil-based cutting fluids, such as from wearing oil-soaked clothing. Employees should remove and launder clothing that is soaked with oil before wearing it again. Dermatitis may also be caused by using soaps, detergents or solvents to clean the skin. Dermatitis is best controlled by good hygiene practices and minimizing exposure. Medical advice should be sought when dermatitis persists.
In the extensive review conducted as a basis for its criteria document, the US National Institute for Occupational Safety and Health (NIOSH) found an association between exposure to metal working fluids and the risk of developing cancer at several organ sites, including the stomach, pancreas, larynx and rectum (NIOSH 1996). The specific formulations responsible for the elevated cancer risks remain to be determined.
Occupational exposure to oil mists and aerosols is associated with a variety of non-malignant respiratory effects, including lipoid pneumonia, asthma, acute airways irritation, chronic bronchitis and impaired pulmonary function (NIOSH 1996).
Metal working fluids are readily contaminated by bacteria and fungi. They may affect the skin or, when inhaled as contaminated aerosols, they may have systemic effects.
Refinery processes such as hydrofinishing and acid treatment are used to remove aromatics from industrial lubricants, and the use of naphthenic base stocks has been restricted in order to minimize carcinogenicity. Additives introduced in blending and compounding may also create a potential risk to health. Exposures to chlorinated compounds and leaded compounds, such as those used in some gear lubricants and greases, cause irritation of the skin and may be potentially hazardous. Tri-orthocresyl phosphate has caused outbreaks of nerve palsies when lubricating oil was accidentally used for cooking. Synthetic oils consist mainly of sodium nitrite and triethanolamine and additives. Commercial triethanolamine contains diethanolamine, which can react with sodium nitrite to form a relatively weak carcinogen, N-nitrosodiethanolamine, which may create a hazard. Semi-synthetic lubricants present the hazards of both products, as well as the additives in their formulations.
Product safety information is important to employees of both manufacturers and users of lubricants, oils and greases. Manufacturers should have material safety data sheets (MSDSs) or other product information available for all of the additives and base stocks used in blending and compounding. Many companies have conducted epidemiological and toxicological testing to determine the degree of hazards associated with any acute and chronic health effects of their products. This information should be available to workers and users through warning labels and product safety information.
Adapted from the 3rd edition, Encyclopaedia of Occupational Health and Safety.
There is a wide variety of techniques for finishing the surfaces of metal products so that they resist corrosion, fit better and look better (see table 1). Some products are treated by a sequence of several of these techniques. This article will briefly describe some of those most commonly used.
Table 1. Summary of the hazards associated with the different metal treatment methods
Metal treatment method |
Hazards |
Precautions |
Electrolytic polishing |
Burns and irritation from caustic and corrosive chemicals |
Use appropriate personal protective equipment. Install effective exhaust ventilation. |
Electroplating |
Exposure to potentially cancer causing chromium and nickel; exposure to cyanides; burns and irritation from caustic and corrosive chemicals; electric shock; the process can be wet, causing slip and fall hazards; potential explosive dust generation; ergonomic hazards |
Use appropriate personal protective equipment. Install effective exhaust ventilation, often slotted, push-pull system. Clean up spills immediately. Install non-skid flooring. Use effective design of work procedures and stations to avoid ergonomic stress. |
Enamels and glazing |
Physical hazards from grinders, conveyers, mills; burn hazard from high temperature liquids and equipment; exposure to dusts that may cause lung disease |
Install proper machine guards, including interlocks. Use appropriate personal protective equipment. Install effective exhaust ventilation to avoid dust exposure. HEPA-filtered equipment may be necessary. |
Etching |
Exposure to hydrofluoric acid; burns and irritation from caustic and corrosive chemicals; burn hazard from high temperature liquids and equipment |
Implement a programme to avoid exposure to hydrofluoric acid. Use appropriate personal protective equipment. Install effective exhaust ventilation. |
Galvanizing |
Burn hazard from high temperature liquids, metals, and equipment; burns and irritation from caustic and corrosive chemicals; metal fume fever; potential lead exposure |
Use appropriate personal protective equipment. Install effective exhaust ventilation. Implement a lead exposure reduction/monitoring programme. |
Heat treatment |
Burn hazard from high temperature liquids, metals and equipment; burns and irritation from caustic and corrosive chemicals; possible explosive atmospheres of hydrogen; potential exposure to carbon monoxide; potential exposure to cyanides; fire hazard from oil quenching |
Use appropriate personal protective equipment. Install effective exhaust ventilation. Display signs warning of high temperature equipment and surfaces. Install systems to monitor the concentration of carbon monoxide. Install adequate fire-suppression systems. |
Metallizing |
Burn hazard from high temperature metals and equipment; possible explosive atmospheres of dust, acetylene; zinc metal fume fever |
Install adequate fire suppression systems. Properly separate chemicals and gases. Use appropriate personal protective equipment. Install effective exhaust ventilation. |
Phosphating |
Burns and irritation from caustic and corrosive chemicals |
Use appropriate personal protective equipment. Install effective exhaust ventilation. |
Plastics coating |
Exposure to chemical sensitizers |
Seek alternatives to sensitizers. Use appropriate personal protective equipment. Install effective exhaust ventilation. |
Priming |
Exposure to various solvents which are potentially toxic and flammable, exposure to chemical sensitizers, exposure to potentially carcinogenic chromium |
Seek alternatives to sensitizers. Use appropriate personal protective equipment. Install effective exhaust ventilation. Properly separate chemicals/gases. |
Before any of these techniques can be applied, the products must be thoroughly cleaned. A number of methods of cleaning are used, individually or in sequence. They include mechanical grinding, brushing and polishing (which produce metallic or oxidic dust—aluminium dust may be explosive), vapour degreasing, washing with organic grease solvents, “pickling” in concentrated acid or alkaline solutions and electrolytic degreasing. The last involves immersion in baths containing cyanide and concentrated alkali in which electrolytically formed hydrogen or oxygen remove the grease, resulting in “blank” metal surfaces that are free from oxides and grease. The cleaning is followed by adequate rinsing and drying of the product.
Proper design of the equipment and effective LEV will reduce some of the risk. Workers exposed to the hazard of splashes must be provided with protective goggles or eye shields and protective gloves, aprons and clothing. Showers and eyewash fountains should be nearby and in good working order, and splashes and spills should be washed away promptly. With electrolytic equipment, the gloves and shoes must be non-conducting, and other standard electrical precautions, such as the installation of ground fault circuit interrupters and lockout/tagout procedures should be followed.
Treatment Processes
Electrolytic polishing
Electrolytic polishing is used to produce a surface of improved appearance and reflectivity, to remove excess metal to accurately fit the required dimensions and to prepare the surface for inspection for imperfections. The process involves preferential anodic dissolution of high spots on the surface after vapour degreasing and hot alkaline cleaning. Acids are frequently used as the electrolyte solutions; accordingly, adequate rinsing is required afterwards.
Electroplating
Electroplating is a chemical or electrochemical process for applying a metallic layer to the product—for example, nickel to protect against corrosion, hard chromium to improve the surface properties or silver and gold to beautify it. Occasionally, non-metallic materials are used. The product, wired as the cathode, and an anode of the metal to be deposited are immersed in an electrolyte solution (which can be acidic, alkaline or alkaline with cyanide salts and complexes) and connected externally to a source of direct current. The positively charged cations of the metallic anode migrate to the cathode, where they are reduced to the metal and deposited as a thin layer (see figure 1). The process is continued until the new coating reaches the desired thickness, and the product is then washed, dried and polished.
Figure 1. Electroplating: Schematic representation
Anode: Cu → Cu+2 + 2e- ; Cathode: Cu+2 + 2e- → Cu
In electroforming, a process closely related to electroplating, objects moulded of, for example, plaster or plastic are made conductive by the application of graphite and then are connected as the cathode so that the metal is deposited on them.
In anodization, a process that has become increasingly important in recent years, products of aluminium (titanium and other metals are also used) are connected as the anode and immersed in dilute sulphuric acid. However, instead of the formation of positive aluminium ions and migrating for deposition on the cathode, they are oxidized by the oxygen atoms arising at the anode and become bound to it as an oxide layer. This oxide layer is partially dissolved by the sulphuric acid solution, making the surface layer porous. Subsequently, coloured or light-sensitive materials can be deposited in these pores, as in the fabrication of nameplates, for example.
Enamels and glazes
Vitreous enamel or porcelain enamel is used to give a high heat-, stain- and corrosion-resistant covering to metals, usually iron or steel, in a wide range of fabricated products including bath tubs, gas and electric cookers, kitchen ware, storage tanks and containers, and electrical equipment. In addition, enamels are used in the decoration of ceramics, glass, jewellery and decorative ornaments. The specialized use of enamel powders in the production of such ornamental ware as Cloisonné and Limoges has been known for centuries. Glazes are applied to pottery ware of all kinds.
The materials used in the manufacture of vitreous enamels and glazes include:
The first step in all types of vitreous enamelling or glazing is the making of the frit, the enamel powder. This involves preparation of the raw materials, smelting and frit handing.
After careful cleaning of the metal products (e.g., shot blasting, pickling, degreasing), the enamel may be applied by a number of procedures:
The prepared objects are then “fired” in a furnace or kiln, which usually is gas fuelled.
Etching
Chemical etching produces a satin or matte finish. Most frequently, it is used as a pre-treatment prior to anodizing, lacquering, conversion coating, buffing or chemical brightening. It is most frequently applied to aluminium and stainless steel, but is also used for many other metals.
Aluminium is usually etched in alkaline solutions containing various mixtures of sodium hydroxide, potassium hydroxide, trisodium phosphate and sodium carbonate, together with other ingredients to prevent sludge formation. One of the most common processes uses sodium hydroxide at a concentration of 10 to 40 g/l maintained at a temperature of 50 to 85°C with an immersion time as long as 10 minutes.
The alkaline etching is usually preceded and followed by treatment in various mixtures of hydrochloric, hydrofluoric, nitric, phosphoric, chromic or sulphuric acid. A typical acid treatment involves immersions of 15 to 60 seconds in a mixture of 3 parts by volume of nitric acid and 1 part by volume of hydrofluoric acid that is maintained at a temperature of 20°C.
Galvanizing
Galvanizing applies a zinc coating to a variety of steel products to protect against corrosion. The product must be clean and oxide-free for the coating to adhere properly. This usually involves a number of cleaning, rinsing, drying or annealing processes before the product enters the galvanizing bath. In “hot dip” galvanizing, the product is passed through a bath of molten zinc; “cold” galvanizing is essentially electroplating, as described above.
Manufactured products are usually galvanized in a batch process, while the continuous strip method is used for steel strip, sheet or wire. Flux may be employed to maintain satisfactory cleaning of both the product and the zinc bath and to facilitate drying. A prefluxing step may be followed by an ammonium chloride flux cover on the surface of the zinc bath, or the latter may be used alone. In galvanizing pipe, the pipe is immersed in a hot solution of zinc ammonium chloride after cleaning and before the pipe enters the molten zinc bath. The fluxes decompose to form irritating hydrogen chloride and ammonia gas, requiring LEV.
The various types of continuous hot-dip galvanizing differ essentially in how the product is cleaned and whether the cleaning is done on-line:
The continuous galvanizing line for light-gauge strip steel omits pickling and the use of flux; it uses alkaline cleaning and maintains the clean surface of the strip by heating it in a chamber or furnace with a reducing atmosphere of hydrogen until it passes below the surface of the molten zinc bath.
Continuous galvanizing of wire requires annealing steps, usually with a molten lead pan in front of the cleaning and galvanizing tanks; air or water cooling; pickling in hot, dilute hydrochloric acid; rinsing; application of a flux; drying; and then galvanizing in the molten zinc bath.
A dross, an alloy of iron and zinc, settles to the bottom of the molten zinc bath and must be removed periodically. Various types of materials are floated on the surface of the zinc bath to prevent oxidation of the molten zinc. Frequent skimming is needed at the points of entry and exit of the wire or strip being galvanized.
Heat treatment
Heat treatment, the heating and cooling of a metal which remains in the solid state, is usually an integral part of the processing of metal products. It almost always involves a change in the crystalline structure of the metal which results in a modification of its properties (e.g., annealing to make the metal more malleable, heating and slow cooling to reduce hardness, heating and quenching to increase hardness, low-temperature heating to minimize internal stresses).
Annealing
Annealing is a “softening” heat treatment widely used to allow further cold working of the metal, improve machinability, stress-relieve the product before it is used and so on. It involves heating the metal to a specific temperature, holding it at that temperature for a specific length of time and allowing it to cool at a particular rate. A number of annealing techniques are used:
Age-hardening
Age-hardening is a heat treatment often used on aluminium-copper alloys in which the natural hardening that takes place in the alloy is accelerated by heating to about 180°C for about 1 hour.
Homogenizing
Homogenizing, usually applied to ingots or powdered metal compacts, is designed to remove or greatly reduce segregation. It is achieved by heating to a temperature about 20°C below the metal’s melting point for about 2 hours or more and then quenching.
Normalizing
A process similar to full annealing, ensures the uniformity of the mechanical properties to be obtained and also produces greater toughness and resistance to mechanical loading.
Patenting
Patenting is a special type of annealing process that is usually applied to materials of small cross-section which are intended to be drawn (e.g., 0.6% carbon steel wire). The metal is heated in an ordinary furnace to above the transformation range and then passes from the furnace directly into, for example, a lead bath held at a temperature of about 170°C.
Quench-hardening and tempering
An increase in hardness can be produced in an iron-based alloy by heating to above the transformation range and rapidly cooling to room temperature by quenching in oil, water or air. The article is often too highly stressed to be put into service and, in order to increase its toughness, it is tempered by reheating to a temperature below the transformation range and allowing it to cool at the desired rate.
Martempering and austempering are similar processes except that the article is quenched, for example, in a salt or lead bath held at a temperature of 400°C.
Surface- and case-hardening
This is another heat-treatment process applied most frequently to iron-based alloys, which allows the surface of the object to remain hard while its core remains relatively ductile. It has a number of variations:
Metallizing
Metallizing, or metal spraying, is a technique for applying a protective metallic coating to a mechanically roughened surface by spraying it with molten droplets of metal. It is also used to build up worn or corroded surfaces and for salvaging badly-machined component parts. The process is widely known as Schooping, after the Dr. Schoop who invented it.
It uses the Schooping gun, a hand-held, pistol-shaped spray gun through which the metal in wire form is fed into a fuel gas/oxygen blowpipe flame which melts it and, using compressed air, sprays it onto the object. The heat source is a mixture of oxygen and either acetylene, propane or compressed natural gas. The coiled wire is usually straightened before being fed into the gun. Any metal that can be made into a wire may be used; the gun can also accept the metal in powder form.
Vacuum metallizing is a process in which the object is placed in a vacuum jar into which the coating metal is sprayed.
Phosphating
Phosphating is used mainly on mild and galvanized steel and aluminium to augment the adhesion and corrosion resistance of paint, wax and oil finishes. It is also used to form a layer which acts as a parting film in the deep drawing of sheet metal and improves its wear resistance. It essentially consists of allowing the metal surface to react with a solution of one or more phosphates of iron, zinc, manganese, sodium or ammonium. Sodium and ammonium phosphate solutions are used for combined cleaning and phosphating. The need to phosphate multi-metal objects and the desire to increase line speeds in automated operations have led to reducing reaction times by the addition of accelerators such as fluorides, chlorates, molybdates and nickel compounds to the phosphating solutions.To reduce crystal size and, consequently, increase the flexibility of zinc phosphate coatings, crystal refining agents such as tertiary zinc phosphate or titanium phosphate are added to the pre-treatment rinse.
The phosphating sequence typically includes the following steps:
Priming
Organic paint primers are applied to metal surfaces to promote the adhesion of subsequently applied paints and to retard corrosion at the paint-metal interface. The primers usually contain resins, pigments and solvents and may be applied to the prepared metal surfaces by brush, spray, immersion, roller coating or electrophoresis.
The solvents may be any combination of aliphatic and aromatic hydrocarbons, ketones, esters, alcohols and ethers. The most commonly used resins are polyvinyl butynol, phenolic resins, drying oil alkyds, epoxidized oils, epoxyesters, ethyl silicates and chlorinated rubbers. In complex primers, cross-linking agents such as tetraethylene pentamine, pentaethylene hexamine, isocyanates and urea formaldehyde are used. Inorganic pigments used in primer formulations include lead, barium, chromium, zinc and calcium compounds.
Plastic coating
Plastic coatings are applied to metals in liquid form, as powders which are subsequently cured or sintered by heating, or in the form of fabricated sheets which are laminated to the metal surface with an adhesive. The most commonly used plastics include polyethylene, polyamides (nylons) and PVC. The latter may include plasticizers based on monomeric and polymeric esters and stabilizers such as lead carbonate, fatty acid salts of barium and cadmium, dibutyltin dilaurate, alkyltin mercaptides and zinc phosphate. Although generally of low toxicity and non-irritating, some of the plasticizers are skin sensitizers.
Hazards and Their Prevention
As might be deduced from the complexity of the processes outlined above, there is a large variety of safety and health hazards associated with the surface treatment of metals. Many are regularly encountered in manufacturing operations; others are presented by the uniqueness of the techniques and materials employed. Some are potentially life threatening. By and large, however, they can be prevented or controlled.
Workplace design
The workplace should be designed to allow the delivery of raw materials and supplies and the removal of the finished products without interfering with the ongoing processing. Since many of the chemicals are flammable or prone to react when mixed, proper separation in storage and in transit is essential. Many of the metal finishing operations involve liquids, and when leaks, spills or splashes of acids or alkalis occur they must be washed away promptly. Accordingly, adequately drained, slip-resistant floors must be provided. Housekeeping must be diligent to keep the work areas and other spaces clean and free from accumulations of materials. Systems for disposal of solid and liquid wastes and effluents from furnaces and exhaust ventilation must be designed with environmental concerns in mind.
Work stations and work assignments should use ergonomic principles to minimize strains, sprains, excessive fatigue and RSIs. Machine guards must have automatic lockout so the machine is de-energized if the guard is removed. Splash guards are essential. Because of the danger of splashes of hot acid and alkali solutions, eyewash fountains and whole-body showers must be installed within easy reach. Signs should be posted to warn other production and maintenance personnel of such dangers as chemical baths and hot surfaces.
Chemical assessment
All chemicals should be evaluated for potential toxicity and physical hazards, and less hazardous materials should be substituted where possible. However, since the less toxic material may be more flammable, the hazard of fire and explosion must also be considered. In addition, the chemical compatibility of materials must be considered. For example, mixing of nitrate and cyanide salts by accident could cause an explosion due to the strong oxidizing properties of nitrates.
Ventilation
Most of the metal coating processes require LEV that is strategically placed to draw the vapours or other contaminants away from the worker. Some systems push fresh air across the tank to “push” airborne contaminants to the exhaust side of the system. Fresh air intakes must be located away from exhaust vents so that potentially toxic gases are not recirculated.
Personal protective equipment
Processes should be engineered to prevent potentially toxic exposures, but since they cannot always be totally avoided, employees will have to be provided with appropriate PPE (e.g., goggles with or without face shields as appropriate, gloves, aprons or coveralls and shoes). Because many of the exposures involve hot corrosive or caustic solutions, the protective items should be insulated and chemical-resistant. If there is possible exposure to electricity, PPE should be non-conductive. PPE must be available in adequate quantity to allow contaminated, wet items to be cleaned and dried before re-using them. Insulated gloves and other protective clothing should be available where there is the risk of thermal burns from hot metal, furnaces and so on.
An important adjunct is the availability of wash-up facilities and clean lockers and dressing rooms, so that workers’ clothing remains uncontaminated and workers do not carry toxic materials back into their homes.
Employee training and supervision
Employee education and training are essential both when new to the job or when there have been changes in the equipment or the process. MSDSs must be provided for each of the chemical products which explain the chemical and physical hazards, in languages and at educational levels that ensure they will be understood by the workers. Competence testing and periodic retraining will assure that workers have retained the needed information. Close supervision is advisable to make sure that the proper procedures are being followed.
Selected hazards
Certain hazards are unique to the metal coating industry and deserve special consideration.
Alkaline and acid solutions
The heated alkaline and acid solutions used in cleaning and treatment of metals are particularly corrosive and caustic. They are irritating to the skin and mucous membranes and are especially dangerous when splashed into the eye. Eyewash fountains and emergency showers are essential. Proper protective clothing and goggles will guard against the inevitable splashes; when a splash reaches the skin, the area should be immediately and copiously rinsed with cool, clean water for at least 15 minutes; medical attention may be necessary, particularly when the eye is involved.
Care should be exercised when utilizing chlorinated hydrocarbons as phosgene may result from a reaction of the chlorinated hydrocarbon, acids and metals. Nitric and hydrofluoric acid are particularly dangerous when their gases are inhaled, because it may take 4 hours or more before the effects on the lungs become apparent. Bronchitis, pneumonitis and even potentially fatal pulmonary oedema may appear belatedly in a worker who apparently had no initial effect from the exposure. Prompt prophylactic medical treatment and, often, hospitalization are advisable for workers who have been exposed. Skin contact with hydrofluoric acid can cause severe burns without pain for several hours. Prompt medical attention is essential.
Dust
Metallic and oxidic dusts are a particular problem in grinding and polishing operations, and are most effectively removed by LEV as they are created. Ductwork should be designed to be smooth and air velocity should be sufficient to keep the particulates from settling out of the air stream. Aluminium and magnesium dust may be explosive and should be collected in a wet trap. Lead has become less of a problem with the decline of its use in ceramics and porcelain glazes, but it remains the ubiquitous occupational hazard and must always be guarded against. Beryllium and its compounds have received interest recently due to the possibility of carcinogenicity and chronic beryllium disease.
Certain operations present a risk of silicosis and pneumoconiosis: the calcining, crushing and drying of flint, quartz or stone; the sieving, mixing and weighing out of these substances in the dry state; and the charging of furnaces with such materials. They also represent a danger when they are used in a wet process and are splashed about the workplace and on workers’ clothing, to become dusts again when they dry out. LEV and rigorous cleanliness and personal hygiene are important preventive measures.
Organic solvents
Solvents and other organic chemicals used in degreasing and in certain processes are dangerous when inhaled. In the acute phase, their narcotic effects may lead to respiratory paralysis and death. In chronic exposure, toxicity of the central nervous system and liver and kidney damage are most frequent. Protection is provided by LEV with a safety zone of at least 80 to 100 cm between the source and the breathing area of the worker. Bench ventilation must also be installed to remove residual vapours from the finished workpieces. Defatting of the skin by organic solvents may be a precursor of dermatitis. Many solvents are also flammable.
Cyanide
Baths containing cyanides are frequently used in electrolytic degreasing, electroplating and cyaniding. Reaction with acid will form the volatile, potentially lethal hydrogen cyanide (prussic acid). The lethal concentration in air is 300 to 500 ppm. Fatal exposures may also result from skin absorption or ingestion of cyanides. Optimum cleanliness is essential for workers using cyanide. Food should not be eaten before washing, and should never be in the work area. Hands and clothing must be carefully cleaned following a potential cyanide exposure.
First aid measures for cyanide poisoning include transport into the open air, removal of contaminated clothing, copious washing of the exposed areas with water, oxygen therapy and inhalation of amyl nitrite. LEV and skin protection are essential.
Chromium and nickel
Chromic and nickel compounds used in galvanic baths in electroplating may be hazardous. Chromium compounds can cause burns, ulceration and eczema of the skin and mucosa and a characteristic perforation of the nasal septum. Bronchial asthma may occur. Nickel salts can cause obstinate allergic or toxic-irritative skin injury. There is evidence that both chromium and nickel compounds may be carcinogenic. LEV and skin protection are essential.
Furnaces and ovens
Special precautions are needed when working with the furnaces employed, for example, in the heat treatment of metals where components are handled at high temperatures and the materials used in the process may either be toxic or explosive or both. The gaseous media (atmospheres) in the furnace may react with the metal charge (oxidizing or reducing atmospheres) or they may be neutral and protective. Most of the latter contain up to 50% hydrogen and 20% carbon monoxide, which, in addition to being combustible, form highly explosive mixtures with air at elevated temperatures. The ignition temperature varies from 450 to 750 °C, but a local spark may cause ignition even at lower temperatures. The danger of explosion is greater when the furnace is being started up or shut down. Since a cooling furnace tends to suck in air (a particular danger when the fuel or power supply is interrupted), a supply of inert gas (e.g., nitrogen or carbon dioxide) should be available for purging when the furnace is shut down as well as when a protective atmosphere is introduced into a hot furnace.
Carbon monoxide is perhaps the greatest hazard from furnaces and ovens. Since it is colourless and odourless, it frequently reaches toxic levels before the worker becomes aware of it. Headache is one of the earliest symptoms of toxicity, and, therefore, a worker developing a headache on the job should immediately be removed into fresh air. Danger zones include recessed pockets in which the carbon monoxide may collect; it should be remembered that brickwork is porous and may retain the gas during normal purging and emit it when the purging is completed.
Lead furnaces may be dangerous since lead tends to vaporize quite rapidly at temperatures above 870°C. Accordingly, an effective fume extraction system is required. A pot breakage or failure may also be hazardous; a sufficiently large well or pit should be provided to capture the molten metal if this occurs.
Fire and explosion
Many of the compounds used in metal coating are flammable and, under certain circumstances, explosive. For the most part, the furnaces and drying ovens are gas fired, and special precautions such as flame-failure devices at burners, low-pressure cut-off valves in the supply lines and explosion relief panels in the structure of the stoves should be installed. In electrolytic operations, hydrogen formed in the process may collect at the surface of the bath and, if not exhausted, may reach explosive concentrations. Furnaces should be properly ventilated and burners protected from being clogged by dripping material.
Oil quenching is also a fire hazard, especially if the metal charge is not completely immersed. Quenching oils should have a high flashpoint, and their temperature should not exceed 27°C.
Compressed oxygen and fuel gas cylinders used in metallizing are fire and explosion hazards if not stored and operated properly. See the article “Welding and thermal cutting” in this chapter for detailed precautions.
As required by local ordinances, firefighting equipment, including alarms, should be provided and maintained in working order, and the workers drilled in using it properly.
Heat
The use of furnaces, open flames, ovens, heated solutions and molten metals inevitably presents the risk of excessive heat exposure, which is compounded in hot, humid climates and, particularly, by occlusive protective garments and gear. Complete air conditioning of a plant may not be economically feasible, but supplying cooled air in local ventilation systems is helpful. Rest breaks in cool surroundings and adequate fluid intake (fluids taken at the work station should be free of toxic contaminants) will help to avert heat toxicity. Workers and supervisors should be trained in the recognition of heat stress symptoms.
Conclusion
Surface treatment of metals involves a multiplicity of processes entailing a broad range of potentially toxic exposures, most of which can be prevented or controlled by the diligent application of well-recognized preventive measures.
Metal reclamation is the process by which metals are produced from scrap. These reclaimed metals are not distinguishable from the metals produced from primary processing of an ore of the metal. However, the process is slightly different and the exposure could be different. The engineering controls are basically the same. Metal reclamation is very important to the world economy because of the depletion of raw materials and the pollution of the environment created by scrap materials.
Aluminium, copper, lead and zinc comprise 95% of the production in the secondary non-ferrous metal industry. Magnesium, mercury, nickel, precious metals, cadmium, selenium, cobalt, tin and titanium are also reclaimed. (Iron and steel are discussed in the chapter Iron and steel industry. See also the article “Copper, lead and zinc smelting and refining” in this chapter.)
Control Strategies
Emission/exposure control principles
Metal reclamation involves exposures to dust, fumes, solvents, noise, heat, acid mists and other potential hazardous materials and risks. Some process and/or material handling modifications may be feasible to eliminate or reduce the generation of emissions: minimizing handling, lowering pot temperatures, decreasing dross formation and surface generation of dust, and modifying plant layout to reduce material handling or re-entrainment of settled dust.
Exposure can be reduced in some cases if machines are selected to perform high-exposure tasks so that employees may be removed from the area. This can also reduce ergonomic hazards due to materials handling.
To prevent cross contamination of clean areas in the plant, it is desirable to isolate processes generating significant emissions. A physical barrier will contain emissions and reduce their spread. Thus, fewer people are exposed, and the number of emission sources contributing to exposure in any one area will be reduced. This simplifies exposure evaluations and makes the identification and control of major sources easier. Reclaim operations are often isolated from other plant operations.
Occasionally, it is possible to enclose or isolate a specific emission source. Because enclosures are seldom air tight, a negative draught exhaust system is often applied to the enclosure. One of the most common ways to control emissions is to provide local exhaust ventilation at the point of emission generation. Capturing emissions at their source reduces the potential for emissions to disperse into the air. It also prevents secondary employee exposure created by the re-entrainment of settled contaminants.
The capture velocity of an exhaust hood must be great enough to prevent fumes or dust from escaping the air flow into the hood. The air flow should have enough velocity to carry fume and dust particles into the hood and to overcome the disrupting effects of cross drafts and other random air movements. The velocity required to accomplish this will vary from application to application. The use of recirculation heaters or personal cooling fans which can overcome local exhaust ventilation should be restricted.
All exhaust or dilution ventilation systems also require replacement air (known also as “make-up” air systems). If the replacement air system is well designed and integrated into natural and comfort ventilation systems, more effective control of exposures can be expected. For example, replacement air outlets should be placed so clean air flows from the outlet across the employees, towards the emission source and to the exhaust. This technique is often used with supplied-air islands and places the employee between clean incoming air and the emission source.
Clean areas are intended to be controlled through direct emission controls and housekeeping. These areas exhibit low ambient contaminant levels. Employees in contaminated areas can be protected by supplied-air service cabs, islands, stand-by pulpits and control rooms, supplemented by personal respiratory protection.
The average daily exposure of workers can be reduced by providing clean areas such as breakrooms and lunchrooms that are supplied with fresh filtered air. By spending time in a relatively contaminant-free area, the employees’ time-weighted average exposure to contaminants can be reduced. Another popular application of this principle is the supplied-air island, where fresh filtered air is supplied to the breathing zone of the employee at the workstation.
Sufficient space for hoods, duct work, control rooms, maintenance activities, cleaning and equipment storage should be provided.
Wheeled-vehicles are significant sources of secondary emissions. Where wheeled-vehicle transport is used, emissions can be reduced by paving all surfaces, keeping surfaces free of accumulated dusty materials, reducing vehicle travel distances and speed, and by re-directing vehicle exhaust and cooling fan discharge. Appropriate paving material such as concrete should be selected after considering factors such as load, use and care of surface. Coatings may be applied to some surfaces to facilitate wash down of roadways.
All exhaust, dilution and make-up air ventilation systems must be properly maintained in order to effectively control air contaminants. In addition to maintaining general ventilation systems, process equipment must be maintained to eliminate spillage of material and fugitive emissions.
Work practice programme implementation
Although standards emphasize engineering controls as a means of achieving compliance, work practice controls are essential to a successful control programme. Engineering controls can be defeated by poor work habits, inadequate maintenance and poor housekeeping or personal hygiene. Employees who operate the same equipment on different shifts can have significantly different airborne exposures because of differences in these factors between shifts.
Work practice programmes, although often neglected, represent good managerial practice as well as good common sense; they are cost effective but require a responsible and cooperative attitude on the part of employees and line supervisors. The attitude of senior management toward safety and health is reflected in the attitude of line supervisors. Likewise, if supervisors do not enforce these programmes, employees attitudes may suffer. Fostering good health and safety attitudes can be accomplished through:
Work practice programmes cannot be simply “installed”. Just as with a ventilation system, they must be maintained and continually checked to insure that they are functioning properly. These programmes are the responsibility of management and employees. Programmes should be established to teach, encourage and supervise “good” (i.e., low exposure) practices.
Personal protective equipment
Safety glasses with side shields, coveralls, safety shoes and work gloves should be routinely worn for all jobs. Those engaged in casting and melting, or in casting alloys, should wear aprons and hand protection made of leather or other suitable materials to protect against the splatter of molten metal.
In operations where engineering controls are not adequate to control dust or fume emissions, appropriate respiratory protection should be worn. If noise levels are excessive, and cannot be engineered out or noise sources cannot be isolated, hearing protection should be worn. There should also be a hearing conservation programme, including audiometric testing and training.
Processes
Aluminium
The secondary aluminium industry utilizes aluminium-bearing scrap to produce metallic aluminium and aluminium alloys. The processes used in this industry include scrap pre-treatment, remelting, alloying and casting. The raw material used by the secondary aluminium industry includes new and old scrap, sweated pig and some primary aluminium. New scrap consists of clippings, forging and other solids purchased from the aircraft industry, fabricators and other manufacturing plants. Borings and turnings are by-product of the machining of castings, rods and forging by the aircraft and automobile industry. Drosses, skimmings and slags are obtained from primary reduction plants, secondary smelting plants and foundries. Old scrap includes automobile parts, household items and airplane parts. The steps involved are as follows:
Table 1 lists exposure and controls for aluminium reclamation operations.
Table 1. Engineering/administrative controls for aluminium, by operation
Process equipment |
Exposure |
Engineering/administrative controls |
Sorting |
Torch desoldering—metal fumes such as lead and cadmium |
Local exhaust ventilation during desoldering; PPE—respiratory protection when desoldering |
Crushing/screening |
Non-specific dusts and aerosol, oil mists, metal particulates, and noise |
Local exhaust ventilation and general area ventilation, isolation of noise source; PPE—hearing protection |
Baling |
No known exposure |
No controls |
Burning/drying |
Non-specific particulate matter which may include metals, soot, and condensed heavy organics. Gases and vapours containing fluorides, sulphur dioxide, chlorides, carbon monoxide, hydrocarbons and aldehydes |
Local exhaust ventilation, general area ventilation, heat stress work/rest regimen, fluids, isolation of noise source; PPE—hearing protection |
Hot-dross processing |
Some fumes |
Local exhaust ventilation, general area ventilation |
Dry milling |
Dust |
Local exhaust ventilation, general area ventilation |
Roasting |
Dust |
Local exhaust ventilation, general area ventilation, heat stress work/rest regimen, fluids, isolation of noise source; PPE—hearing protection |
Sweating |
Metal fumes and particulates, non-specific gases and vapours, heat and noise |
Local exhaust ventilation, general area ventilation, heat stress work/rest regimen, fluids, isolation of noise source; PPE—hearing protection and respiratory protection |
Reverberatory (chlorine) smelting-refining |
Products of combustion, chlorine, hydrogen chlorides, metal chlorides, aluminium chlorides, heat and noise |
Local exhaust ventilation, general area ventilation, heat stress work/rest regimen, fluids, isolation of noise source; PPE—hearing protection and respiratory protection |
Reverberatory (fluorine) smelting-refining |
Products of combustion, fluorine, hydrogen flluorides, metal fluorides, aluminium fluorides, heat and noise |
Local exhaust ventilation, general area ventilation, heat stress work/rest regimen, fluids, isolation of noise source; PPE—hearing protection and respiratory protection |
Copper reclamation
The secondary copper industry utilizes copper-bearing scrap to produce metallic copper and copper based alloys. The raw materials used can be classified as new scrap produced in the fabrication of finished products or old scrap from obsolete worn out or salvaged articles. Old scrap sources include wire, plumbing fixtures, electrical equipment, automobiles and domestic appliances. Other materials with copper value include slags, drosses, foundry ashes and sweepings from smelters. The following steps are involved:
Table 2 lists exposures and controls for copper reclamation operations.
Table 2. Engineering/administrative controls for copper, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Stripping and sorting |
Air contaminants from material handling and desoldering or scrap cutting |
Local exhaust ventilation, general area ventilation |
Briquetting and crushing |
Non-specific dusts and aerosol, oil mists, metal particulates and noise |
Local exhaust ventilation and general area ventilation, isolation of noise source; PPE—hearing protection and respiratory protection |
Shredding |
Non-specific dusts, wire insulation material, metal particulates and noise |
Local exhaust ventilation and general area ventilation, isolation of noise source; PPE—hearing protection and respiratory protection |
Grinding and gravity separation |
Non-specific dusts, metal particulates from fluxes, slags and drosses, and noise |
Local exhaust ventilation and general area ventilation, isolation of noise source; PPE—hearing protection and respiratory protection |
Drying |
Non-specific particulate matter, which may include metals, soot and condensed heavy organics |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids, isolation of noise source; PPE—hearing protection and respiratory protection |
Insulation burning |
Non-specific particulate matter which may include smoke, clay |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids, isolation of noise source; PPE—respiratory protection |
Sweating |
Metal fumes and particulates, non-specific gases, vapours and particulates |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids, isolation of noise source; PPE—hearing protection and respiratory protection |
Ammonium carbonate leaching |
Ammonia |
Local exhaust ventilation, general area ventilation; PPE—respiratory protection |
Steam distillation |
Ammonia |
Local exhaust ventilation, general area ventilation; PPE—glasses with side shields |
Hydrothermal hydrogen reduction |
Ammonia |
Local exhaust ventilation, general area ventilation; PPE—respiratory protection |
Sulphuric acid leaching |
Sulphuric acid mists |
Local exhaust ventilation, general area ventilation |
Converter smelting |
Volatile metals, noise |
Local exhaust ventilation, general area ventilation; PPE—respiratory protection and hearing protection |
Electric crucible smelting |
Particulate, sulphur and nitrogen oxides, soot, carbon monoxide, noise |
Local exhaust ventilation, general area ventilation; PPE—hearing protection |
Fire refining |
Sulphur oxides, hydrocarbons, particulates |
Local exhaust ventilation, general area ventilation; PPE—hearing protection |
Electrolytic refining |
Sulphuric acid and metals from sludge |
Local exhaust ventilation, general area ventilation |
Lead reclamation
Raw materials purchased by secondary lead smelters may require processing prior to being charged into a smelting furnace. This section discusses the most common raw materials which are purchased by secondary lead smelters and feasible engineering controls and work practices to limit employee exposure to lead from raw materials processing operations. It should be noted that lead dust can generally be found throughout lead reclamation facilities and that any vehicular air is likely to stir up lead dust which can then be inhaled or adhere to shoes, clothing, skin and hair.
Automotive batteries
The most common raw material at a secondary lead smelter is junk automotive batteries. Approximately 50% of the weight of a junk automotive battery will be reclaimed as metallic lead in the smelting and refining process. Approximately 90% of the automotive batteries manufactured today utilize a polypropylene box or case. The polypropylene cases are reclaimed by almost all secondary lead smelters due to the high economic value of this material. Most of these processes can generate metal fumes, in particular lead and antimony.
In automotive battery breaking there is a potential for forming arsine or stibine due to the presence of arsenic or antimony used as hardening agents in grid metal and the potential for having nascent hydrogen present.
The four most common processes for breaking automotive batteries are:
The first three of these processes involve cutting the top off of the battery, then dumping the groups, or lead-bearing material. The fourth process involves crushing the entire battery in a hammer mill and separating the components by gravity separation.
Automotive battery separation takes place after automotive batteries have been broken in order that the lead-bearing material can be separated from the case material. Removing the case may generate acid mists. The most widely used techniques for accomplishing this task are:
Industrial batteries which were used to power mobile electric equipment or for other industrial uses are purchased periodically for raw material by most secondary smelters. Many of these batteries have steel cases which require removal by cutting the case open with a cutting torch or a hand-held gas powered saw.
Other purchased lead-bearing scrap
Secondary lead smelters purchase a variety of other scrap materials as raw materials for the smelting process. These materials include battery manufacturing plant scrap, drosses from lead refining, scrap metallic lead such as linotype and cable covering, and tetraethyl lead residues. These types of materials may be charged directly into smelting furnaces or mixed with other charge materials.
Raw material handling and transport
An essential part of the secondary lead smelting process is the handling, transportation and storage of raw material. Materials are transported by fork-lifts, front-end loaders or mechanical conveyors (screw, bucket elevator or belt). The primary method of material transporting in the secondary lead industry is mobile equipment.
Some common mechanical conveyance methods which are used by secondary lead smelters include: belt conveying systems that can be used to transport furnace feed material from storage areas to the furnace charring area; screw conveyors for transporting flue dust from the baghouse to an agglomeration furnace or a storage area or bucket elevators and drag chains/lines.
Smelting
The smelting operation at a secondary lead smelter involves the reduction of lead-bearing scrap into metallic lead in a blast furnace or reverberatory.
Blast furnaces are charged with lead-bearing material, coke (fuel) limestone and iron (flux). These materials are fed into the furnace at the top of the furnace shaft or through a charge door in the side of the shaft neat the top of the furnace. Some environmental hazards associated with blast furnace operations are metal fumes and particulates (especially lead and antimony), heat, noise and carbon monoxide. A variety of charge material conveying mechanisms are used in the secondary lead industry. The skip hoist is probably the most common. Other devices in use include vibratory hoppers, belt conveyors and bucket elevators.
Blast furnace tapping operations involve removing the molten lead and slag from the furnace into moulds or ladles. Some smelters tap metal directly into a holding kettle which keeps the metal molten for refining. The remaining smelters cast the furnace metal into blocks and allow the blocks to solidify.
Blast air for the combustion process enters the blast furnace through tuyères which occasionally begin to fill with accretions and must be physically punched, usually with a steel rod, to keep them from being obstructed. The conventional method to accomplish this task is to remove the cover of the tuyères and insert the steel rod. After the accretions have been punched, the cover is replaced.
Reverberatory furnaces are charged with lead-bearing raw material by a furnace charging mechanism. Reverberatory furnaces in the secondary lead industry typically have a sprung arch or hanging arch constructed of refractory brick. Many of the contaminants and physical hazards associated with reverberatory furnaces are similar to those of blast furnaces. Such mechanisms can be a hydraulic ram, a screw conveyor or other devices similar to those described for blast furnaces.
Reverberatory furnace tapping operations are very similar to blast-furnace tapping operations.
Refining
Lead refining in secondary lead smelters is conducted in indirect fired kettles or pots. Metal from the smelting furnaces is typically melted in the kettle, then the content of trace elements is adjusted to produce the desired alloy. Common products are soft (pure) lead and various alloys of hard (antimony) lead.
Virtually all secondary lead refining operations employ manual methods for adding alloying materials to the kettles and employ manual drossing methods. Dross is swept to the rim of the kettle and removed by shovel or large spoon into a container.
Table 3 lists exposures and controls for lead reclamation operations.
Table 3. Engineering/administrative controls for lead, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Vehicles |
Lead dust from roads and splashing water containing lead |
Water washdown and keeping areas wetted down. Operator training, prudent work practices and good housekeeping are key elements in minimizing lead emissions when operating mobile equipment. Enclose equipment and provide a positive pressure filtered air system. |
Conveyors |
Lead dust |
It is also preferable to equip belt conveyor systems with self-cleaning tail pulleys or belt wipes if they are used to transport furnace feed materials or flue dusts. |
Battery decasing |
Lead dust, acid mists |
Local exhaust ventilation, general area ventilation |
Charge preparation |
Lead dust |
Local exhaust ventilation, general area ventilation |
Blast furnace |
Metal fumes and particulates (lead, antimony), heat and noise, carbon monoxide |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids, isolation of noise source; PPE—respiratory protection and hearing protection |
Reverberatory furnace |
Metal fumes and particulates (lead, antimony), heat and noise |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids, isolation of noise source; PPE—respiratory protection and hearing protection |
Refining |
Lead particulates and possibly alloying metals and fluxing agents, noise |
Local exhaust ventilation, general area ventilation; PPE—hearing protection |
Casting |
Lead particulates and possibly alloying metals |
Local exhaust ventilation, general area ventilation |
Zinc reclamation
The secondary zinc industry utilizes new clippings, skimmings and ashes, die-cast skimmings, galvanizers’ dross, flue dust and chemical residue as sources of zinc. Most of the new scrap processed is zinc- and copper-based alloys from galvanizing and die-casting pots. Included in the old scrap category are old zinc engravers’ plates, die castings, and rod and die scrap. The processes are as follows:
Table 4 lists exposures and controls for zinc reclamation operations.
Table 4. Engineering/administrative controls for zinc, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Reverberatory sweating |
Particulates containing zinc, aluminium, copper, iron, lead, cadmium, manganese and chromium, contaminants from fluxing agents, sulphur oxides, chlorides and fluorides |
Local exhaust ventilation, general area ventilation, heat stress–work/rest regimen, fluids |
Rotary sweating |
Particulates containing zinc, aluminium, copper, iron, lead, cadmium, manganese and chromium, contaminants from fluxing agents, sulphur oxides, chlorides and fluorides |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Muffle sweating and kettle (pot) sweating |
Particulates containing zinc, aluminium, copper, iron, lead, cadmium, manganese and chromium, contaminants from fluxing agents, sulphur oxides, chlorides and fluorides |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Crushing/screening |
Zinc oxide, minor amounts of heavy metals, chlorides |
Local exhaust ventilation, general area ventilation |
Sodium carbonate leaching |
Zinc oxide, sodium carbonate, zinc carbonate, zinc hydroxide, hydrogen chloride, zinc chloride |
Local exhaust ventilation, general area ventilation |
Kettle (pot) melting crucible, reverberatory, electric induction melting |
Zinc oxide fumes, ammonia, ammonia chloride, hydrogen chloride, zinc chloride |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Alloying |
Particulates containing zinc, alloying metals, chlorides; non-specific gases and vapours; heat |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Retort distillation, retort distillation/oxidation and muffle distillation |
Zinc oxide fumes, other metal particulates, oxides of sulphur |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Graphite rod resistor distillation |
Zinc oxide fumes, other metal particulates, oxides of sulphur |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Magnesium reclamation
Old scrap is obtained from sources such as scrap automobile and aircraft parts and old and obsolete lithographic plates, as well as some sludges from primary magnesium smelters. New scrap consists of clippings, turnings, borings, skimmings, slags, drosses and defective articles from sheet mills and fabrication plants. The greatest danger in handling magnesium is that of fire. Small fragments of the metal can readily be ignited by a spark or flame.
Table 5 lists exposures and controls for magnesium reclamation operations.
Table 5. Engineering/administrative controls for magnesium, by operation
Process equipment |
Exposures |
Engineering/administrative |
Scrap sorting |
Dust |
Water washdown |
Open pot melting |
Fumes and dust, a high potential for fires |
Local exhaust ventilation and general area ventilation and work practices |
Casting |
Dust and fumes, heat and a high potential for fires |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Mercury reclamation
The major sources for mercury are dental amalgams, scrap mercury batteries, sludges from electrolytic processes that use mercury as a catalyst, mercury from dismantled chlor-alkali plants and mercury-containing instruments. Mercury vapour can contaminate each of these processes.
Table 6 lists exposures and controls for mercury reclamation operations.
Table 6. Engineering/administrative controls for mercury, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Crushing |
Volatile mercury |
Local exhaust; PPE—respiratory protection |
Filtration |
Volatile mercury |
Local exhaust ventilation; PPE—respiratory protection |
Vacuum distillation |
Volatile mercury |
Local exhaust ventilation; PPE—respiratory protection |
Solution purification |
Volatile mercury, solvents, organics and acid mists |
Local exhaust ventilation, general area ventilation; PPE—respiratory protection |
Oxidation |
Volatile mercury |
Local exhaust ventilation; PPE—respiratory protection |
Retorting |
Volatile mercury |
Local exhaust ventilation; PPE—respiratory protection |
Nickel reclamation
The principal raw materials for nickel reclamation are nickel-, copper- and aluminium-vapour based alloys, which can be found as old or new scrap. Old scrap comprises alloys that are salvaged from machinery and airplane parts, while new scrap refers to sheet scrap, turnings and solids which are by-products of the manufacture of alloy products. The following steps are involved in nickel reclamation:
Exposures and control measures for nickel reclamation operations are listed in table 7.
Table 7. Engineering/administrative controls for nickel, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Sorting |
Dust |
Local exhaust and solvent substitution |
Degreasing |
Solvent |
Local exhaust ventilation and solvent substitution and/or recovery, general area ventilation |
Smelting |
Fumes, dust, noise, heat |
Local exhaust ventilation, work/rest regimen, fluids; PPE—respiratory protection and hearing protection |
Refining |
Fumes, dust, heat, noise |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids; PPE—respiratory protection and hearing protection |
Casting |
Heat, metal fumes |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Precious metals reclamation
The raw materials for the precious metal industry consist of both old and new scrap. Old scrap includes electronic components from obsolete military and civilian equipment and scrap from the dental industry. New scrap is generated during the fabrication and manufacturing of precious metal products. The products are the elemental metals such as gold, silver, platinum and palladium. Precious metal processing includes the following steps:
Exposures and controls are listed, by operation, in table 8 (see also “Gold smelting and refining”).
Table 8. Engineering/administrative controls for precious metals, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Sorting and shredding |
Hammermill is a potential noise hazard |
Noise control material; PPE—hearing protection |
Incineration |
Organics, combustion gases and dust |
Local exhaust ventilation and general area ventilation |
Blast furnace smelting |
Dust, noise |
Local exhaust ventilation; PPE—hearing protection and respiratory protection |
Electrolytic refining |
Acid mists |
Local exhaust ventilation, general area ventilation |
Chemical refining |
Acid |
Local exhaust ventilation, general area ventilation; PPE—acid-resistant clothing, chemical goggles and face shield |
Cadmium reclamation
Old cadmium-bearing scrap includes cadmium-plated parts from junked vehicles and boats, household appliances, hardware and fasteners, cadmium batteries, cadmium contacts from switches and relays and other used cadmium alloys. New scrap is normally cadmium vapour bearing rejects and contaminated by-products from industries which handle the metals. The reclamation processes are:
Exposures in cadmium reclamation processes and the necessary controls are summarized in table 9.
Table 9. Engineering/administrative controls for cadmium, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Scrap degreasing |
Solvents and cadmium dust |
Local exhaust and solvent substitution |
Alloy smelting/refining |
Products of oil and gas combustion, zinc fumes, cadmium dust and fumes |
Local exhaust ventilation and general area ventilation; PPE—respiratory protection |
Retort distillation |
Cadmium fumes |
Local exhaust ventilation; PPE—respiratory protection |
Melting/dezincing |
Cadmium fumes and dust, zinc fumes and dust, zinc chloride, chlorine, hydrogen chloride, heat stress |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids; PPE—respiratory protection |
Casting |
Cadmium dust and fumes, heat |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids; PPE—respiratory protection |
Selenium reclamation
Raw materials for this segment are used xerographic copying cylinders and scrap generated during the manufacture of selenium rectifiers. Selenium dusts may be present throughout. Distillation and retort smelting can produce combustion gases and dust. Retort smelting is noisy. Sulphur dioxide mist and acid mist are present in refining. Metal dusts can be produced from casting operations (see table 10).
Table 10. Engineering/administrative controls for selenium, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Scrap pretreatment |
Dust |
Local exhaust |
Retort smelting |
Combustion gases and dust, noise |
Local exhaust ventilation and general area ventilation; PPE—hearing protection; control of burner noise |
Refining |
SO2, acid mist |
Local exhaust ventilation; PPE—chemical goggles |
Distillation |
Dust and combustion products |
Local exhaust ventilation, general area ventilation |
Quenching |
Metal dust |
Local exhaust ventilation, general area ventilation |
Casting |
Selenium fumes |
Local exhaust ventilation, general area ventilation |
The reclamation processes are as follows:
Cobalt reclamation
The sources of cobalt scrap are super alloy grindings and turnings, and obsolete or worn engine parts and turbine blades. The processes of reclamation are:
See table 11 for a summary of exposures and controls for cobalt reclamation.
Table 11. Engineering/administrative controls for cobalt, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Hand sorting |
Dust |
Water washdown |
Degreasing |
Solvents |
Solvent recovery, local exhaust and solvent substitution |
Blasting |
Dust—toxicity dependent upon the grit used |
Local exhaust ventilation; PPE for physical hazard and respiratory protection depending on grit used |
Pickling and chemical treatment process |
Acid mists |
Local exhaust ventilation, general area ventilation; PPE—respiratory protection |
Vacuum melting |
Heavy metals |
Local exhaust ventilation, general area ventilation |
Casting |
Heat |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Tin reclamation
The major sources of raw materials are tin-plated steel trimmings, rejects from tin-can manufacturing companies, rejected plating coils from the steel industry, tin drosses and sludges, solder drosses and sludges, used bronze and bronze rejects and metal type scrap. Tin dust and acid mists can be found in many of the processes.
See table 12 for a summary of exposures and controls for tin reclamation.
Table 12. Engineering/administrative controls for tin, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Dealuminization |
Sodium hydroxide |
Local exhaust; PPE—chemical goggles and/or face shield |
Batch mixing |
Dust |
Local exhaust ventilation and general area ventilation |
Chemical detinning |
Caustic |
Local exhaust ventilation; PPE—chemical goggles and/or face shield |
Dross smelting |
Dust and heat |
Local exhaust ventilation, general area ventilation, work/rest regimen, fluids |
Dust leaching and filtration |
Dust |
Local exhaust ventilation, general area ventilation |
Settling and leaf filtration |
None identified |
None identified |
Evapocentrifugation |
None identified |
None identified |
Electrolytic refining |
Acid mist |
Local exhaust ventilation and general area ventilation; PPE—chemical goggles and/or face shield |
Acidification and filtration |
Acid mists |
Local exhaust ventilation and general area ventilation; PPE—chemical goggles and/or face shield |
Fire refining |
Heat |
Work/rest regimen, PPE |
Smelting |
Combustion gases, fumes and dust, heat |
Local exhaust ventilation and general area ventilation, work/rest regimen, PPE |
Calcining |
Dust, fumes, heat |
Local exhaust ventilation and general area ventilation work/rest regimen, PPE |
Kettle refining |
Dust, fumes, heat |
Local exhaust ventilation and general area ventilation, work/rest regimen, PPE |
Titanium reclamation
The two primary sources of titanium scrap are the home and titanium consumers. Home scrap which is generated by the milling and manufacturing of titanium products includes trim sheets, plank sheet, cuttings, turnings and borings. Consumer scrap consists of recycled titanium products. The reclamation operations include:
Controls for exposures in titanium reclamation procedures are listed in table 13.
Table 13. Engineering/administrative controls for titanium, by operation
Process equipment |
Exposures |
Engineering/administrative controls |
Solvent degreasing |
Solvent |
Local exhaust and solvent recovery |
Pickling |
Acids |
Face shields, aprons, long sleeves, safety glasses or goggles |
Electrorefining |
None known |
None known |
Smelting |
Volatile metals, noise |
Local exhaust ventilation and control of noise from burners; PPE—hearing protection |
Casting |
Heat |
PPE |
Metal Finishing
The surface treatment of metals increases their durability and improves their appearance. A single product may undergo more than one surface treatment—for example, an auto body panel may be phosphated, primed and painted. This article deals with the processes used for surface treatment of metals and the methods used to reduce their environmental impact.
Operating a metal finishing business requires cooperation between company management, employees, government and the community to effectively minimize the environmental effect of the operations. Society is concerned with the amount and the long-term effects of pollution entering the air, water and land environment. Effective environmental management is established through detailed knowledge of all elements, chemicals, metals, processes and outputs.
Pollution prevention planning shifts the environmental management philosophy from reacting to problems to anticipating solutions focusing on chemical substitution, process change and internal recycling, using the following planning sequence:
Continuous improvement is achieved by setting new priorities for action and repeating the sequence of actions.
Detailed process documentation will identify the waste streams and allow priorities to be set for waste reduction opportunities. Informed decisions about potential changes will encourage:
Major processes and standard operating processes
Cleaning is required because all metal finishing processes require that parts to be finished be free from organic and inorganic soils, including oils, scale, buffing and polishing compounds. The three basic types of cleaners in use are solvents, vapour degreasers and alkaline detergents.
Solvents and vapour degreasing cleaning methods have been almost totally replaced by alkaline materials where the subsequent processes are wet. Solvents and vapour degreasers are still in use where parts must be clean and dry with no further wet processing. Solvents such as terpenes are in some instances replacing volatile solvents. Less toxic materials such as 1,1,1-trichloroethane have been substituted for more hazardous materials in vapour degreasing (although this solvent is being phased out as an ozone depleter).
Alkaline cleaning cycles usually include a soak immersion followed by an anodic electroclean, followed by a weak acid immersion. Non-etching, non-silicated cleaners are typically used to clean aluminium. The acids are typically sulphuric, hydrochloric and nitric.
Anodizing, an electrochemical process to thicken the oxide film on the metal surface (frequently applied to aluminium), treats the parts with dilute chromic or sulphuric acid solutions.
Conversion coating is used to provide a base for subsequent painting or to passivate for protection against oxidation. With chromating, parts are immersed in a hexavalent chrome solution with active organic and inorganic agents. For phosphating, parts are immersed in dilute phosphoric acid with other agents. Passivating is accomplished through immersion in nitric acid or nitric acid with sodium dichromate.
Electroless plating involves a deposition of metal without electricity. Copper or nickel electroless deposition is used in the manufacture of printed circuit boards.
Electroplating involves the deposition of a thin coat of metal (zinc, nickel, copper, chromium, cadmium, tin, brass, bronze, lead, tin-lead, gold, silver and other metals such as platinum) on a substrate (ferrous or non-ferrous). Process baths include metals in solution in acid, alkaline neutral and alkaline cyanide formulations (see figure 1).
Figure 1. Inputs and outputs for a typical electroplating line
Chemical milling and etching are controlled dissolution immersion processes using chemical reagents and etchants. Aluminium is typically etched in caustic prior to anodizing or chemically brightened in a solution which could contain nitric, phosphoric and sulphuric acids.
Hot-dip coatings involve the application of metal to a workpiece by immersion in molten metal (zinc or tin galvanizing of steel).
Good management practices
Important safety, health and environmental improvements can be achieved through process improvements, such as:
Environmental planning for specific wastes
Specific waste streams, usually spent plating solutions, can be reduced by:
Several methods of reducing drag-out include:
Drag-out recovery of chemicals uses a variety of technologies. These include:
Rinse water
Most of the hazardous waste produced in a metal finishing facility comes from waste water generated by the rinsing operations that follow cleaning and plating. By increasing rinse efficiency, a facility can significantly reduce waste water flow.
Two basic strategies improve rinsing efficiency. First, turbulence can be generated between the workpiece and the rinse water through spray rinses and rinse water agitation. Movement of the rack or forced water or air are used. Second, the contact time between the workpiece and the rinse water can be increased. Multiple rinse tanks set countercurrent in series will reduce the amount of rinse water used.
Industrial Coatings
The term coatings includes paints, varnishes, lacquers, enamels and shellacs, putties, wood fillers and sealers, paint and varnish removers, paint brush cleaners and allied paint products. Liquid coatings contain pigments and additives dispersed in a liquid binder and solvent mixture. Pigments are inorganic or organic compounds that provide coating colour and opacity and influence coating flow and durability. Pigments often contain heavy metals such as cadmium, lead, zinc, chromium and cobalt. The binder increases coating adhesiveness, cohesiveness and consistency and is the primary component that remains on the surface when coating is completed. Binders include a variety of oils, resins, rubbers and polymers. Additives such as fillers and extenders may be added to coatings to reduce manufacturing costs and increase coating durability.
The types of organic solvents used in coatings include aliphatic hydrocarbons, aromatic hydrocarbons, esters, ketones, glycol ethers and alcohols. Solvents disperse or dissolve the binders and decrease the coating viscosity and thickness. Solvents used in coatings formulations are hazardous because many are human carcinogens and are flammable or explosive. Most solvents contained in a coating evaporate when the coating cures, which generates volatile organic compound (VOC) emissions. VOC emissions are becoming increasingly regulated because of the negative effects on human health and the environment. Environmental concerns associated with conventional ingredients, coating application technologies and coating wastes are a driving force for developing pollution prevention alternatives.
Most coatings are used on architectural, industrial or special products. Architectural coatings are used in buildings and building products and for decorative and protective services such as varnishes to protect wood. Industrial facilities incorporate coating operations in various production processes. The automotive, metal can, farm machinery, coil coating, wood and metal furniture and fixtures, and household appliance industries are the major industrial coatings consumers.
Design of a coating formulation depends on the purpose of the coating application. Coatings provide aesthetics, and corrosion and surface protection. Cost, function, product safety, environmental safety, transfer efficiency and drying and curing speed determine formulations.
Coating processes
There are five operations comprising most coating processes: raw materials handling and preparation, surface preparation, coating, equipment cleaning and waste management.
Raw material handling and preparation
Raw material handling and preparation involves inventory storage, mixing operations, thinning and adjusting of coatings and raw material transfer through the facility. Monitoring and handling procedures and practices are needed to minimize the generation of wastes from spoilage, off specification and improper preparation that can result from excessive thinning and consequent wastage. Transfer, whether manual or through a piped system, must be scheduled to avoid spoilage.
Surface preparation
The type of surface preparation technique used depends on the surface being coated—previous preparation, amount of soil, grease, the coating to be applied and the surface finish required. Common preparation operations include degreasing, precoating or phosphating and coating removal. For metal finishing purposes, degreasing involves solvent wiping, cold cleaning or vapour degreasing with halogenated solvents, aqueous alkaline cleaning, semi-aqueous cleaning or aliphatic hydrocarbon cleaning to remove organic soil, dirt, oil and grease. Acid pickling, abrasive cleaning or flame cleaning are used to remove mill scale and rust.
The most common preparation operation for metal surfaces, other than cleaning, is phosphate coating, used to promote adhesion of organic coatings onto metal surfaces and retard corrosion. Phosphate coatings are applied by immersing or spraying metal surfaces with zinc, iron or manganese phosphate solution. Phosphating is a surface finishing process similar to electroplating, consisting of a series of process chemical and rinse baths in which parts are immersed to achieve the desired surface preparation. See the article “Surface treatment of metals” in this chapter.
Coating removal, chemical or mechanical, is conducted on surfaces that require recoating, repair or inspection. The most common chemical coating removal method is solvent stripping. These solutions usually contain phenol, methylene chloride and an organic acid to dissolve the coating from the coated surface. A final water wash to remove the chemicals can generate large quantities of wastewater. Abrasive blasting is the common mechanical process, a dry operation that uses compressed air to propel a blasting medium against the surface to remove the coating.
Surface preparation operations affect the quantity of waste from the specific preparation process. If the surface preparation is inadequate, resulting in poor coating, then removal of the coating and recoating adds to waste generation.
Coating
The coating operation involves transferring the coating to the surface and curing the coating on the surface. Most coating technologies fall into 1 of 5 basic categories: dip coating, roll coating, flow coating, spray coating, and the most common technique, air-atomized spray coating using solvent-based coatings.
Air-atomized spray coatings are usually conducted in a controlled environment because of solvent emissions and overspray. Overspray control devices are fabric filters or water walls, generating either used filters or wastewater from air scrubbing systems.
Curing is performed to convert the coating binder into a hard, tough, adherent surface. Curing mechanisms include: drying, baking or exposure to an electron beam or infrared or ultraviolet light. Curing generates significant VOCs from solvent-based coatings and poses a potential for explosion if the solvent concentrations rise above the lower explosive limit. Consequently, curing operations are equipped with air pollution control devices to prevent VOC emissions and for safety control to prevent explosions.
Environmental and health concerns, increased regulations affecting conventional coating formulations, high solvent costs and expensive hazardous waste disposal have created a demand for alternative coating formulations that contain less hazardous constituents and generate less waste when applied. Alternative coating formulations include:
Equipment cleaning
Equipment cleaning is a necessary, routine maintenance operation in coating processes. This creates significant amounts of hazardous waste, particularly if halogenated solvents are used for cleaning. Equipment cleaning for solvent-based coatings has traditionally been conducted manually with organic solvents to remove coatings from process equipment. Piping requires flushing with solvent in batches until clean. Coating equipment must be cleaned between product changes and after process shutdowns. The procedures and practices used will determine the level of waste generated from these activities.
Waste management
Several waste streams are generated by coating processes. Solid waste includes empty coating containers, coating sludge from overspray and equipment cleaning, spent filters and abrasive materials, dry coating and cleaning rags.
Liquid wastes include waste water from surface preparation, overspray control or equipment cleaning, off-specification or excess coating or surface preparation materials, overspray, spills and spent cleaning solutions. Onsite closed-loop recycling is becoming more popular for spent solvents as disposal costs rise. Water-based liquids are usually treated onsite prior to discharge to publicly owned treatment systems.
VOC emissions are generated by all conventional coating processes that use solvent-based coatings, requiring control devices such as carbon adsorption units, condensers or thermal catalytic oxidizers.
The diversity of processes and products within the microelectronics and semiconductor industry is immense. The focus of the occupational health and safety discussion in this chapter centres on semiconductor integrated circuit (IC) production (both in silicon-based products and valence III-V compounds), printed wiring board (PWB) production, printed circuit board (PCB) assembly and computer assembly.
The industry is composed of numerous major segments. The Electronics Industry Association uses the following delineation in reporting data on pertinent trends, sales and employment within the industry:
Electronic components include electron tubes (e.g., receiving, special-purpose and television tubes), solid-state products (e.g., transistors, diodes, ICs, light-emitting diodes (LEDs) and liquid-crystal displays (LCDs)) and passive and other components (e.g., capacitors, resistors, coils, transformers and switches).
Consumer electronics include television sets and other home and portable audio and video products, as well as information equipment such as personal computers, facsimile transmission machines and telephone answering devices. Electronic gaming hardware and software, home security systems, blank audio and video cassettes and floppy disks, electronic accessories and total primary batteries also fall under the consumer electronics heading.
In addition to general purpose and specialized computers, computers and peripheral equipment includes auxiliary storage equipment, input/output equipment (e.g., keyboards, mice, optical scanning devices and printers), terminals and so on. While telecommunications, defence communications and industrial and medical electronics utilize some of the same technology these segments also involve specialized equipment.
The emergence of the microelectronics industry has had a profound impact on the evolution and structure of the world’s economy. The pace of change within industrialized nations of the world has been greatly influenced by advances within this industry, specifically in the evolution of the integrated circuit. This pace of change is graphically represented in the timeline of the number of transistors per integrated circuit chip (see figure 1).
Figure 1. Transistors per integrated circuit chip
The economic importance of worldwide semiconductor sales is significant. Figure 2 is a projection by the Semiconductor Industry Association for worldwide and regional semiconductor sales for 1993 to 1998.
Figure 2. Worldwide semiconductor sales forecast
The semiconductor IC and computer/electronics assembly industries are unique compared to most other industrial categories in the relative composition of their production workforces. The semiconductor fabrication area has a high percentage of female operators that run the process equipment. The operator-related tasks typically do not require heavy lifting or excess physical strength. Also, many of the job tasks involve fine motor skills and attention to detail. Male workers predominate in the maintenance-related tasks, engineering functions and management. A similar composition is found in the computer/electronics assembly portion of this industry segment. Another unusual feature of this industry is the concentration of manufacturing in the Asia/Pacific area of the world. This is especially true in the final assembly or back-end processes in the semiconductor industry. This processing involves the positioning and placement of the fabricated integrated circuit chip (technically known as a die) on a chip carrier and lead frame. This processing requires precise positioning of the chip, typically through a microscope, and very fine motor skills. Again, female workers predominate this part of the process, with the majority of worldwide production being concentrated in the Pacific Rim, with high concentrations in Taiwan, Malaysia, Thailand, Indonesia and the Philippines, and growing numbers in China and Vietnam.
The semiconductor IC fabrication areas have various unusual properties and characteristics unique to this industry. Namely, the IC processing involves extremely tight particulate control regimens and requirements. A typical modern IC fabrication area may be rated as a Class 1 or less cleanroom. As a method of comparison, an outdoor environment would be greater than Class 500,000; a typical room in a house approximately Class 100,000; and a semiconductor back-end assembly area approximately Class 10,000. To attain this level of particulate control involves actually putting the fabrication worker in totally enclosed bunny suits that have air supply and filtration systems to control the levels of particulates generated by the workers in the fabrication area. The human occupants of the fabrication areas are considered very potent generators of fine particulates from their exhaled air, shedding of skin and hair, and from their clothing and shoes. This requirement for wearing confining clothing and isolating work routines has contributed to employees feeling like they are working in a “non-hospitable” work environment. See figure 3. Also, in the photolithographic area, the processing involves exposing the wafer to a photoactive solution, and then patterning an image on the wafer surface using ultraviolet light. To alleviate unwanted ultraviolet (UV) light from this processing area, special yellow lights are used (they lack the UV wavelength component normally found in indoor lighting). These yellow lights help to make the workers feel they are in a different work environment and can possibly have a disorienting affect on some individuals.
Figure 3. A state-of-the-art cleanroom
Process Overview
The description of silicon semiconductor device processing, either discrete devices (a semiconductor containing only one active device, such as a transistor) or ICs (interconnected arrays of active and passive elements within a single semiconductor substrate capable of performing at least one electronic circuit function), involves numerous highly technical and specific operations. The intent of this description is to provide a basic framework and explanation of the primary component steps utilized in fabricating a silicon semiconductor device and the associated environmental, health and safety (EHS) issues.
The fabrication of an IC involves a sequence of processes that may be repeated many times before a circuit is complete. The most popular ICs use 6 or more masks to complete patterning processes, with 10 to 24 masks being typical. The manufacture of a microcircuit begins with an ultra-high purity silicon wafer 4 to 12 inches in diameter. Perfectly pure silicon is almost an insulator, but certain impurities, called dopants, added in amounts of from 10 to 100 parts per million, make silicon conduct electricity.
An integrated circuit can consist of millions of transistors (also diodes, resistors and capacitors) made of doped silicon, all connected by the appropriate pattern of conductors to create the computer logic, memory or other type of circuit. Hundreds of microcircuits can be made on one wafer.
Six major fabrication processing steps are universal to all silicon semiconductor devices: oxidation, lithography, etching, doping, chemical vapour deposition and metallization. These are followed by assembly, testing, marking, packing and shipping.
Oxidation
Generally, the first step in semiconductor device processing involves the oxidation of the exterior surface of the wafer to grow a thin layer (about one micron) of silicon dioxide (SiO2). This primarily protects the surface from impurities and serves as a mask for the subsequent diffusion process. This ability to grow a chemically stable protective wafer of silicon dioxide on silicon makes silicon wafers the most widely used semiconductor substrate.
Oxidation, commonly called thermal oxidation, is a batch process which takes place in a high-temperature diffusion furnace. The protective silicon dioxide layer is grown in atmospheres containing either oxygen (O2) (dry oxidation) or oxygen combined with water vapour (H2O) (wet oxidation). The temperatures in the furnace range from 800 to 1,300oC. Chlorine compounds in the form of hydrogen chloride (HCl) may also be added to help control unwanted impurities.
The tendency in newer fabrication facilities is towards vertical oxidation furnaces. Vertical furnaces better address the need for greater contamination control, larger wafer size and more uniform processing. They allow a smaller equipment footprint that conserves precious cleanroom floor space.
Dry oxidation
Silicon wafers to be oxidized are first cleaned, using a detergent and water solution, and solvent rinsed with xylene, isopropyl alcohol or other solvents. The cleaned wafers are dried, loaded into a quartz wafer holder called a boat and loaded into the operator end (load end) of the quartz diffusion furnace tube or cell. The inlet end of the tube (source end) supplies high-purity oxygen or oxygen/nitrogen mixture. The “dry” oxygen flow is controlled into the quartz tube and assures that an excess of oxygen is available for the growth of silicon dioxide on the silicon wafer surface. The basic chemical reaction is:
Si + O2 → SiO2
Wet oxidation
Four methods of introducing water vapour are commonly used when water is the oxidizing agent—pyrophoric, high-pressure, bubbler and flash. The basic chemical reactions are:
Pyrophoric and high pressure: Si + 2O2 + 2 H2 → SiO2 + 2H2O
Flash and bubbler: Si + 2H2O → SiO2 + 2H2
Pyrophoric oxidation involves the introduction and combustion of a hydrogen/oxygen gas mixture. Such systems are generally called burnt hydrogen or torch systems. Water vapour is produced when proper amounts of hydrogen and oxygen are introduced at the inlet end of the tube and allowed to react. The mixture must be controlled precisely to guarantee proper combustion and prevent the accumulation of explosive hydrogen gas.
High-pressure oxidation (HiPox) is technically called a water pyrosynthesis system and generates water vapour through the reaction of ultra-pure hydrogen and oxygen. The steam is then pumped into a high-pressure chamber and pressurized to 10 atmospheres, which accelerates the wet oxidation process. De-ionized water may also be used as a steam source.
In bubbler oxidation de-ionized water is placed in a container called a bubbler and maintained at a constant temperature below its boiling point of 100°C through the use of a heating mantle. Nitrogen or oxygen gas enters the inlet side of the bubbler, becomes saturated with water vapour as it rises through the water, and exits through the outlet into the diffusion furnace. Bubbler systems appear to be the most widely used method of oxidation.
In flash oxidation de-ionized water is dripped continuously into the heated bottom surface of a quartz container and the water evaporates rapidly once it hits the hot surface. Nitrogen or oxygen carrier gas flows over the evaporating water and carries the water vapour into the diffusion furnace.
Lithography
Lithography, also known as photolithography or simply masking, is a method of accurately forming patterns on the oxidized wafer. The microelectronic circuit is built up layer by layer, each layer receiving a pattern from a mask prescribed in circuit design.
The printing trades developed the true antecedents of today’s semiconductor device microfabrication processes. These developments relate to the manufacture of printing plates, usually of metal, on which removal of material through chemical etching produces a surface relief pattern. This same basic technique is used in producing master masks used in the fabrication of each layer of processing of a device.
Circuit designers digitize the basic circuitry of each layer. This computerized schematic allows quick generation of the mask circuitry and facilitates any changes that may be needed. This technique is known as computer-aided design (CAD). Utilizing powerful computer algorithms, these on-line design systems permit the designer to lay out and modify the circuitry directly on video display screens with interactive graphic capabilities.
The final drawing, or mask, for each layer of circuitry is created by a computer-driven photoplotter, or pattern generator. These photoplotted drawings are then reduced to the actual size of the circuit, a master mask produced on glass with chrome relief, and reproduced on a work plate which serves for either contact or projection printing on the wafer.
These masks delineate the pattern of the conducting and insulating areas which are transferred to the wafer through photolithography. Most companies do not produce their own masks, but utilize those furnished by a mask producer.
Cleaning
The need for a particulate- and contamination-free exterior wafer surface requires frequent cleaning. The major categories are:
Resist application
Wafers are coated with a resist material of solvent-based polymer and rapidly rotated on a spinner, which spreads a thin uniform layer. The solvents then evaporate, leaving a polymeric film. All resist materials depend on (primarily ultraviolet) radiation-induced changes in the solubility of a synthetic organic polymer in a selected developer rinse. Resist materials are classified as either negative or positive resists, depending on whether the solubility in the developer decreases (negative) or increases (positive) upon exposure to radiation. Table 1 identifies the component makeup of various photoresist systems.
Table 1. Photoresist systems
Ultraviolet |
|||
Near (350–450 nm) |
Negative |
PB |
Azide base aliphatic rubber (isoprene) |
Positive |
PB |
Ortho-diazoketone |
|
Deep (200–250 nm) |
Primarily |
||
Electron-beam (about 100 nm) |
|||
Negative |
PB |
Copolymer-ethyl acrylate and glycidyl methacrylate (COP) |
|
Positive |
PB |
Polymethylmethacrylate, polyfluoralkylmethacrylate, polyalkylaldehyde, poly-cyano ethylacrylate |
|
X ray (0.5–5 nm) |
|||
Negative |
PB |
Copolymer-ethyl acrylate and glycidyl methacrylate (COP) |
|
Positive |
PB |
Polymethylmethacrylate, ortho-diazoketone, poly |
PB = polymer base; S = solvent; D = developer.
Since most photoresists are ultraviolet (UV) light sensitive, the processing area is lit with special yellow lights lacking sensitive UV wavelengths (see figure 1).
Figure 1. Photolithographic “Yellow room” equipment
Negative and positive UV resists are primarily in use in the industry. E-beam and x-ray resists, however, are gaining in market share because of their higher resolutions. Health concerns in lithography are primarily caused by potential reproductive hazards associated with selected positive resists (e.g., ethylene glycol monoethyl ether acetate as a carrier) that are currently being phased out by the industry. Occasional odours from the negative resists (e.g., xylene) also result in employee concerns. Because of these concerns, a great deal of time is spent by semiconductor industry industrial hygienists sampling photoresist operations. While this is useful in characterizing these operations, routine exposures during spinner and developer operations are typically less than 5% of the airborne standards for occupational exposure for the solvents used in the process (Scarpace et al. 1989).
A 1 hour exposure to ethylene glycol monoethyl ether acetate of 6.3 ppm was found during the operation of a spinner system. This exposure was primarily caused by poor work practices during the maintenance operation (Baldwin, Rubin and Horowitz 1993).
Drying and pre-baking
After the resist has been applied, the wafers are moved on a track or manually moved from the spinner to a temperature-controlled oven with a nitrogen atmosphere. A moderate temperature (70 to 90°C) causes the photoresist to cure (soft bake) and the remaining solvents to evaporate.
To ensure adhesion of the resist layer to the wafer, a primer, hexamethyldisilizane (HMDS), is applied to the wafer. The primer ties up molecular water on the surface of the wafer. HMDS is applied either directly in an immersion or spin-on process or through a vapour prime that offers process and cost advantages over the other methods.
Mask aligning and exposure
The mask and wafer are brought close together using a precise piece of optical/mechanical equipment, and the image on the mask is aligned to any pattern already existing in the wafer beneath the layer of photoresist. For the first mask, no alignment is necessary. In older technologies, alignment for successive layers is made possible by the use of a biscope (dual lens microscope) and precision controls for positioning the wafer with respect to the mask. In newer technologies alignment is done automatically using reference points on the wafers.
Once the alignment is done, a high-intensity ultraviolet mercury vapour or arc lamp source shines through the mask, exposing the resist in places not protected by opaque regions of the mask.
The various methods of wafer alignment and exposure include UV flood exposure (contact or proximity), UV exposure through projection lens for reduction (projection), UV step and repeat reduction exposure (projection), x-ray flood (proximity) and electron beam scan exposure (direct writing). The primary method in use involves UV exposure from mercury vapour and arc lamps through proximity or projection aligners. The UV resists are either designed to react to a broad spectrum of UV wavelengths, or they are formulated to react preferentially to one or more of the main spectrum lines emitted from the lamp (e.g., g-line at 435 nm, h-line at 405 nm and i-line at 365 nm).
The predominant wavelengths of UV light currently used in photomasking are 365 nm or above, but UV lamp spectra also contain significant energy in the wavelength region of health concern, the actinic region below 315 nm. Normally, the intensity of the UV radiation escaping from the equipment is less than both what is present from sunlight in the actinic region and the standards set for occupational exposure to UV.
Occasionally during maintenance, the alignment of the UV lamp requires that it be energized outside the equipment cabinet or without normal protective filters. Exposure levels during this operation can exceed occupational exposure limits, but standard cleanroom attire (e.g., smocks, vinyl gloves, face masks and polycarbonate safety glasses with UV inhibitor) is usually adequate to attenuate the UV light to below exposure limits (Baldwin and Stewart 1989).
While the predominant wavelengths for ultraviolet lamps used in photolithography are 365 nm or above, the quest for smaller features in advanced ICs is leading to the use of exposure sources with smaller wavelengths, such as deep UV and x rays. One new technology for this purpose is the use of krypton-fluoride excimer lasers used in steppers. These steppers use a wavelength of 248 nm with high laser power outputs. However, enclosures for these systems contain the beam during normal operation.
As with other equipment containing high-power laser systems used in semiconductor manufacturing, the main concern is when interlocks for the system must be defeated during beam alignment. High-powered lasers are also one of the most significant electrical hazards in the semiconductor industry. Even after power is off, a significant shock potential exists within the tool. Controls and safety design considerations for these systems are covered by Escher, Weathers and Labonville (1993).
One advanced-technology exposure source used in lithography is x rays. Emission levels from x-ray lithography sources may result in dose rates approaching 50 millisieverts (5 rems) per year in the centre of the equipment. Restricting access to areas inside the shielded wall is recommended to minimize exposure (Rooney and Leavey 1989).
Developing
During the development step the unpolymerized areas of the resist are dissolved and removed. Solvent-based developer is applied to the resist-covered wafer surface by either immersion, spraying or atomization. Developer solutions are identified in table 1. A solvent rinse (n-butyl acetate, isopropyl alcohol, acetone, etc.) is usually applied following the developer to remove any residual material. The resist remaining after developing protect the individual layers during subsequent processing.
Baking
After aligning, exposing and developing the resist, the wafers then move to another temperature-controlled oven with a nitrogen atmosphere. The higher-temperature oven (120 to 135°C) causes the photoresist to cure and fully polymerize on the wafer surface (hard bake).
Photoresist stripping
The developed wafer is then selectively etched using wet or dry chemicals (see “Etching” below). The remaining photoresist must be stripped from the wafer prior to further processing. This is done either by using wet chemical solutions in temperature-controlled baths or through the use of a plasma asher or dry chemical. Table 2 identifies both wet and dry chemical constituents. A discussion of dry chemical plasma etching—using the same equipment and principles of operation as plasma ashing—follows.
Table 2. Photoresist strippers
Wet chemical
Acid
Sulphuric (H2SO4) and chromic (CrO3)
Sulphuric (H2SO4) and ammonium persulphate ((NH4)2S2O8)
Sulphuric (H2SO4) and hydrogen peroxide (H2O2)
Organics
Phenols, sulphuric acids, trichlorobenzene, perchloroethylene
Glycol ethers, ethanolamine, triethanolamine
Sodium hydroxide and silicates (positive resist)
Dry chemical
Plasma ashing (stripping)
RF (radio frequency) power source—13.56 MHz or 2,450 MHz frequency
Oxygen (O2) source gas
Vacuum pump systems
—Oil lubricated with liquid nitrogen trap (old technology)
—Lubricated with inert perfluoropolyether fluids (newer technology)
—Dry pump (newest technology)
Etching
Etching removes layers of silicon dioxide (SiO2), metals and polysilicon, as well as resists, according to the desired patterns delineated by the resist. The two major categories of etching are wet and dry chemical. Wet etching is predominantly used and involves solutions containing the etchants (usually an acid mixture) at the desired strengths, which react with the materials to be removed. Dry etching involves the use of reactive gases under vacuum in a highly energized chamber, which also removes the desired layers not protected by resist.
Wet chemical
The wet chemical etching solutions are housed in temperature-controlled etch baths made of polypropylene (poly-pro), flame-resistant polypropylene (FRPP) or polyvinyl chloride (PVC). The baths generally are equipped with either ring-type plenum exhaust ventilation or slotted exhaust at the rear of the wet chemical etch station. Vertical laminar flow hoods supply uniformly filtered particulate-free air to the top surface of the etch baths. Common wet etchant chemical solutions are presented in table 3, in relation to the surface layer being etched.
Table 3. Wet chemical etchants
Material to etch |
Etchants |
|
Silicon |
||
Polycrystalline silicon (Si) |
Hydrofluoric, nitric, acetic acids and iodine |
|
Silicon dioxide (SiO2) |
Buffered oxide etch (BOE) - Hydrofluoric and |
|
Silicon nitride (Si3N4) |
Phosphoric and hydrofluoric acids |
|
CVD Oxide or Pad Etch |
Ammonium fluoride, acetic and hydrofluoric acids |
|
Metals |
||
Aluminium (Al) |
Phosphoric, nitric, acetic and hydrochloric acids |
|
Chromium-Nickel (Cr/Ni) |
Ceric ammonium nitrate and nitric acid |
|
Gold (Au) |
Hydrochloric and nitric acids (aqua regia) |
|
Silver (Ag) |
Ferric nitrate (FeNO3) and ethylene glycol |
|
Compound |
Formula |
Standard concentration (%) |
Acetic acid |
CH3COOH |
36 |
Ammonium fluoride |
NH4F |
40 |
Glacial acetic acid |
CH3COOH |
99.5 |
Hydrochloric acid |
HCl |
36 |
Hydrofluoric acid |
HF |
49 |
Nitric acid |
HNO3 |
67 |
Phosphoric acid |
H3PO4 |
85 |
Potassium hydroxide |
KOH |
50 or 10 |
Sodium hydroxide |
NaOH |
50 or 10 |
Sulphuric acid |
H2SO4 |
96 |
Vertically mounted flow supply hoods, when used in conjunction with splash shields and exhaust ventilation, can create areas of air turbulence within the wet chemical etch station. As a result, a decrease is possible in the effectiveness of the local exhaust ventilation in capturing and routing fugitive air contaminants from the etch baths in use.
The main concern with wet etching is the possibility of skin contact with the concentrated acids. While all the acids used in etching can cause acid burns, exposure to hydrofluoric acid (HF) is of particular concern. The lag time between skin contact and pain (up to 24 hours for solutions less than 20% HF and 1 to 8 hours for 20 to 50% solutions) can result in delayed treatment and more severe burns than expected (Hathaway et al. 1991).
Historically acid burns have been a particular problem within the industry. However, the incidence of skin contact with acids have been reduced in recent years. Some of this reduction was caused by product-related improvements in the etch process, such as the shift to dry etching, the use of more robotics and the installation of chemical dispense systems. The reduction in the rate of acid burns may also be attributed to better handling techniques, greater use of personal protective equipment, better designed wet decks and better training—all of which require continued attention if the rate is to decline further (Baldwin and Williams 1996).
Dry chemical
Dry chemical etching is an area of growing interest and usage due to its ability to better control the etching process and reduce contamination levels. Dry chemical processing effectively etches desired layers through the use of chemically reactive gases or through physical bombardment.
Chemically reactive plasma etching systems have been developed which can effectively etch silicon, silicon dioxide, silicon nitride, aluminium, tantalum, tantalum compounds, chromium, tungsten, gold and glass. Two kinds of plasma etching reactor systems are in use—the barrel, or cylindrical, and the parallel plate, or planar. Both operate on the same principles and primarily vary in configuration only.
A plasma is similar to a gas except that some of the atoms or molecules of the plasma are ionized and may contain a substantial number of free radicals. The typical reactor consists of a vacuum reactor chamber containing the wafer, usually made of aluminium, glass or quartz; a radio-frequency (RF) energy source—usually at 450 kHz, 13.56 MHz or 40.5 MHz and a control module to control processing time, composition of reactant gas, flow rate of gas and RF power level. In addition, an oil-lubricated (older technology) or dry (newer technology) roughing pump vacuum source is in line with the reactor chamber. Wafers are loaded into the reactor, either individually or in cassettes, a pump evacuates the chamber and the reagent gas (usually carbon tetrafluoride) is introduced. Ionization of the gas forms the etching plasma, which reacts with the wafers to form volatile products which are pumped away. The introduction of fresh reactant gas into the chamber maintains etching activity. Table 4 identifies the materials and plasma gases in use for etching various layers.
Table 4. Plasma etching gases and etched materials
Material |
Gas |
Silicon |
|
Polysilicon (polySi) and Silicon |
CF + O2, CCl4 or CF3Cl, CF4 and HCl |
Silicon dioxide (SiO2) |
C2F6, C3F8, CF4, SiF4, C5F12, CHF3, CCl2F2, SF6, HF |
Silicon nitride (Si3N4) |
CF4 + Ar, CF4 + O2, CF4 + H2 |
Metals |
|
Aluminium (Al) |
CCl4 or BCl3 + He or Ar |
Chromium (Cr) |
CCl4 |
Chromium oxide (CrO3) |
Cl2 + Ar or CCl4 + Ar |
Gallium arsenide (GaAs) |
CCl2F2 |
Vanadium (V) |
CF4 |
Titanium (Ti) |
CF4 |
Tantulum (Ta) |
CF4 |
Molybdenum (Mo) |
CF4 |
Tungsten (W) |
CF4 |
Another method that currently is being developed for etching is microwave downstream. It uses a high-power-density microwave discharge to produce metastable atoms with long lifetimes that etch material almost as if it were immersed in acid.
Physical etching processes are similar to sandblasting in that argon gas atoms are used to physically bombard the layer to be etched. A vacuum pump system is used to remove dislocated material. Reactive ion etching involves a combination of chemical and physical dry etching.
The sputtering process is one of ion impact and energy transfer. Sputter etching incorporates a sputtering system, where the wafer to be etched is attached to a negative electrode or target in a glow-discharge circuit. Material sputters from the wafer by bombardment with positive ions, usually argon, and results in the dislocation of the surface atoms. Power is provided by an RF source at 450 kHz frequency. An in-line vacuum system is used for pressure control and reactant removal.
Ion-beam etching and milling is a gentle etching process which uses a beam of low-energy ions. The ion-beam system consists of a source to generate the ion beam, a work chamber in which the etching or milling occurs, fixturing with a target plate for holding the wafers in the ion beam, a vacuum pump system, supporting electronics and instruments. The ion beam is extracted from an ionized gas (argon or argon/oxygen) or plasma, which is created by the electrical discharge. The discharge is obtained by applying a voltage between an electron-emitting hot-filament cathode and an anode cylinder located in the outer diameter of the discharge region.
Ion-beam milling is done in the low-energy range of ion bombardment, where only surface interactions occur. These ions, usually in the 500 to 1,000 eV range, strike a target and sputter off surface atoms by breaking the forces bonding the atom to its neighbour. Ion-beam etching is done in a slightly higher energy range, which involves a more dramatic dislocation of surface atoms.
Reactive ion etching (RIE) is a combination of physical sputtering and chemical reactive species etching at low pressures. RIE uses ion bombardment to achieve directional etching and also a chemically reactive gas, carbon tetrafluoride (CF4) or carbon tetrachloride (CCl4), to maintain good etched layer selectivity. A wafer is placed in a chamber with an atmosphere of chemically reactive gas compound at a low pressure of about 0.1 torr (1.3 x 10–4 atmosphere). An electrical discharge creates a plasma of reactive “free radicals” (ions) with an energy of a few hundred electron volts. The ions strike the wafer surface vertically, where they react to form volatile species that are removed by a low-pressure in-line vacuum system.
Dry etchers sometimes have a cleaning cycle that is used to remove deposits that accumulate on the inside of the reaction chambers. Parent compounds used for the cleaning cycle plasmas include nitrogen trifluoride (NF3), hexafluoroethane (C2F6) and octafluoropropane (C3F8).
These three gases used in the cleaning process, and many of the gases used in etching, are a cornerstone to an environmental issue facing the semiconductor industry which surfaced in the mid-1990s. Several of the highly fluorinated gases were identified as having significant global warming (or greenhouse effect) potential. (These gases are also referred to as PFCs, perfluorinated compounds.) The long atmospheric lifetime, high global warming potential and significant increased usage of PFCs like NF3, C2F6, C3F8, CF4, trifluoromethane (CHF3) and sulphur hexafluoride (SF6) had the semiconductor industry focus on ways to reduce their emissions.
Atmospheric emissions of PFCs from the semiconductor industry have been due to poor tool efficiency (many tools consumed only 10 to 40% of the gas used) and inadequate air emission abatement equipment. Wet scrubbers are not effective in removing PFCs, and tests on many combustion units found poor destruction efficiencies for some gases, especially CF4. Many of these combustion units broke down C2F6 and C3F8 into CF4. Also, the high cost of ownership for these abatement tools, their power demand, their release of other global warming gases and their combustion by-products of hazardous air pollutants indicated combustion abatement was not a suitable method for controlling PFC emissions.
Making process tools more efficient, identifying and developing more environmentally friendly alternatives to these dry etchant gases and recovery/recycling of the exhaust gases have been the environmental emphases associated with dry etchers.
The major occupational hygiene emphasis for dry etchers has been on potential exposures to maintenance personnel working on the reaction chambers, pumps and other associated equipment that may contain reaction product residues. The complexity of plasma metal etchers and the difficulty in characterizing the odours associated with their maintenance has made them the subject of many investigations.
The reaction products formed in plasma metal etchers are a complex mixture of chlorinated and fluorinated compounds. The maintenance of metal etchers often involves short-duration operations that generate strong odours. Hexachloroethane was found to be the major cause of odour in one type of aluminium etcher (Helb et al. 1983). In another, cyanogen chloride was the main problem: exposure levels were 11 times the 0.3 ppm occupational exposure limit (Baldwin 1985). In still other types of etchers, hydrogen chloride is associated with the odour; maximum exposure measured was 68 ppm (Baldwin, Rubin and Horowitz 1993). For additional information on the subject see Mueller and Kunesh (1989).
The complexity of the chemistries present in metal etcher exhausts has led researchers to develop experimental methods for investigating the toxicity of these mixtures (Bauer et al. 1992a). Application of these methods in rodent studies indicates certain of these chemical mixtures are suspected mutagens (Bauer et al. 1992b) and suspected reproductive toxins (Schmidt et al. 1995).
Because dry etchers operate as closed systems, chemical exposure to the operators of the equipment typically does not occur while the system is closed. One rare exception to this is when the purge cycle for older batch etchers is not long enough to adequately remove the etchant gases. Brief but irritating exposures to fluorine compounds that are below the detection limit for typical industrial hygiene monitoring procedures have been reported when the doors to these etchers are opened. Normally this can be corrected by simply increasing the length of the purge cycle prior to opening the etch chamber door.
The primary concern for operator exposure to RF energy comes during plasma etching and ashing (Cohen 1986; Jones 1988). Typically, the leakage of RF energy can be caused by:
RF exposure can also occur during the maintenance of etchers, particularly if the equipment cabinet has been removed. An exposure of 12.9 mW/cm2 was found at the top of an older model plasma etcher with the cover removed for maintenance (Horowitz 1992). The actual RF radiation leakage in the area where the operator stands was typically less than 4.9 mW/cm2.
Doping
The formation of an electrical junction or boundary between p and n regions in a single crystal silicon wafer is the essential element for the functioning of all semiconductor devices. Junctions permit current to flow in one direction much more easily than in the other. They provide the basis for diode and transistor effects in all semiconductors. In an integrated circuit, a controlled number of elemental impurities or dopants, must be introduced into selected etched regions of the silicon substrate, or wafer. This can be done either by diffusion or ion implantation techniques. Regardless of the technique used, the same types or dopants are used for the production of semiconductor junctions. Table 5 identifies the main components used for doping, their physical state, electrical type (p or n) and the primary junction technique in use—diffusion or ion implantation.
Table 5. Junction formation dopants for diffusion and ion implantation
Element |
Compound |
Formula |
State |
Technique |
n-type |
||||
Antimony |
Antimony trioxide |
Sb2O3 |
Solid |
Diffusion |
Arsenic |
Arsenic trioxide |
As2O3 |
Solid |
Diffusion |
Phosphorus |
Phosphorus pentoxide |
P2O5 |
Solid |
Diffusion |
p-type |
||||
Boron |
Boron nitride |
BN |
Solid |
Diffusion |
Routine chemical exposures to operators of both diffusion furnaces and ion implanters are low—typically less that the detection limit of standard occupational hygiene sampling procedures. Chemical concerns with the process centre on the possibility of toxic gas releases.
As early as the 1970s, progressive semiconductor manufacturers began installing the first continuous gas-monitoring systems for flammable and toxic gases. The main focus of this monitoring was to detect accidental releases of the most toxic dopant gases with odour thresholds above their occupational exposure limits (e.g., arsine and diborane).
Most industrial hygiene air monitors in the semiconductor industry are used for flammable and toxic gas leak detection. However, some facilities are also using continuous monitoring systems to:
The technologies most used in the semiconductor industry for this type of monitoring are colorimetric gas detection (e.g., MDA continuous gas detector), electrochemical sensors (e.g., sensydyne monitors) and Fourier transform infrared (e.g., Telos ACM) (Baldwin and Williams 1996).
Diffusion
Diffusion is a term used to describe the movement of dopants away from regions of high concentration at the source end of the diffusion furnace to regions of lower concentration within the silicon wafer. Diffusion is the most established method of junction formation.
This technique involves subjecting a wafer to a heated atmosphere within the diffusion furnace. The furnace contains the desired dopants in a vapour form and results in creating regions of doped electrical activity, either p or n. The most commonly used dopants are boron for p-type; and phosphorus (P), arsenic (As) or antimony (Sb) for n-type (see table 5).
Typically, wafers are stacked in a quartz carrier or boat and placed in the diffusion furnace. The diffusion furnace contains a long quartz tube and a mechanism for accurate temperature control. Temperature control is extremely important, as the rates of diffusion of the various silicon dopants are primarily a function of temperature. The temperatures in use range from 900 to 1,300 oC, depending on the specific dopant and process.
The heating of the silicon wafer to a high temperature allows the impurity atoms to diffuse slowly through the crystal structure. Impurities move more slowly through silicon dioxide than through the silicon itself, enabling the thin oxide pattern to serve as a mask and thereby permitting the dopant to enter silicon only where it is unprotected. After enough impurities have accumulated, the wafers are removed from the furnace and diffusion effectively ceases.
For maximum control, most diffusions are performed in two steps—predeposition and drive in. The predeposit, or diffusion with constant source, is the first step and takes place in a furnace in which the temperature is selected to achieve the best control of impurity amounts. The temperature determines the solubility of the dopant. After a comparatively short predeposit treatment, the wafer is physically moved to a second furnace, usually at a higher temperature, where a second heat treatment drives in the dopant to the desired depth of diffusion in the silicon wafer lattice.
The dopant sources used in the predeposit step are in three distinct chemical states: gas, liquid and solid. Table 5 identifies the various types of diffusion source dopants and their physical states.
Gases are generally supplied from compressed gas cylinders with pressure controls or regulators, shut-off valves and various purging attachments and are dispensed through small-diameter metal tubing.
Liquids are dispensed normally from bubblers, which saturate a carrier gas stream, usually nitrogen, with the liquid dopant vapours, as is described in the section on wet oxidation. Another form of liquid dispensing is through the use of the spin-on dopant apparatus. This entails putting a solid dopant in solution with a liquid solvent carrier, then dripping the solution on the wafer and spinning, in a manner similar to the application of photoresists.
Solid sources may be in the shape of a boron nitride wafer, which is sandwiched between two silicon wafers to be doped and then placed in a diffusion furnace. Also, the solid dopants, in powder or bead form, may be placed in a quartz bomb enclosure (arsenic trioxide), manually dumped in the source end of a diffusion tube or loaded in a separate source furnace in line with the main diffusion furnace.
In the absence of proper controls, arsenic exposures above 0.01 mg/m3 were reported during the cleaning of a deposition furnace (Wade et al. 1981) and during the cleaning of source housing chambers for solid-source ion implanters (McCarthy 1985; Baldwin, King and Scarpace 1988). These exposures occurred when no precautions were taken to limit the amount of dust in the air. However, when residues were kept wet during cleaning, exposures were reduced to far below the airborne exposure limit.
In the older diffusion technologies safety hazards exist during the removal, cleaning and installation of furnace tubes. The hazards include potential cuts from broken quartz ware and acid burns during the manual cleaning. In newer technologies these hazards are lessened by in situ tube cleaning that eliminates much of the manual handling.
Diffusion furnace operators experience the highest routine cleanroom exposure to extremely low-frequency electromagnetic fields (e.g., 50 to 60 hertz) in semiconductor manufacturing. Average exposures greater than 0.5 microteslas (5 milligauss) were reported during actual operation of the furnaces (Crawford et al. 1993). This study also noted that cleanroom personnel working in the vicinity of diffusion furnaces had average measured exposures that were noticeably higher than those of other cleanroom workers. This finding was consistent with point measurements reported by Rosenthal and Abdollahzadeh (1991), who found that diffusion furnaces produced proximity readings (5 cm or 2 inches away) as high as 10 to 15 microteslas, with the surrounding fields falling off more gradually with distance than other cleanroom equipment studied; even at 6 feet away from diffusion furnaces, the reported flux densities were 1.2 to 2 microteslas (Crawford et al. 1993). These emission levels are well below current health-based exposure limits set by the World Health Organization and those set by individual countries.
Ion implantation
Ion implantation is the newer method of introducing impurities elements at room temperature into silicon wafers for junction formation. Ionized dopant atoms (i.e., atoms stripped of one or more of their electrons) are accelerated to a high energy by passing them through a potential difference of tens of thousands of volts. At the end of their path, they strike the wafer and are embedded at various depths, depending on their mass and energy. As in conventional diffusion, a patterned oxide layer or a photoresist pattern selectively masks the wafer from the ions.
A typical ion implantation system consists of an ion source (gaseous dopant source, usually in small lecture bottles), analysis equipment, accelerator, focusing lens, neutral beam trap, scanner process chamber and a vacuum system (normally three separate sets of in-line roughing and oil-diffusion pumps). The stream of electrons is generated from a hot filament by resistance, an arc discharge or cold cathode electron beam.
Generally, after wafers are implanted, a high temperature annealing step (900 to 1,000°C) is performed by a laser beam anneal or pulsed annealing with an electron-beam source. The annealing process helps repair the damage to the exterior surface of the implanted wafer caused by the bombardment of dopant ions.
With the advent of a safe delivery system for arsine, phosphine and boron trifluoride gas cylinders used in ion implanters, the potential for catastrophic release of these gases has been greatly reduced. These small gas cylinders are filled with a compound to which the arsine, phosphine and boron trifluoride are adsorbed. The gases are pulled out of the cylinders by use of a vacuum.
Ion implanters are one of the most significant electrical hazards in the semiconductor industry. Even after power is off, a significant shock potential exists within the tool and must be dissipated prior to working inside the implanter. A careful review of maintenance operations and the electrical hazards is warranted for all newly installed equipment, but especially for ion implanters.
Exposures to hydrides (probably a mixture of arsine and phosphine) as high as 60 ppb have been found during ion implanter cryo-pump maintenance (Baldwin, Rubin and Horowitz 1993). Also, high concentrations of both arsine and phosphine can off-gas from contaminated implanter parts that are removed during preventive maintenance (Flipp, Hunsaker and Herring 1992).
Portable vacuum cleaners with high-efficiency particulate attenuator (HEPA) filters are used to clean arsenic-contaminated work surfaces in ion implantation areas. Exposures above 1,000 μg/m3 were measured when HEPA vacuums were improperly cleaned. HEPA vacuums, when discharging to the workspace, can also efficiently distribute the distinctive, hydride-like odour associated with ion implanter beam line cleaning (Baldwin, Rubin and Horowitz 1993).
While a concern, there have been no published reports of significant dopant gas exposures during oil changes of vacuum pumps used with dopants—possibly because this is usually done as a closed system. The lack of reported exposure may also be a result of low levels of off-gassing of hydrides from the used oil.
The result of a field study where 700 ml of used roughing pump oil from an ion implanter which used both arsine and phosphine was heated only showed detectable concentrations of airborne hydrides in the pump head space when the pump oil exceeded 70oC (Baldwin, King and Scarpace 1988). Since normal operating temperatures for mechanical roughing pumps are 60 to 80oC, this study did not indicate the potential for a significant exposure.
During ion implantation, x rays are formed incidental to the operation. Most implanters are designed with sufficient cabinet shielding (which includes lead sheeting strategically placed around the ion source housing and adjacent access doors) to maintain employee exposure below 2.5 microsieverts (0.25 millirems) per hour (Maletskos and Hanley 1983). However, an older model of implanters was found to have x-ray leakage above 20 microsieverts per hour (μSv/hr) at the unit’s surface (Baldwin, King and Scarpace 1988). These levels were reduced to less than 2.5 μSv/hr after additional lead shielding was installed. Another older model of ion implanter was found to have x-ray leakage around an access door (up to 15 μSv/hr) and at a viewport (up to 3 μSv/hr). Additional lead shielding was added to attenuate possible exposures (Baldwin, Rubin and Horowitz 1993).
In addition to x-ray exposures from ion implanters, the possibility of neutron formation has been postulated if the implanter is operated above 8 million electron volts (MeV) or deuterium gas is used as an ion source (Rogers 1994). However, typically implanters are designed to operate at well below 8 MeV, and deuterium is not commonly used in the industry (Baldwin and Williams 1996).
Chemical vapour deposition
Chemical vapour deposition (CVD) involves the layering of additional material on the silicon wafer surface. CVD units normally operate as a closed system resulting in little or no chemical exposure to the operators. However, brief hydrogen chloride exposure above 5 ppm can occur when certain CVD prescrubbers are cleaned (Baldwin and Stewart 1989). Two broad categories of deposition are in common use—epitaxial and the more general category of non-epitaxial CVD.
Epitaxial chemical vapour deposition
Epitaxial growth is rigidly controlled deposition of a thin single crystal film of a material which maintains the same crystal structure as the existing substrate wafer layer. It serves as a matrix for fabricating semiconductor components in subsequent diffusion processes. Most epitaxial films are grown on substrates of the same material, such as silicon on silicon, in a process referred to as homoepitaxy. Growing layers of different materials on a substrate, such as silicon on sapphire, is called heteroepitaxy IC device processing.
Three primary techniques are used to grow epitaxial layers: vapour phase, liquid phase and molecular beam. Liquid-phase and molecular-beam epitaxy are primarily used in the processing of III-V (e.g., GaAs) devices. These are discussed in the article “III-V semiconductor manufacturing”.
Vapour-phase epitaxy is used to grow a film by the CVD of molecules at a temperature of 900 to 1,300oC. Vapours containing the silicon and controlled amounts of p- or n-type dopants in a carrier gas (usually hydrogen) are passed over heated wafers to deposit doped layers of silicon. The process is generally performed at atmospheric pressure.
Table 6 identifies the four major types of vapour-phase epitaxy, parameters and the chemical reactions taking place.
Table 6. Major categories of silicon vapour-phase epitaxy
Parameters |
||
Pressure |
Atmospheric |
|
Temperature |
900–1300 °C |
|
Silicon sources |
Silane (SiH4), silicon tetrachloride (SiCl4), trichlorosilane (SiHCl3), |
|
Dopant gases |
Arsine (AsH3), phosphine (PH3), diborane (B2H6) |
|
Dopant gas concentration |
≈100 ppm |
|
Etchant gas |
Hydrogen chloride (HCl) |
|
Etchant gas concentration |
≈1–4% |
|
Carrier gases |
Hydrogen (H2), nitrogen (N2) |
|
Heating source |
Radio frequency (RF) or infrared (IR) |
|
Vapour-phase epitaxy types |
Chemical reactions |
|
Hydrogen reduction of silicon tetrachloride |
SiCl4 + 2H2 → Si + 4HCl |
|
Pyrolytic decomposition of silane |
SiH4 → Si + 2H2 |
|
Hydrogen reduction of trichlorosilane |
SiHCl3 + H2 → Si + 3HCl |
|
Reduction of dichlorosilane |
SiH2Cl2 → Si + 2HCl |
The deposition sequence normally followed in an epitaxial process involves:
Non-epitaxial chemical vapour deposition
Whereas epitaxial growth is a highly specific form of CVD where the deposited layer has the same crystalline structure orientation as the substrate layer, non-epitaxial CVD is the formation of a stable compound on a heated substrate by the thermal reaction or decomposition of gaseous compounds.
CVD can be used to deposit many materials, but in silicon semiconductor processing the materials generally encountered, in addition to epitaxial silicon, are:
Each of these materials may be deposited in a variety of ways, and each has many applications.
Table 7 identifies the three major categories of CVD using operating temperature as a mechanism of differentiation.
Table 7. Major categories of silicon chemical vapour deposition (CVD)
Parameters |
||||
Pressure |
Atmospheric (APCVD) or low pressure (LPCVD) |
|||
Temperature |
500–1,100 °C |
|||
Silicon and nitride sources |
Silane (SiH4), silicon tetrachloride (SiCl4), ammonia (NH3), nitrous oxide (N20) |
|||
Dopant sources |
Arsine (AsH3), phosphine (PH3), diborane (B2H6) |
|||
Carrier gases |
Nitrogen (N2), hydrogen (H2) |
|||
Heating source |
Cold wall system—radio frequency (RF) or infrared (IR) |
|||
CVD type |
Reaction |
Carrier gas |
Temperature |
|
Medium temperature (≈ 600–1,100 °C) |
||||
Silicon nitride (Si3N4) |
3SiH4 + 4 NH3 → Si3N4 + 12H2 |
H2 |
900–1,100 °C |
|
Polysilicon (poly Si) |
SiH4 + Heat → Si + 2H2 |
H2 |
850–1,000 °C |
|
Silicon dioxide (SiO2) |
SiH4 + 4CO2 → SiO2 + 4CO + 2H2O |
N2 |
500–900 °C |
|
Low temperature (≈<600 C) Silox, Pyrox, Vapox and Nitrox** |
||||
Silicon dioxide (SiO2) or p-doped SiO2 |
||||
Silox |
SiH4 + 2O2 + Dopant → SiO2 + 2H2O |
N2 |
200–500 °C |
|
Pyrox |
SiH4 + 2O2 + Dopant → SiO2 + 2H2O |
N2 |
<600 °C |
|
Vapox |
SiH4 + 2O2 + Dopant → SiO2 + 2H2O |
N2 |
<600 °C |
|
Silicon nitride (Si3N4) |
||||
Nitrox |
3SiH4 + 4NH3 (or N2O*) → Si3N4 + 12H2 |
N2 |
600–700 °C |
|
Low temperature plasma enhanced (passivation) (<600°C) |
||||
Utilizing radio-frequency (RF) or |
||||
Silicon dioxide (SiO2) |
SiH4 + 2O2 → SiO2 + 2H20 |
|||
Silicon nitride (Si3N4) |
3SiH4 + 4NH3 (or N2O*) → Si3N4 + 12H2 |
* Note: Reactions are not stoichiometrically balanced.
**Generic, proprietary or trademark names for CVD reactor systems
The following components are found in nearly all the types of CVD equipment:
Basically, the CVD process entails supplying controlled amounts of silicon or nitride source gases, in conjunction with nitrogen and/or hydrogen carrier gases, and a dopant gas if desired, for chemical reaction within the reactor chamber. Heat is applied to provide the necessary energy for the chemical reaction in addition to controlling the surface temperatures of the reactor and wafers. After the reaction is complete, the unreacted source gas plus the carrier gas are exhausted through the effluent handling system and vented to the atmosphere.
Passivation is a functional type of CVD. It involves the growth of a protective oxide layer on the surface of the silicon wafer, generally as the last fabrication step prior to non-fabrication processing. The layer provides electrical stability by isolating the integrated circuit’s surface from electrical and chemical conditions in the environment.
Metallization
After the devices have been fabricated in the silicon substrate, they must be connected together to perform circuit functions. This process is known as metallization. Metallization provides a means of wiring or interconnecting the uppermost layers of integrated circuits by depositing complex patterns of conductive materials, which route electrical energy within the circuits.
The broad process of metallization is differentiated according to the size and thickness of the layers of metals and other materials being deposited. These are:
The most common metals used for silicon semiconductor metallization are: aluminium, nickel, chromium or an alloy called nichrome, gold, germanium, copper, silver, titanium, tungsten, platinum and tantalum.
Thin or thick films may also be evaporated or deposited on various ceramic or glass substrates. Some examples of these substrates are: alumina (96% Al203), beryllia (99% BeO), borosilicate glass, pyroceram and quartz (SiO2).
Thin film
Thin film metallization is often applied through the use of a high-vacuum or partial-vacuum deposition or evaporation technique. The major types of high-vacuum evaporation are electron beam, flash and resistive, while partial-vacuum deposition is primarily done by sputtering.
To perform any type of thin film vacuum metallization, a system usually consists of the following basic components:
Electron-beam evaporation, frequently called E beam, uses a focused beamof electrons to heat the metallization material. A high-intensity beam of electrons is generated in a manner similar to that used in a television picture tube. A stream of electrons is accelerated through an electrical field of typically 5 to 10 kV and focused on the material to be evaporated. The focused beam of electrons melts the material contained in a water-cooled block with a large depression called a hearth. The melted material then vaporizes within the vacuum chamber and condenses on the cool wafers as well as on the entire chamber surface. Then standard photoresist, exposure, development and wet or dry etch operations are performed to delineate the intricate metallized circuitry.
Flash evaporation is another technique for the deposition of thin metallized films. This method is primarily used when a mixture of two materials (alloys) are to be simultaneously evaporated. Some examples of two component films are: nickel/chromium (Nichrome), chromium/silicon monoxide (SiO) and aluminium/silicon.
In flash evaporation, a ceramic bar is heated by thermal resistance and a continuously fed spool of wire, stream of pellets or vibrationally dispensed powder is brought in contact with the hot filament or bar. The vaporized metals then coat the interior chamber and wafer surfaces.
Resistive evaporation (also known as filament evaporation) is the simplest and least expensive form of deposition. The evaporation is accomplished by gradually increasing the current flowing through the filament to first melt the loops of material to be evaporated, thereby wetting the filament. Once the filament is wetted, the current through the filament is increased until evaporation occurs. The primary advantage of resistive evaporation is the wide variety of materials that can be evaporated.
Maintenance work is sometimes done on the inside surface of E-beam evaporator deposition chambers called bell jars. When the maintenance technicians have their heads inside the bell jars, significant exposures can occur. Removing the metal residues that deposit on the inside surface of bell jars may result in such exposures. For example, technician exposures far above the airborne exposure limit for silver were measured during residue removal from an evaporator used to deposit silver (Baldwin and Stewart 1989).
Cleaning bell jar residues with organic cleaning solvents can also result in high solvent exposure. Technician exposures to methanol above 250 ppm have occurred during this type of cleaning. This exposure can be eliminated by using water as the cleaning solvent instead of methanol (Baldwin and Stewart 1989).
The sputtering deposition process takes place in a low-pressure or partial-vacuum gas atmosphere, using either direct electric current (DC, or cathode sputtering) or RF voltages as a high-energy source. In sputtering, ions of argon inert gas are introduced into a vacuum chamber after a satisfactory vacuum level has been reached through the use of a roughing pump. An electric field is formed by applying a high voltage, typically 5,000 V, between two oppositely charged plates. This high-energy discharge ionizes the argon gas atoms and causes them to move and accelerate to one of the plates in the chamber called the target. When the argon ions strike the target made of the material to be deposited, they dislodge, or sputter, these atoms or molecules. The dislodged atoms of the metallization material are then deposited in a thin film on the silicon substrates which face the target.
RF leakage from the sides and backs on many older sputter units was found to exceed the occupational exposure limit (Baldwin and Stewart 1989). Most of the leakage was attributable to cracks in the cabinets caused by repeated removal of the maintenance panels. In newer models by the same manufacturer, panels with wire mesh along the seams prevent significant leakage. The older sputterers can be retrofitted with wire mesh or, alternatively, copper tape can be used to cover the seams to reduce the leakage.
Thick film
The structure and dimension of most thick films are not compatible with the metallization of silicon integrated circuits, primarily due to size constraints. Thick films are used mostly for metallization of hybrid electronic structures, such as in the manufacture of LCDs.
The silk-screening process is the dominant method of thick film application. Thick film materials typically used are palladium, silver, titanium dioxide and glass, gold-platinum and glass, gold-glass and silver-glass.
Resistive thick films are normally deposited and patterned on a ceramic substrate using silk-screening techniques. Cermet is a form of resistive thick film composed of a suspension of conductive metal particles in a ceramic matrix with an organic resin as filler. Typical cermet structures are composed of chromium, silver or lead oxide in a silicon monoxide or dioxide matrix.
Plating
Two basic types of plating techniques are used in forming metallic films on semiconductor substrates: electroplating and electroless plating.
In electroplating, the substrate to be plated is placed at the cathode, or negatively charged terminal, of the plating tank and immersed in an electrolytic solution. An electrode made of the metal to be plated serves as the anode, or positively charged terminal. When a direct current is passed through the solution, the positively charged metal ions, which dissolve into the solution from the anode, migrate and plate on the cathode (substrate). This method of plating is used for forming conductive films of gold or copper.
In electroless plating, the simultaneous reduction and oxidation of the metal to be plated is used in forming a free metal atom or molecule. Since this method does not require electrical conduction during the plating process, it can be used with insulating-type substrates. Nickel, copper and gold are the most common metals deposited in this manner.
Alloying/annealing
After the metallized interconnections have been deposited and etched, a final step of alloying and annealing may be performed. The alloying consists of placing the metallized substrates, usually with aluminium, in a low-temperature diffusion furnace to assure a low-resistance contact between the aluminium metal and silicon substrate. Finally, either during the alloy step or directly following it, the wafers are often exposed to a gas mixture containing hydrogen in a diffusion furnace at 400 to 500°C. The annealing step is designed to optimize and stabilize the characteristics of the device by combining the hydrogen with uncommitted atoms at or near the silicon-silicon dioxide interface.
Backlapping and backside metallization
There is also an optional metallization processing step called backlapping. The backside of the wafer may be lapped or ground down using a wet abrasive solution and pressure. A metal such as gold may be deposited on the back side of the wafer by sputtering. This makes attachment of the separated die to the package easier in the final assembly.
Assembly and testing
Non-fabrication processing, which includes external packaging, attachments, encapsulation, assembly and testing, is normally performed in separate production facilities and many times is done in Southeast Asian countries, where these labour-intensive jobs are less expensive to perform. In addition, ventilation requirements for process and particulate control are generally different (non-cleanroom) in the non-fabrication processing areas. These final steps in the manufacturing process involve operations that include soldering, degreasing, testing with chemicals and radiation sources, and trimming and marking with lasers.
Soldering during semiconductor manufacturing normally does not result in high lead exposures. To prevent thermal damage to the integrated circuit, the solder temperature is kept below the temperature where significant molten lead fume formation can occur (430°C). However, cleaning solder equipment by scraping or brushing of the lead-containing residues can result in lead exposures above 50 μg/m3 (Baldwin and Stewart 1989). Also, lead exposures of 200 μg/m3 have occurred when improper dross removal techniques are used during wave solder operations (Baldwin and Williams 1996).
One growing concern with solder operations is respiratory irritation and asthma due to exposure to the pyrolysis products of the solder fluxes, particularly during hand soldering or touch-up operations, where historically local exhaust ventilation has not been commonly used (unlike wave solder operations, which for the last few decades have typically been enclosed in exhausted cabinets) (Goh and Ng 1987). See the article “Printed circuit board and computer assembly” for more details.
Since colophony in the solder flux is a sensitizer, all exposures should be reduced to as low as possible, regardless of air sampling results. New soldering installations particularly should include local exhaust ventilation when soldering is to be performed for extended periods of time (e.g., greater than 2 hours).
Fumes from hand soldering will rise vertically on thermal currents, entering the employee’s breathing zone as the person leans over the point of soldering. Control usually is achieved by means of effective high velocity and low volume local exhaust ventilation at the solder tip.
Devices that return filtered air to the workplace may, if the filtration efficiency is inadequate, cause secondary pollution which can affect people in the workroom other than those soldering. Filtered air should not be returned to the workroom unless the amount of soldering is small and the room has good general dilution ventilation.
Wafer sort and test
After wafer fabrication is completed, each intrinsically finished wafer undergoes a wafer sort process where integrated circuitry on each specific die is electrically tested with computer-controlled probes. An individual wafer may contain from one hundred to many hundreds of separate dies or chips which must be tested. After the test results are finished, the dies are physically marked with an automatically dispensed one-component epoxy resin. Red and blue are used to identify and sort dies which do not meet the desired electrical specifications.
Die separation
With the devices or circuits on the wafer tested, marked and sorted, the individual dies on the wafer must be physically separated. A number of methods have been designed for separating the individual dies—diamond scribing, laser scribing and diamond wheel sawing.
Diamond scribing is the oldest method in use and involves drawing a precisely shaped diamond-imbedded tip across the wafer along the scribe line or “street” separating the individual dies on the wafer surface. The imperfection in the crystal structure caused by scribing allows the wafer to be bent and fractured along this line.
Laser scribing is a relatively recent die separation technique. A laser beam is generated by a pulsed, high-powered neodymium-yttrium laser. The beam generates a groove in the silicon wafer along the scribe lines. The groove serves as the line along which the wafer breaks.
A widely used method of die separation is wet sawing—cutting substrates along the street with a high-speed circular diamond saw. Sawing can either partially cut (scribe) or completely cut (dice) through the silicon substrate. A wet slurry of material removed from the street is generated by sawing.
Die attach and bonding
The individual die or chip must be attached to a carrier package and metal lead-frame. Carriers are typically made of an insulating material, either ceramic or plastic. Ceramic carrier materials are usually made of alumina (Al2O3), but can possibly consist of beryllia (BeO) or steatite (MgO-SiO2). Plastic carrier materials are either of the thermoplastic or thermosetting resin type.
The attachment of the individual die is generally accomplished by one of three distinct types of attachment: eutectic, preform and epoxy. Eutectic die attachment involves using an eutectic brazing alloy, such as gold-silicon. In this method, a layer of gold metal is predeposited on the backside of the die. By heating the package above the eutectic temperature (370°C for gold-silicon) and placing the die on it, a bond is formed between the die and package.
Preform bonding involves the use of a small piece of special composition material that will adhere to both the die and the package. A preform is placed on the die-attach area of a package and allowed to melt. The die is then scrubbed across the region until the die is attached, and then the package is cooled.
Epoxy bonding involves the use of an epoxy glue to attach the die to the package. A drop of epoxy is dispensed on the package and the die placed on top of it. The package may need to be baked at an elevated temperature to cure the epoxy properly.
Once the die is physically attached to the package, electrical connections must be provided between the integrated circuit and package leads. This is accomplished by using either thermocompression, ultrasonic or thermosonic bonding techniques to attach gold or aluminium wires between the contact areas on the silicon chip and the package leads.
Thermocompression bonding is often used with gold wire and involves heating the package to approximately 300oC and forming the bond between the wire and bonding pads using both heat and pressure. Two major types of thermocompression bonding are in use—ball bonding and wedge bonding. Ball bonding, which is used only with gold wire, feeds the wire through a capillary tube, compresses it, and then a hydrogen flame melts the wire. In addition, this forms a new ball on the end of the wire for the next bonding cycle. Wedge bonding involves a wedge-shaped bonding tool and a microscope used for positioning the silicon chip and package accurately over the bonding pad. The process is performed in an inert atmosphere.
Ultrasonic bonding uses a pulse of ultrasonic, high-frequency energy to provide a scrubbing action that forms a bond between the wire and the bonding pad. Ultrasonic bonding is primarily used with aluminium wire and is often preferred to thermocompression bonding, since it does not require the circuit chip to be heated during the bonding operation.
Thermosonic bonding is a recent technological change in gold wire bonding. It involves the use of a combination of ultrasonic and heat energies and requires less heat than thermocompression bonding.
Encapsulation
The primary purpose of encapsulation is to put an integrated circuit into a package which meets the electrical, thermal, chemical and physical requirements associated with the application of the integrated circuit.
The most widely used package types are the radial-lead type, the flat pack and the dual-in-line (DIP) package. The radial-lead type of packages are mostly made of Kovar, an alloy of iron, nickel and cobalt, with hard glass seals and Kovar leads. Flat packs use metal-lead frames, usually made of an aluminium alloy combined with ceramic, glass and metal components. Dual-in-line packages are generally the most common and often use ceramic or moulded plastics.
Moulded plastic semiconductor packages are primarily produced by two separate processes—transfer moulding and injection moulding. Transfer moulding is the predominant plastic encapsulation method. In this method, the chips are mounted on untrimmed lead frames and then batch loaded into moulds. Powdered or pellet forms of thermosetting plastic moulding compounds are melted in a heated pot and then forced (transferred) under pressure into the loaded moulds. The powdered or pellet form plastic moulding compound systems can be used on epoxy, silicone or silicone/epoxy resins. The system usually consists of a mixture of:
Injection moulding uses either a thermoplastic or thermosetting moulding compound which is heated to its melting point in a cylinder at a controlled temperature and forced under pressure through a nozzle into the mould. The resin solidifies rapidly, the mould is opened and the encapsulation package ejected. A wide variety of plastic compounds are used in injection moulding, with epoxy and polyphenylene sulphide (PPS) resins being the newest entries in semiconductor encapsulating.
The final packaging of the silicon semiconductor device is classified according to its resistance to leakage or ability to isolate the integrated circuit from its environment. These are differentiated as being hermetically (airtight) or non-hermetically sealed.
Leak testing and burn in
Leak testing is a procedure developed to test the actual sealing ability or hermetism of the packaged device. Two common forms of leak testing are in use: helium leak detection and radioactive tracer leak detection.
In helium leak detection, the completed packages are placed in an atmosphere of helium pressure for a period of time. Helium is able to penetrate through imperfections into the package. After removal from the helium pressurization chamber, the package is transferred to a mass-spectrometer chamber and tested for helium leaking out of imperfections in the package.
Radioactive tracer gas, usually krypton-85 (Kr-85), is substituted for helium in the second method, and the radioactive gas leaking out of the package is measured. Under normal conditions, personnel exposure from this process is less than 5 millisieverts (500 millirems) per year (Baldwin and Stewart 1989). Controls for these systems usually include:
Also, materials that come in contact with Kr-85 (e.g., exposed ICs, used pump oil, valves and O-rings) are surveyed to ensure they do not emit excessive levels of radiation because of residual gas in them before they are removed from the controlled area. Leach-Marshal (1991) provides detailed information on exposures and controls from Kr-85 fine-leak detection systems.
Burn in is a temperature and electrical stressing operation to determine the reliability of the final packaged device. Devices are placed in a temperature-controlled oven for an extended period of time using either ambient atmosphere or an inert atmosphere of nitrogen. Temperatures range from 125°C to 200°C (150°C is an average), and time periods from a few hours to 1,000 hours (48 hours is an average).
Final test
For a final characterization of the packaged silicon semiconductor device’s performance, a final electrical test is performed. Because of the large number and the complexity of the tests required, a computer performs and evaluates the testing of numerous parameters important to the eventual functioning of the device.
Mark and pack
Physical identification of the final packaged device is accomplished by the use of a variety of marking systems. The two major categories of component marking are contact and non-contact printing. Contact printing typically incorporates a rotary offset technique using solvent-based inks. Non-contact printing, which transfers markings without physical contact, involves ink-jet head or toner printing using solvent-based inks or laser marking.
The solvents used as a carrier for the printing inks and as a pre-cleaner are typically composed of a mixture of alcohols (ethanol) and esters (ethyl acetate). Most of the component marking systems, other than laser marking, use inks which require an additional step for setting, or curing. These curing methods are air curing, heat curing (thermal or infrared) and ultraviolet curing. Ultraviolet-curing inks contain no solvents.
Laser marking systems utilize either a high-powered carbon dioxide (CO2) laser, or a high-powered neodymium:yttrium laser. These lasers are typically embedded in the equipment and have interlocked cabinets that enclose the beam path and the point where the beam contacts the target. This eliminates the laser beam hazard during normal operations, but there is a concern when the safety interlocks are defeated. The most common operation where it is necessary to remove the beam enclosures and defeat the interlocks is alignment of the laser beam.
During these maintenance operations, ideally the room containing the laser should be evacuated, except for necessary maintenance technicians, with the doors to the room locked and posted with appropriate laser safety signs. However, high-powered lasers used in semiconductor manufacturing are often located in large, open manufacturing areas, making it impractical to relocate non-maintenance personnel during maintenance. For these situations, a temporary control area is typically established. Normally these control areas consist of laser curtains or welding screens capable of withstanding direct contact with the laser beam. Entrance to the temporary control area is usually through a maze entry that is posted with a warning sign whenever the interlocks for the laser are defeated. Other safety precautions during beam alignment are similar to those required for the operation of an open-beamed high-powered laser (e.g., training, eye protection, written procedures and so on).
High-powered lasers are also one of the most significant electrical hazards in the semiconductor industry. Even after power is off, a significant shock potential exists within the tool and must be dissipated prior to working inside the cabinet.
Along with the beam hazard and electrical hazard, care should also be taken in performing maintenance on laser marking systems because of the potential for chemical contamination from the fire retardant antimony trioxide and beryllium (ceramic packages containing this compound will be labelled). Fumes can be created during the marking with the high-powered lasers and create residues on the equipment surfaces and fume extraction filters.
Degreasers have been used in the past to clean semiconductors before they are marked with identification codes. Solvent exposure above the applicable occupational airborne exposure limit can easily occur if an operator’s head is placed below the cooling coils that cause the vapours to recondense, as can happen when an operator attempts to retrieve dropped parts or when a technician cleans residue from the bottom of the unit (Baldwin and Stewart 1989). The use of degreasers has been greatly reduced in the semiconductor industry due to restrictions on the use of ozone-depleting substances such as chlorofluorocarbons and chlorinated solvents.
Failure analysis and quality assurance
Failure analysis and quality analysis laboratories typically perform various operations used to ensure the reliability of the devices. Some of the operations performed in these laboratories present the potential for employee exposure. These include:
Cobalt-60 (up to 26,000 curies) is used in irradiators for testing the ability of ICs to withstand exposure to gamma radiation in military and space applications. Under normal conditions, personnel exposures from this operation are less than 5 millisieverts (500 millirems) per year (Baldwin and Stewart 1989). Controls for this somewhat specialized operation are similar to those utilized for Kr-85 fine-leak systems (e.g., isolated room, continuous radiation monitors, personnel exposure monitoring and so on).
Small “specific licence” alpha sources (e.g., micro- and millicuries of Americium-241) are used in the failure analysis process. These sources are covered by a thin protective coating called a window that allows alpha particles to be emitted from the source to test the integrated circuit’s ability to operate when bombarded by alpha particles. Typically the sources are periodically checked (e.g., semi-annually) for leakage of radioactive material that can occur if the protective window is damaged. Any detectable leakage usually triggers removal of the source and its shipment back to the manufacturer.
Cabinet x-ray systems are used to check the thickness of metal coatings and to identify defects (e.g., air bubbles in mould compound packages). While not a significant source of leakage, these units are typically checked on a periodic basis (e.g., annually) with a hand-held survey meter for x-ray leakage and inspected to ensure that door interlocks operate properly.
Shipping
Shipping is the endpoint of most silicon semiconductor device manufacturers’ involvement. Merchant semiconductor manufacturers sell their product to other end-product producers, while captive manufacturers use the devices for their own end products.
Health Study
Each process step uses a particular set of chemistries and tools that result in specific EHS concerns. In addition to concerns associated with specific process steps in silicon semiconductor device processing, an epidemiological study investigated health effects among employees of the semiconductor industry (Schenker et al. 1992). See also the discussion in the article “Health effects and disease patterns”.
The main conclusion of the study was that work in semiconductor fabrication facilities is associated with an increased rate of spontaneous abortion (SAB). In the historical component of the study, the number of pregnancies studied in fabrication and nonfabrication employees were approximately equal (447 and 444 respectively), but there were more spontaneous abortions in fabrication (n=67) than non-fabrication (n=46). When adjusted for various factors that could cause bias (age, ethnicity, smoking, stress, socio-economic status and pregnancy history) the relative risk (RR) for fabrication verses non-fabrication was 1.43 (95% confidence interval=0.95-2.09).
The researchers linked the increased SAB rate with exposure to certain ethylene-based glycol ethers (EGE) used in semiconductor manufacturing. The specific glycol ethers that were involved in the study and are suspected of causing adverse reproductive effects are:
While not part of the study, two other glycol ethers used in the industry, 2-ethoxyethanol (CAS 110-80-5) and diethylene glycol dimethyl ether (CAS 111-96-6) have similar toxic effects and have been banned by some semiconductor manufacturers.
In addition to an increased SAB rate associated with exposure to certain glycol ethers, the study also concluded:
Equipment Review
The complexity of semiconductor manufacturing equipment, coupled with continuous advancements in the manufacturing processes, makes the pre-installation review of new process equipment important for minimizing EHS risks. Two equipment review processes help ensure that new semiconductor process equipment will have appropriate EHS controls: CE marking and Semiconductor Equipment and Materials International (SEMI) standards.
CE marking is a manufacturer’s declaration that the equipment so marked conforms to the requirements of all applicable Directives of the European Union (EU). For semiconductor manufacturing equipment, the Machinery Directive (MD), Electromagnetic Compatibility (EMC) Directive and Low Voltage Directive (LVD) are considered those directives most applicable.
In the case of the EMC Directive, the services of a competent body (organization officially authorized by an EU member state) need to be retained to define testing requirements and approve findings of the examination. The MD and LVD may be assessed by either the manufacturer or a notified body (organization officially authorized by an EU member state). Regardless of the path chosen (self assessment or third party) it is the importer of record who is responsible for the imported product being CE marked. They may use the third party or self assessment information as the basis for their belief that the equipment meets the requirements for the applicable directives, but, ultimately, they will prepare the declaration of conformity and affix the CE marking themselves.
Semiconductor Equipment and Materials International is an international trade association that represents semiconductor and flat panel display equipment and materials suppliers. Among its activities is the development of voluntary technical standards that are agreements between suppliers and customers aimed at improving product quality and reliability at a reasonable price and steady supply.
Two SEMI standards that specifically apply to EHS concerns for new equipment are SEMI S2 and SEMI S8. SEMI S2-93, Safety Guidelines for Semiconductor Manufacturing Equipment, is intended as a minimum set of performance-based EHS considerations for equipment used in semiconductor manufacturing. SEMI S8-95, Supplier Ergonomic Success Criteria User’s Guide, expands on the ergonomics section in SEMI S2.
Many semiconductor manufacturers require that new equipment be certified by a third party as meeting the requirements of SEMI S2. Guidelines for interpreting SEMI S2-93 and SEMI S8-95 are contained in a publication by the industry consortium SEMATECH (SEMATECH 1996). Additional information on SEMI is available on the worldwide web (http://www.semi.org).
Chemical Handling
Liquid dispensing
With automated chemical-dispensing systems becoming the rule, not the exception, the number of chemical burns to employees has decreased. However, proper safeguards need to be installed in these automated chemical-dispensing systems. These include:
Gas dispensing
Gas distribution safety has improved significantly over the years with the advent of new types of cylinder valves, restricted flow orifices incorporated into the cylinder, automated gas purge panels, high flow rate detection and shut-off and more sophisticated leak detection equipment. Because of its pyrophoric property and its wide use as a feed stock, silane gas represents the most significant explosion hazard within the industry. However, silane gas incidents have become more predictable with new research conducted by Factory Mutual and SEMATECH. With proper reduced-flow orifices (RFOs), delivery pressures and ventilation rates, most explosive incidents have been eliminated (SEMATECH 1995).
Several safety incidents have occurred in recent years due to an uncontrolled mixing of incompatible gases. Because of these incidents, semiconductor manufacturers often review gas line installations and tool gas boxes to ensure that improper mixing and/or back flow of gases cannot occur.
Chemical issues typically generate the greatest concerns in semiconductor manufacturing. However, most injuries and deaths within the industry result from non-chemical hazards.
Electrical Safety
There are numerous electrical hazards associated with equipment used in this industry. Safety interlocks play an important role in electrical safety, but these interlocks are often overridden by maintenance technicians. A significant amount of maintenance work is typically performed while equipment is still energized or only partially de-energized. The most significant electrical hazards are associated with ion implanters and laser power supplies. Even after power is off, a significant shock potential exists within the tool and must be dissipated prior to working inside the tool. The SEMI S2 review process in the United States and the CE mark in Europe have helped improve electrical safety for new equipment, but maintenance operations are not always adequately considered. A careful review of maintenance operations and the electrical hazards is needed for all newly installed equipment.
Second on the electrical hazard list is the set of equipment that generates RF energy during etching, sputtering and chamber cleaning processes. Proper shielding and grounding are needed to minimize the risk of RF burns.
These electrical hazards and the many tools not being powered down during maintenance operations require the maintenance technicians to employ other means to protect themselves, such as lockout/tagout procedures. Electrical hazards are not the only energy sources which are addressed with lockout/tagout. Other energy sources include pressurized lines, many containing hazardous gas or liquids, and pneumatic controls. Disconnections for controlling these energy sources need to be in a readily available location—within the fab (fabrication) or chase area where the employee will be working, rather than in inconvenient locations such as subfabs.
Ergonomics
The interface between the employee and the tool continues to cause injuries. Muscle strain and sprains are fairly common within the semiconductor industry, especially with the maintenance technician. The access to pumps, chamber covers and so on often is not well designed during manufacturing of the tool and during the placement of the tool in the fab. Pumps should be on wheels or placed in pull-out drawers or trays. Lifting devices need to be incorporated for many operations.
Simple wafer handling causes ergonomic hazards, especially in older facilities. Newer facilities typically have larger wafers and thus require more automated handling systems. Many of these wafer-handling systems are considered robotic devices, and the safety concerns with these systems must be accounted for when they are designed and installed (ANSI 1986).
Fire Safety
In addition to silane gas, which has already been addressed, hydrogen gas has the potential for being a significant fire hazard. However, it is better understood and the industry has not seen many major issues associated with hydrogen.
The most serious fire hazard now is associated with wet decks or etching baths. The typical plastic materials of construction (polyvinyl chloride, polypropylene and flame-resistant polypropylene) all have been involved in fab fires. The ignition source may be an etch or plating bath heater, the electrical controls mounted directly to the plastic or an adjacent tool. If a fire occurs with one of these plastic tools, particle contamination and corrosive combustion products spread throughout the fab. The economic loss is high due to the down time in the fab while the area and equipment are brought back to cleanroom standards. Often some expensive equipment cannot be adequately decontaminated, and new equipment must be purchased. Therefore, adequate fire prevention and fire protection are both critical.
Fire prevention can be addressed with different non-combustible building materials. Stainless steel is the preferred material of construction for these wet decks, but often the process will not “accept” a metal tool. Plastics with less fire/smoke potential exist, but have not yet been adequately tested to determine if they will be compatible with semiconductor manufacturing processes.
For fire protection, these tools must be protected by unobstructed sprinkler protection. The placement of HEPA filters above wet benches often blocks sprinkler heads. If this occurs, additional sprinkler heads are installed below the filters. Many companies also require that a fire detection and suppression system be installed inside the plenum cavities on these tools, where many fires start.
Liquid crystal displays (LCDs) have been commercially available since the 1970s. They are commonly used in watches, calculators, radios and other products requiring indicators and three or four alphanumeric characters. Recent improvements in the liquid crystal materials allow large displays to be manufactured. While LCDs are only a small portion of the semiconductor industry, their importance has grown with their use in flat-panel displays for portable computers, very light laptop computers and dedicated word processors. The importance of LCDs is expected to continue to grow as they eventually replace the last vacuum tube commonly used in electronics—the cathode ray tube (CRT) (O’Mara 1993).
The manufacture of LCDs is a very specialized process. Industrial hygiene monitoring results indicate very low airborne contaminant levels for the various solvent exposures monitored (Wade et al. 1981). In general, the types and quantities of toxic, corrosive and flammable solid, liquid and gaseous chemicals and hazardous physical agents in use are limited in comparison with other types of semiconductor manufacturing.
Liquid crystal materials are rod-like molecules exemplified by the cyanobiphenyl molecules shown in figure 1. These molecules possess the property of rotating the direction of polarized light passing through. Although the molecules are transparent to visible light, a container of the liquid material appears milky or translucent instead of transparent. This occurs because the long axis of the molecules are aligned at random angles, so the light is scattered randomly. A liquid crystal display cell is arranged so that the molecules follow a specific alignment. This alignment can be changed with an external electric field, allowing the polarization of incoming light to be changed.
Figure 1. Basic liquid crystal polymer molecules
In the manufacture of flat panel displays, two glass substrates are processed separately, then joined together. The front substrate is patterned to create a colour filter array. The rear glass substrate is patterned to form thin film transistors and the metal interconnect lines. These two plates are mated in the assembly process and, if necessary, sliced and separated into individual displays. Liquid crystal material is injected into a gap between the two glass plates. The displays are inspected and tested and a polarizer film is applied to each glass plate.
Numerous individual processes are required to manufacture flat panel displays. They require specialized equipment, materials and processes. Certain key processes are outlined below.
Glass Substrate Preparation
The glass substrate is an essential and expensive component of the display. Very tight control of the optical and mechanical properties of the material is required at every stage of the process, especially when heating is involved.
Glass fabrication
Two processes are used to make very thin glass with very precise dimensions and reproducible mechanical properties. The fusion process, developed by Corning, utilizes a glass feed rod that melts in a wedge-shaped trough and flows up and over the sides of the trough. Flowing down both sides of the trough, the molten glass joins into a single sheet at the bottom of the trough and can be drawn downward as a uniform sheet. The thickness of the sheet is controlled by the speed of drawing down the glass. Widths of up to almost 1 m can be obtained.
Other manufacturers of glass with the appropriate dimensions for LCD substrates use the float method of manufacturing. In this method, the molten glass is allowed to flow out onto a bed of molten tin. The glass does not dissolve or react with the metallic tin, but floats on the surface. This allows gravity to smooth the surface and allow both sides to become parallel. (See the chapter Glass, ceramics and related materials.)
A variety of substrate sizes are available extending to 450 × 550 mm and larger. Typical glass thickness for flat panel displays is 1.1 mm. Thinner glass is used for some smaller displays, such as pagers, telephones, games and so on.
Cutting, bevelling and polishing
Glass substrates are trimmed to size after the fusion or float process, typically to about 1 m on a side. Various mechanical operations follow the forming process, depending on the ultimate application of the material.
Since glass is brittle and easily chipped or cracked at the edges, these are typically bevelled, chamfered or otherwise treated to reduce chipping during handling. Thermal stresses at edge cracks accumulate during substrate processing and lead to breakage. Glass breakage is a significant problem during production. Besides the possibility of employee cuts and lacerations, it represents a yield loss, and glass fragments might remain in equipment, causing particulate contamination or scratching of other substrates.
Increased substrate size results in increased difficulties for glass polishing. Large substrates are mounted to carriers using wax or other adhesive and polished using a slurry of abrasive material. This polishing process must be followed by a thorough chemical cleaning to remove any remaining wax or other organic residue, as well as the metallic contaminants contained in the abrasive or polishing medium.
Cleaning
Cleaning processes are used for bare glass substrates and for substrates covered with organic films, such as colour filters, polyimide orientation films and so on. Also, substrates with semiconductor, insulator and metal films require cleaning at certain points within the fabrication process. As a minimum, cleaning is required prior to each masking step in colour filter or thin film transistor fabrication.
Most flat panel cleaning employs a combination of physical and chemical methods, with selective use of dry methods. After chemical etching or cleaning, substrates are usually dried using isopropyl alcohol. (See table 1.)
Table 1. Cleaning of flat panel displays
Physical cleaning |
Dry cleaning |
Chemical cleaning |
Brush scrubbing |
Ultraviolet ozone |
Organic solvent* |
Jet spray |
Plasma (oxide) |
Neutral detergent |
Ultrasonic |
Plasma (non-oxide) |
|
Megasonic |
Laser |
Pure water |
* Common organic solvents used in the chemical cleaning include: acetone, methanol, ethanol, n-propanol, xylene isomers, trichloroethylene, tetrachloroethylene.
Colour Filter Formation
Colour filter formation on the front glass substrate includes some of the glass finishing and preparation steps common to both the front and rear panels, including the bevelling and lapping processes. Operations such as patterning, coating and curing are performed repeatedly on the substrate. Many points of similarity with silicon wafer processing exist. Glass substrates are normally handled in track systems for cleaning and coating.
Colour filter patterning
Various materials and application methods are used to create colour filters for various flat panel display types. Either a dyestuff or a pigment can be used, and either one can be deposited and patterned in several ways. In one approach, gelatin is deposited and dyed in successive photolithographic operations, using proximity printing equipment and standard photoresists. In another, pigments dispersed in photoresist are employed. Other methods for forming colour filters include electrodeposition, etching and printing.
ITO Deposition
After colour filter formation, the final step is the sputter deposition of a transparent electrode material. This is indium-tin oxide (ITO), which is actually a mixture of the oxides In2O3 and SnO2. This material is the only one suitable for the transparent conductor application for LCDs. A thin ITO film is required on both sides of the display. Typically, ITO films are made using vacuum evaporation and sputtering.
Thin films of ITO are easy to etch with wet chemicals such as hydrochloric acid, but, as the pitch of the electrodes becomes smaller and features become finer, dry etching may be necessary to prevent undercutting of the lines due to overetching.
Thin Film Transistor Formation
Thin film transistor formation is very similar to the fabrication of an integrated circuit.
Thin film deposition
The substrates begin the fabrication process with a thin film application step. Thin films are deposited by CVD or physical vapour deposition (PVD). Plasma-enhanced CVD, also known as glow discharge, is used for amorphous silicon, silicon nitride and silicon dioxide.
Device patterning
Once the thin film has been deposited, a photoresist is applied and imaged to allow etching of the thin film to the appropriate dimensions. A sequence of thin films is deposited and etched, as with integrated circuit fabrication.
Orientation Film Application and Rubbing
On both the upper and bottom substrate, a thin polymer film is deposited for orientation of the liquid crystal molecules at the glass surface. This orientation film, perhaps 0.1 μm thick, may be a polyimide or other “hard” polymer material. After deposition and baking, it is rubbed with fabric in a specific direction, leaving barely detectable grooves in the surface. Rubbing can be done with a once through cloth on a belt, fed from a roller on one side, passing under a roller which contacts the substrate, onto a roller on the other side. The substrate moves underneath the cloth in the same direction as the cloth. Other methods include a travelling brush that moves across the substrate. The nap of the rubbing material is important. The grooves serve to aid the liquid crystal molecules to align at the substrate surface and to assume the proper tilt angle.
The orientation film can be deposited by spin coating or by printing. The printing method is more efficient in material usage; 70 to 80% of the polyimide is transferred from the printing roll to the substrate surface.
Assembly
Once the substrate rubbing step is completed, an automated assembly line sequence is begun, which consists of:
Automated transport of both top and bottom plates occurs through the line. One plate receives the adhesive, and the second plate is introduced at the spacer applicator station.
Liquid Crystal Injection
In the case where more than one display has been constructed on the substrate, the displays are now separated by slicing. At this point, the liquid crystal material can be introduced into the gap between the substrates, making use of a hole left in the seal material. This entrance hole is then sealed and prepared for final inspection. Liquid crystal materials are often delivered as two or three component systems which are mixed at injection. Injection systems provide mixing and purging of the cell to avoid trapping bubbles during the filling process.
Inspection and Test
Inspection and functional testing are performed after assembly and liquid crystal injection. Most defects are related to particles (including point and line defects) and cell gap problems.
Polarizer Attachment
The final manufacturing step for the liquid crystal display itself is the application of the polarizer to the outside of each glass plate. Polarizer films are composite films which contain the pressure-sensitive adhesive layer needed to attach the polarizer to the glass. They are applied by automated machines which dispense the material from rolls or pre-cut sheets. The machines are variants of labelling machines developed for other industries. The polarizing film is attached to both sides of the display.
In some cases, a compensation film is applied prior to the polarizer. Compensation films are polymer films (e.g., polycarbonate and polymethyl methacrylate) that are stretched in one direction. This stretching changes the optical properties of the film.
A completed display will ordinarily have driver integrated circuits mounted on or near one of the glass substrates, usually the thin film transistor side.
Hazards
Glass breakage is a significant hazard in LCD manufacturing. Cuts and lacerations can occur. Exposure to chemicals used for cleaning is another concern.
Silicon has historically dominated IC technology development as the primary semiconductor material. The principal focus in recent years on a silicon alternative has concentrated on III-V compounds, such as gallium arsenide (GaAs), as a substrate material. As a semiconductor material, GaAs exhibits increased capabilities over silicon, such as electron mobility 5 to 6 times that of silicon. This characteristic, coupled with the potential semi- insulating properties of GaAs, leads to increased performance in both speed and power consumption.
GaAs has a zinc blende-structure consisting of two interpenetrating face-centred cubic sublattices which relate to the growth of high quality ingot material. The technology involved in the growth of GaAs is considerably more complicated than that employed for silicon, as a more complicated two-phase equilibrium and a highly volatile component, arsenic (As), is involved. Precise control of the As vapour pressure in the ingot growth system is required to maintain exact stoichiometry of the GaAs compound during the growth process. Two primary categories of III-V semiconductor display and device production have economically feasible processing procedures—LED displays and microwave IC devices.
LEDs are fabricated from single-crystal GaAs in which p-n junctions are formed by the addition of suitable doping agents—typically tellurium, zinc or silicon. Epitaxial layers of ternary and quaternary III-V materials such as gallium arsenide phosphide (GaAsP) are grown on the substrate and result in an emission band of specific wavelengths in the visible spectrum for displays or in the infrared spectrum for emitters or detectors. For example, red light with a peak at about 650 nm comes from the direct recombination of the p-n electrons and holes. Green-emitting diodes are generally composed of gallium phosphide (GaP). The generalized LED processing steps are covered in this article.
Microwave IC devices are a specialized form of integrated circuit; they are used as high-frequency amplifiers (2 to 18 GHz) for radar, telecommunications and telemetry, as well as for octave and multi-octave amplifiers for use in electronic warfare systems. Microwave IC device manufacturers typically purchase single-crystal GaAs substrate, either with or without an epitaxial layer, from outside vendors (as do silicon device manufacturers). The major processing steps include liquid-phase epitaxial deposition, fabrication and non-fabrication processing similar to silicon device manufacturing. Processing steps which warrant description additional to that for LED processing are also discussed in this article.
Wafer Manufacturing
Similar to the silicon ingot growth process, elemental forms of gallium and arsenic, plus small quantities of dopant material—silicon, tellurium or zinc—are reacted at elevated temperatures to form ingots of doped single-crystal GaAs. Three generalized methods of ingot production are utilized:
The bulk polycrystalline GaAs compound is normally formed by the reaction of As vapour with Ga metal at elevated temperatures in sealed quartz ampoules. Typically, an As reservoir located at one end of the ampoule is heated to 618°C. This generates approximately 1 atmosphere of As vapour pressure in the ampoule, a prerequisite for obtaining stoichiometric GaAs. The As vapour reacts with the Ga metal maintained at 1,238°C and located at the other end of the ampoule in a quartz or pyrolytic boron nitride (PBN) boat. After the arsenic has been completely reacted, a polycrystalline charge is formed. This is used for single-crystal growth by programmed cooling (gradient freeze) or by physically moving either the ampoule or furnace to provide proper temperature gradients for growth (Bridgeman). This indirect approach (arsenic transport) for compounding and growth of GaAs is used because of the high vapour pressure of arsenic at the melting point of GaAs, about 20 atmospheres at 812°C and 60 atmospheres at 1,238°C, respectively.
Another approach to the commercial production of bulk single-crystal GaAs is the LEC technique. A Czochralski crystal puller is loaded with chunk GaAs in a crucible with an outer graphite susceptor. The bulk GaAs is then melted at temperatures close to 1,238°C, and the crystal is pulled in a pressurized atmosphere which could vary by manufacturer typically from a few atmospheres up to 100 atmospheres. The melt is completely encapsulated by a viscous glass, B2O3, which prevents melt dissociation as the As vapour pressure is matched or exceeded by the pressure of an inert gas (typically argon, or nitrogen) applied in the puller chamber. Alternatively, monocrystalline GaAs can be synthesized in situ by injecting the As into the molten Ga or combining As and Ga directly at high pressure.
GaAs wafer manufacturing represents the semiconductor manufacturing process with the greatest potential for significant, routine chemical exposures. While GaAs wafer manufacturing is done only by a small percentage of semiconductor manufacturers, particular emphasis is needed in this area. The large amounts of As used in the process, the numerous steps in the process and the low airborne exposure limit for arsenic make it difficult to control exposures. Articles by Harrison (1986); Lenihan, Sheehy and Jones (1989); McIntyre and Sherin (1989) and Sheehy and Jones (1993) provide additional information on the hazards and controls for this process.
Polycrystalline ingot synthesis
Ampoule load and seal
Elemental As (99.9999%) in chunk form is weighed and loaded into a quartz boat in an exhausted glove box. Pure liquid Ga (99.9999%) and the dopant material are also weighed and loaded into a quartz or pyrolytic boron nitride (PBN) boat(s) in the same manner. The boats are loaded into a long cylindrical quartz ampoule. (In the Bridgman and gradient freeze techniques, a seed crystal with the desired crystallographic orientation is also introduced, whereas in the two-stage LEC technique, where only poly GaAs is needed at this stage, a polycrystalline GaAs is synthesized without the seed crystal.)
The quartz ampoules are placed in a low-temperature furnace and heated while the ampoule is purged with hydrogen (H2), in a process known as hydrogen reduction reaction, to remove oxides. After purging with an inert gas such as argon, the quartz ampoules are attached to a vacuum pump assembly, evacuated, and the ampoule ends are heated and sealed with a hydrogen/oxygen torch. This creates a charged and sealed quartz ampoule ready for furnace growth. Hydrogen purging and the hydrogen/oxygen torch system is a potential fire/explosion hazard if proper safety devices and equipment are not in use (Wade et al. 1981).
Because the arsenic is being heated, this assembly is maintained under exhaust ventilation. Arsenic oxide deposits can form in the exhaust duct supporting this assembly. Care must be taken to prevent exposure and contamination should the ducts be disturbed in any way.
Storage and handling of arsenic chunks is a concern. For security, often the arsenic is kept under locked storage and with a tight inventory control. Typically the arsenic is also kept in a fire-rated storage cabinet to prevent its involvement in event of a fire.
Furnace growth
The Bridgeman and the gradient freeze methods of single-crystal ingot growth both utilize charged and sealed quartz ampoules in a high-temperature furnace enclosure which is vented to a wet scrubber system. The primary exposure hazards during furnace growth relate to the potential for the quartz ampoule to implode or explode during ingot growth. This situation occurs on a rather sporadic and infrequent basis, and is the result of one of the following:
The horizontal Bridgeman system consists of a multizone furnace in which the sealed quartz ampoule has separate temperature zones—the arsenic “cold” finger end at 618°C and the quartz gallium/dopant/seed crystal boat containing the melt at 1,238°C. The basic principle in the horizontal Bridgeman system involves traversing two heated zones (one above the melting point of GaAs, and one below the melting point) over a boat of GaAs to provide the precisely controlled freezing of molten GaAs. The seed crystal, maintained at all times in the freeze zone, provides the initial crystal starting structure, defining the direction and orientation of the crystalline structure within the boat. The quartz boat and ampoule of Ga and As are suspended within the heater chamber by a set of silicon carbide liners called support tubes, which are positioned within the resistance heater assembly to mechanically move the full distance of the ampoule. Additionally, the furnace assembly rests on a table which must be tilted during growth to provide the proper interface of the synthesized GaAs melt with the seed crystal.
In the gradient freeze method, a multizone high temperature furnace utilizing resistance heating is kept at 1,200 to 1,300 °C (1,237°C is the melt/freeze point of GaAs). The total ingot growth process duration is typically 3 days and comprises the following steps:
The quartz ampoule is also tilted during the growth process by the use of a scissors-type manual jack.
Ampoule breakout
After the single-crystal GaAs ingot is grown within the sealed quartz ampoule, the ampoule must be opened and the quartz boat containing the ingot plus seed crystal removed. This is accomplished by one of the following methods:
The quartz ampoules are recycled by wet etching the condensed arsenic on the interior surface with aqua regia (HCl,HNO3) or sulphuric acid/hydrogen peroxide (H2SO4/H2O2).
Ingot beadblasting/cleaning
In order to see polycrystalline defects and remove exterior oxides and contaminants, the single-crystal GaAs ingot must be beadblasted. The beadblasting is done in an exhausted glove-box unit utilizing either silicon carbide or calcined alumina blasting media. Wet cleaning is done in chemical baths provided with local exhaust ventilation and utilizing aqua regia or alcohol rinses (isopropyl alcohol and/or methanol).
Monocrystalline ingot growth
The polycrystalline GaAs ingot retrieved from the ampoule is broken into chunks, weighed and placed into a quartz or PBN crucible, and a boron oxide disc is placed on top of it. The crucible is then placed into a crystal grower (puller) pressurized in an inert gas, and heated to 1,238°C. At this temperature, the GaAs melts, with the lighter boron oxide becoming a liquid encapsulant to prevent the arsenic from dissociating from the melt. A seed crystal is introduced into the melt below the liquid cap and while counter-rotating, is slowly withdrawn from the melt, thereby solidifying as it leaves the “hot-zone”. This process takes approximately 24 hours, depending on the charge size and crystal diameter.
Once the growth cycle is completed, the grower is opened to retrieve the monocrystalline ingot and for cleaning. Some amount of arsenic escapes from the melt even with the liquid cap in place. There can be significant exposure to airborne arsenic during this step of the process. To control this exposure, the grower is cooled to below 100°C, which results in the deposition of fine arsenic particulate on the interior surface of the grower. This cooling helps minimize the amount of arsenic that becomes airborne.
Heavy deposits of arsenic-containing residues are left on the inside of the crystal grower. Removal of the residues during routine preventive maintenance can result in significant airborne concentrations of arsenic (Lenihan, Sheehy and Jones 1989; Baldwin and Stewart 1989; McIntyre and Sherin 1989). Controls used during this maintenance operation often include scavenger exhaust ventilation, disposable clothing and respirators.
When the ingot is removed, the grower is dismantled. A HEPA vacuum is utilized to pick up arsenic particulates on all parts of the grower. After vacuuming, the stainless steel parts are wiped with an ammonium hydroxide/hydrogen peroxide mixture to remove any residual arsenic, and the grower is assembled.
Wafer processing
X-ray diffraction
The crystalline orientation of the GaAs ingot is determined by the use of an x-ray diffraction unit, as in silicon ingot processing. A low-powered laser can be used to determine the crystalline orientation in a production setting; however, x-ray diffraction is more accurate and is the preferred method.
When x-ray diffraction is used, often the x-ray beam is totally enclosed in a protective cabinet that is periodically checked for radiation leakage. Under certain circumstances, it is not practical to fully contain the x-ray beam in an interlocked enclosure. In this instance operators may be required to wear radiation finger badges, and controls similar to those used for high-powered lasers are used (e.g., enclosed room with limited access, operator training, enclosing the beam as much as practical, etc.) (Baldwin and Williams 1996).
Ingot cropping, grinding and slicing
The ends or tails of the single-crystal ingot are removed, using a water-lubricated single-bladed diamond saw, with various coolants added to the water. The monocrystalline ingot is then placed on a lathe which shapes it into a cylindrical ingot of uniform diameter. This is the grinding process, which is also a wet process.
After cropping and grinding, GaAs ingots are epoxy or wax mounted to a graphite beam and sawed into individual wafers through the use of automatically operated inside diameter (ID) diamond-blade saws. This wet operation is done with the use of lubricants and generates a GaAs slurry, which is collected, centrifuged and treated with calcium fluoride to precipitate out the arsenic. The supernatant is tested to ensure that it does not contain excess arsenic, and the sludge is pressed into a cake and disposed of as hazardous waste. Some manufacturers send the collected slurry from the ingot cropping, grinding and slicing processes for Ga reclaim.
Arsine and phosphine may be formed from the reaction of GaAs and indium phosphide with moisture in the air, other arsenides and phosphides or when mixed with acids during the processing of gallium arsenide and indium phosphide; 92 ppb arsine and 176 ppb phosphine have been measured 2 inches away from the slicing blades used to cut GaAs and indium phosphide ingots (Mosovsky et al. 1992, Rainer et al. 1993).
Wafer washing
After GaAs wafers are dismounted from the graphite beam, they are cleaned by sequential dipping in wet chemical baths containing solutions of sulphuric acid/hydrogen peroxide or acetic acid and alcohols.
Edge profiling
Edge profiling is also a wet process performed on sliced wafers to form an edge around the wafer, which makes it less prone to breakage. Because only a thin cut is made on the surface of the wafer, only a small amount of slurry is generated.
Lapping and polishing
Wafers are wax mounted on a lapping or grinding plate, using a hotplate, and are lapped on a machine exerting a set rotational speed and pressure. A lapping solution is fed onto the lapping surface (a slurry of aluminium oxide, glycerine and water). After a brief lapping period, when the desired thickness is achieved, the wafers are rinsed and mounted on a mechanical polishing machine. Polishing is performed using a sodium bicarbonate, 5% chlorine, water (or sodium hypochlorite) and colloidal silica slurry. The wafers are then dismounted on a hotplate, the wax is removed using solvents and the wafers are cleaned.
Epitaxy
The single-crystal GaAs wafers are used as substrates for the growth of very thin layers of the same or other III-V compounds having the desired electronic or optical properties. This must be done in such a way as to continue, in the grown layer, the crystal structure of the substrate. Such crystal growth, in which the substrate determines the crystallinity and orientation of the grown layer, is called epitaxy, and a variety of epitaxial growth techniques are used in III-V display and device production. The most common techniques are:
Liquid-phase epitaxy
In LPE a layer of doped III-V material is grown directly on the surface of the GaAs substrate using a graphite holder that contains separate chambers for the material to be deposited on the wafers. Weighed quantities of deposition materials are added to the upper chamber of the holder, while the wafers are placed in a lower chamber. The assembly is placed within a quartz reaction tube under a hydrogen atmosphere. The tube is heated to melt the deposition materials, and when the melt equilibrates, the upper section of the holder is slid so that the melt is positioned over the wafer. The furnace temperature is then lowered to form the epitaxial layer.
LPE is primarily used in microwave IC epitaxy and for manufacturing LEDs of certain wavelengths. The major concern with this LPE process is the use of highly flammable hydrogen gas in the system, which is mitigated by good engineering controls and early warning systems.
Molecular-beam epitaxy
Vacuum epitaxy in the form of MBE has developed as a particularly versatile technique. MBE of GaAs consists of an ultrahigh-vacuum system containing sources for atomic or molecular beams of Ga and As and a heated substrate wafer. The molecular-beam sources are usually containers for liquid Ga or solid As. The sources have an orifice that faces the substrate wafer. When the effusion oven (or container) is heated, atoms of Ga or molecules of As effuse from the orifice. For GaAs, growth usually takes place with a substrate temperature above 450°C.
High exposures to arsine can occur during the maintenance of solid-source MBE systems. Room air concentrations of 0.08 ppm were detected in one study when the chamber of the MBE unit was opened for maintenance. The authors hypothesized that transient arsine generation may be caused by a reaction of very fine particulate arsenic with water vapour, with aluminium acting as a catalyst (Asom et al. 1991).
Vapour phase epitaxy
Degreased and polished wafers undergo an etch and clean step prior to epitaxy. This involves a sequential wet-chemical dipping operation utilizing sulphuric acid, hydrogen peroxide and water in a 5:1:1 ratio; a de-ionized water rinse; and an isopropyl alcohol clean/dry. A visual inspection is also performed.
Two major techniques of VPE are in use, based on two different chemistries:
The thermochemistries of these techniques are very different. The halogen reactions are usually “hot” to “cold” ones, in which the III-halogen is generated in a hot zone by reaction of the III element with HCl, and then diffuses to the cold zone, where it reacts with the V species to form III-V material.The metal-organic chemistry is a “hot wall” process in which the III metal-organic compound “cracks” or pyrolyzes away the organic group and the remaining III and hydride V react to form III-V.
In VPE, GaAs substrate is placed in a heated chamber under a hydrogen atmosphere. The chamber is heated by either RF or resistance heating. HCl is bubbled through a Ga boat, forming gallium chloride, which then reacts with the AsH3 and PH3 near the surface of the wafers to form GaAsP, which is deposited as the epitaxial layer on the substrate. There are a number of dopants that can be added (depending on the product and the recipe). These include low concentrations of tellurides, selenides and sulphides.
A common technique used for VPE in LED processing is the III-halogen and V-hydrogen (hydride) system. It involves a two-cycle process—initially growing the epitaxial layer of GaAsP on the GaAs substrate and, lastly, an etch cycle to clean the graphite/quartz reactor chamber of impurities. During the epitaxial growth cycle, the pre-cleaned GaAs wafers are loaded onto a carousel located inside a quartz reactor chamber containing a reservoir of elemental liquid gallium through which anhydrous HCl gas is metered, forming GaCl3. The hydride/hydrogen gas mixtures (e.g., 7% AsH3/H2 and 10% PH3/H2) are also metered into the reactor chamber with the addition of ppm concentrations of organometallic dopants of tellurium and selenium. The chemical species in the hot zone, the upper part of the reaction chamber, react, and, in the cold zone, the lower part of the chamber, form the desired layer of GaAsP on the wafer substrate as well as on the interior of the reactor chamber.
Effluents from the reactor are routed to a hydrogen torch system (combustion chamber or burnbox) for pyrolysis and are vented to a wet scrubber system. Alternatively, the reactor effluents can be bubbled through a liquid medium to trap most of the particulates. The safety challenge is reliance on the reactors themselves to “crack” the gases. The efficiency of these reactors is approximately 98 to 99.5%; therefore, some unreacted gases may be coming off of the bubbler when they are taken out by the operators. There is off-gassing of various arsenic- and phosphorus-containing compounds from these bubblers, requiring that they be quickly transported to a vented sink for maintenance, where they are purged and cleaned, in order to keep personnel exposure low. The occupational hygiene challenge of this process is profiling the exhaust effluent, since most of the out-gassed compounds from various parts of the reactor, especially the bubbler, are unstable in air and the available conventional collection media and analytical techniques are not discriminatory towards the different species.
Another concern is prescrubbers for VPE reactors. They can contain high concentrations of arsine and phosphine. Exposures above occupational exposure limits can occur if these prescrubbers are indiscriminately opened (Baldwin and Stewart 1989).
The etch cycle is performed at the end of the growth cycle and on new reactor parts to clean the interior surface of impurities. Undiluted HCl gas is metered into the chamber for periods of approximately 30 minutes, and the reactor is heated to over 1,200°C. The effluents are vented to the wet scrubber system for neutralization.
At the end of both the growth and etch cycles, an extended N2 purge is used to flush the reactor chamber of toxic/flammable and corrosive gases.
Reactor cleaning
After each growth cycle, the VPE reactors must be opened, the wafers removed, and both the upper and the lower portion of the reactor physically cleaned. The cleaning process is performed by the operator.
The quartz prescrubber from the reactors is physically moved out of the reactor and placed in an exhausted sink where it is purged with N2, rinsed with water and then submerged in aqua regia. This is followed by another water rinse prior to drying the part. The intention of the N2 purge is to simply displace the oxygen due to the presence of unstable, pyrophoric phosphorus. Some residues containing various arsenicals and phosphorus-containing by-products are left on these parts even after the purge and water rinse. The reaction between these residues and the strong oxidizer/acid mixture could potentially generate significant amounts of AsH3 and some PH3. There is also exposure potential with other maintenance procedures in the area.
The bottom part of the quartz reaction chamber and the bottom plate (base plate) are scraped clean using a metal tool, and the particulate material (mixture of GaAs, GaAsP, arsenic oxides, phosphorus oxides and entrapped hydride gases) is collected in a metal container positioned below the vertical reactor. A high-efficiency vacuum is used for the final clean-up.
Another operation with potential for chemical exposure is cleaning the reactor’s trap. The trap cleaning is done by scraping the graphite parts from the upper chamber, which have a crust of all the previously mentioned by-products plus arsenic chloride. The scraping procedure generates dust and is performed in a ventilated sink to minimize exposure to the operators. The process exhaust line, which contains all the by-products plus moisture that forms a liquid waste, is opened and drained into a metal container. The HEPA vacuum is used to clean off any dust particles that may have escaped during the transfer of the graphite parts and from the raising and lowering of the bell jar, which knocks off any loose particles.
Metallorganic chemical-vapour deposition
MOCVD is widely used in the preparation of III-V devices. In addition to the hydride gases used as source materials in other CVD systems (e.g., arsine and phosphine), less toxic liquid alternatives (e.g., tertiary butyl arsine and tertiary butyl phosphine) are also used in MOCVD systems, along with other toxics such as cadmium alkyls and mercury (Content 1989; Rhoades, Sands and Mattera 1989; Roychowdhury 1991).
While VPE refers to a compound material deposition process, MOCVD refers to the parent chemistry sources used in the system. Two chemistries are used: halides and metallorganic. The VPE process described above is a halide process. A group III halide (gallium) is formed in the hot zone and the III-V compound is deposited in the cold zone. In the metallorganic process for GaAs, trimethylgallium is metered into the reaction chamber along with arsine, or a less toxic liquid alternative such as tertiary butyl arsine, to form gallium arsenide. An example of a typical MOCVD reaction is:
(CH3)3Ga + AsH3 → GaAs + 3CH4
There are other chemistries used in MOCVD processing of LEDs. Organometallics used as the group III elements include trimethyl gallium (TMGa), triethyl gallium (TEGa), TM indium, TE indium and TM aluminium. Hydride gases are also used in the process: 100% AsH3 and 100% PH3. The dopants used in the process are: dimethyl zinc (DMZ), bis-cyclopentadienyl magnesium and hydrogen selenide (H2Se). These materials are reacted within the reaction chamber under a low-pressure H2 atmosphere. The reaction produces epitaxial layers of AlGaAs, AlInGaP, InAsP and GaInP. This technique has been traditionally used in the manufacturing of semiconductor lasers and optical communication devices such as transmitters and receivers for fibre optics. The AlInGaP process is used to produce very bright LEDs.
Similar to the VPE process, MOCVD reactor and part cleaning presents challenges for both the process as well as the occupational hygienist, especially if large amounts of concentrated PH3 is used in the process. The “cracking” efficiency of these reactors is not as great as that of the VPE reactors. There is a significant amount of phosphorus generated, which is a fire hazard. The cleaning procedure involves the use of dilute hydrogen peroxide/ammonium hydroxide on various parts from these reactors, which is an explosion hazard if, due to operator error, a concentrated solution is used in the presence of a metal catalyst.
Device Fabrication
The GaAs wafer with an epitaxially grown layer of GaAsP on the upper surface proceeds to the device fabrication processing sequence.
Nitride deposition
A high-temperature CVD of silicon nitride (Si3N4) is performed, using a standard diffusion furnace. The gaseous sources are silane (SiH4) and ammonia (NH3) with a nitrogen carrier gas.
Photolithographic process
The standard photoresist, aligning/exposure, developing and stripping process is utilized as in silicon device processing (see the section on lithography in the article “Silicon semiconductor manufacturing”).
Wet etching
Various mixtures of wet-chemical acid solutions are used in plastic baths in locally exhausted etch stations, some provided with vertically mounted laminar HEPA filtered supply systems. The primary acids in use are sulphuric (H2SO4), hydrofluoric (HF), hydrochloric (HCl) and phosphoric (H3PO4). As in silicon processing, hydrogen peroxide (H2O2) is used with sulphuric acid, and ammonium hydroxide (NH4OH) provides a caustic etch. A cyanide solution (sodium or potassium) is also used for etching aluminium. However, cyanide etching is slowly being phased out as other etchants are developed for this process. As an alternative to wet etching, a plasma etching and ashing process is used. The reactor configurations and reactant gases are very similar to those utilized in silicon device processing.
Diffusion
A closed ampoule zinc diarsenide solid source diffusion is performed in a vacuum diffusion furnace at 720°C, utilizing a N2 carrier gas. Arsenic and zinc arsenide are used as dopants. They are weighed in a glove box in the same manner as in bulk substrate.
Metallization
An initial aluminium evaporation is performed utilizing an E-beam evaporator. After backlapping, a last step gold evaporation is performed utilizing a filament evaporator.
Alloying
A final alloying step is performed in a low-temperature diffusion furnace, utilizing a nitrogen inert atmosphere.
Backlapping
Backlapping is done to remove deposited materials (GaAsP, Si3N4 and so on) from the backside of the wafer. The wafers are wax mounted to a lapper plate and wet lapped with a colloidal silica slurry. Then the wax is removed by wet stripping the wafers in an organic stripper in a locally exhausted wet chemical etch station. Another alternative to wet lapping is dry lapping, which utilizes aluminium oxide “sand”.
There are a number of resists and resist strippers used, typically containing sulphonic acid (dodecyl benzene sulphonic acid), lactic acid, aromatic hydrocarbon, naphthalene and catechol. Some resist strippers contain butyl ethanoate, acetic acid and butyl ester. There are both negative and positive resists and resist strippers used, depending on the product.
Final test
As in silicon device processing, the completed LED circuits are computer tested and marked (see “Silicon semiconductor manufacturing”). Final inspection is performed and then the wafers are electrically tested to mark defective dies. A wet saw is then used to separate the individual dies, which are then sent for assembly.
Printed Wiring Boards
Printed wiring boards (PWBs) are the interconnective electrical framework and physical structure that hold together the various electronic components of a printed circuit board. The major categories of PWBs are single-sided, double-sided, multilayer and flexible. The complexity and spacing requirements of ever increasingly dense and smaller boards have required that both sides of the board be covered with underlying circuits. Single-sided boards met early calculator and simple consumer electronic devices requirements, but portable notebook computers, personal digital assistants and personal music systems have required double-sided and multilayer PWBs. The processing of the patterning of PWBs is essentially a photolithographic process that involves selectively depositing and removing layers of materials on a dielectric substrate that acts as the electrical “wiring” that is etched or deposited on the printed wiring board.
Multilayer boards contain two or more pieces of dielectric material with circuitry that are stacked up and bonded together. Electrical connections are established from one side to the other, and to the inner layer circuitry, by drilled holes which are subsequently plated through with copper. The dielectric substrate most commonly used is fibreglass sheets (epoxy/fibreglass laminate). Other materials are glass (with polyimide, Teflon or triazine resins) and paper covered with phenolic resin. In the United States, laminated boards are categorized based on their fire-extinguishing properties; drilling, punching and machining properties; properties of moisture absorption; chemical and heat resistance; and mechanical strength (Sober 1995). The FR-4 (epoxy resin and glass cloth substrate) is widely used for high-technology applications.
The actual PWB process involves numerous steps and a wide variety of chemical agents. Table 1 illustrates a typical multilayer process and the EHS issues associated with this process. The primary differences between a single-sided and double-sided board is that the single-sided starts with raw material clad only on one side with copper, and omits the electroless copper plating step. The standard double-sided board has a solder mask over bare copper and is plated through the holes; the board has gold-coated contacts and a component legend. The majority of PWBs are multilayer boards, which are double-sided with internal layers that have been fabricated and sandwiched inside the laminate package and then processed almost identically to a double-layer board.
Table 1. PWB process: Environmental, health and safety issues
Primary process steps |
Health and safety issues |
Environmental issues |
Material prep |
||
Purchase specific laminate, entry material and backup board in pre-cut size |
Computer aided design—VDU and ergonomics hazards |
None |
Stack and pin |
||
Copper-clad panels are stacked with entry material and backup board; holes drilled and |
Noise during drilling; drilling particulate containing copper, lead, gold and epoxy/fibreglass |
Waste particulate (copper, lead, gold and |
Drilling |
||
Numerically controlled (N/C) drilling machines |
Noise during drilling; drilling particulate containing copper, lead, gold and epoxy/fibreglass |
Waste particulate (copper, lead, gold and |
Deburr |
||
Drilled panels pass through brushes or abrasive wheel |
Noise during deburr; particulate containing copper, lead, gold and epoxy/fibreglass |
Waste particulate (copper, lead, gold and |
Electroless copper plating |
||
Adding thin copper layer to through holes |
Inhalation and dermal exposure to cleaners, conditioners, etchants, catalysts—H2SO4, H2O2, glycol ethers, KMnO4, NH4HF2, palladium, SnCl2, CuSO4, formaldehyde, NaOH |
Water effluents—acids, copper, caustics, |
Imaging |
||
Dry film resist—UV sensitive photopolymer |
Inhalation and dermal exposure to resists; developers; and |
Air emissions—solvents (VOCs), acid gases, |
Pattern plating |
||
Cleaning |
Inhalation and dermal hazards from cleaning; copper plating or tin/tin and lead plating and rack stripping—H3PO4, H2SO4; H2SO4 and CuSO4; fluoboric acid and Sn/Pb; concentrated HNO3 |
Air emissions—acid gases; water |
Strip, etch, strip |
||
Resist strip |
Inhalation and dermal hazards from resist strip; alkaline etch or copper strip—monoethanol amine (MEA); NH4OH; NH4Cl/NH4OH or NH4HF2 |
Air emissions—MEA, ammonia, fluorides; |
Solder mask |
||
Epoxy inks —screen printing |
Inhalation and dermal hazards from precleaning; epoxy inks and solvent carriers; developers—H2SO4; epichlorhydrin + bisphenol A, glycol ethers (PGMEA based); gamma-butyrolactone. UV light from curing process |
Air emissions—acid gases, glycol ethers |
Solder coating |
||
Solder levelling |
Inhalation and dermal hazards from flux, decomposition products and lead/tin solder residues—dilute glycol ethers + <1% HCl and <1% HBr; aldehydes, HCl, CO; lead and tin |
Air emissions—glycol ethers (VOC), acid gases, aldehydes, CO; waste—lead/tin solder, flux |
Gold and nickel plating |
||
Inhalation and dermal hazards from acids, metals and |
Air emissions—acid gases, cyanides; water |
|
Component legend |
||
Screen print |
Inhalation and dermal hazards from epoxy based inks and solvent carriers—glycol ether-based solvents, epichlorhydrin + bisphenol A |
Air emissions—glycol ethers (VOCs) waste — inks and solvents (small quantities) |
Cl2 = chlorine gas; CO = carboon monoxide; CuSO4 = copper sulphate; H2O2 = hydrogen peroxide;H2SO4 = sulphuric acid; H3PO4 = phosphoric acid; HBR = hydrobromic acid; HCl = hydrochloric acid; HNO3 = nitric acid; K2CO3 = potassium carbonate; KMNO4 = potassium permanganate; NA3PO4 = sodium phosphate; NH4Cl = ammonium chloride; NH4OH = ammonium hydroxide; NiSO4 = nickel sulphate; Pb = lead; Sn = tin; SnCl2 = stannous chloride; UV = ultraviolet; VOCs = volatile organic compounds.
Printed Circuit Board Assembly
Printed circuit board (PCB) assembly involves the hard attachment of electronic components to the PWB through the use of lead/tin solder (in a wave solder machine or applied as a paste and then reflowed in a low-temperature furnace) or epoxy resins (cured in a low-temperature furnace). The underlying PWB (single-sided, double-sided, multilayer or flexible) will determine the densities of components that can be attached. Numerous process and reliability issues form the basis for the selection of the PCB assembly processes that will be utilized. The major technological processes are: total surface mounting technology (SMT), mixed technology (includes both SMT and plated through hole (PTH)) and underside attachment.
Typically in modern electronics/computer assembly facilities, the mixed technology is utilized, with some components being surface mounted and other connectors/components being soldered on using through-hole technology or solder reflowing. A “typical” mixed technology process is discussed below, wherein a surface mount process involving adhesive attach, wave soldering and reflow soldering is utilized. With mixed technology, it is sometimes possible to reflow surface mount components (SMCs) on the top side of a double-sided board and wave solder the SMCs on the underside. Such a process is particularly useful when the surface mount and through-hole technologies must be mixed on a single board, which is the norm in current electronics manufacturing. The first step is to mount the SMCs to the top side of the board, using the solder reflow process. Next, the through-hole components are inserted. The board is then inverted, and the underside SMCs are mounted adhesively to the board. Wave soldering of both through-hole components and underside SMCs is the final step.
The major technical mixed technology process steps include:
A brief discussion of the important environmental, health and safety implications for each process step is provided below.
Pre- and post-cleaning
Commercial PWBs are typically purchased from a PWB supplier and have been pre-cleaned with de-ionized (DI) water solution to remove all surface contaminants. Prior to the concerns regarding stratospheric ozone layer depletion, an ozone depleting substance, such as a chlorofluorocarbon (CFC), would be used as a final clean, or even pre-clean by the electronic device manufacturer. At the end of the PCB assembly process, the use of a chlorofluorocarbon “vapour degreasing” operation to remove residues from the flux/wave soldering operation was typical. Again due to concerns about ozone depletion and tight regulatory controls on the production of CFCs, process changes were made that allowed the complete PWB assemblies to by-pass cleaning or use only a DI water cleaning.
Solder paste and adhesive application (stencil print and placement) and component insertion
The application of lead/tin solder paste to the PWB surface allows the surface mount component to be attached to the PWB and is key to the SMT process. The solder material acts as a mechanical linkage for electrical and thermal conduction and as a coating for surface protection and enhanced solderability. The solder paste is made up of approximately 70 to 90% non-volatile matter (on a weight per weight or weight per volume basis):
Solvents (volatile matter) make-up the remainder of the product (typically an alcohol and glycol ether mixture that is a proprietary blend).
The solder paste is printed through a stencil, which is an exact pattern of the surface design that is to be added to the PWB surface. The solder paste is pushed through the apertures in the stencil onto the pad sites on the PWB by means of a squeegee that slowly traverses the stencil. The stencil is then lifted away, leaving the paste deposits on the appropriate pads on the board. The components are then inserted on the PWB. The primary EHS hazards relate to the housekeeping and personal hygiene of the operators that apply the solder paste to the stencil surface, clean the squeegee and clean the stencils. The concentration of lead in the solder and the tendency of the dried solder paste to adhere to the skin and equipment/facility work surfaces requires the use of protective gloves, good clean-up of work surfaces, safe disposal of contaminated clean-up materials (and environmental handling) and strict personal hygiene by the operators (e.g., handwashing with soap prior to eating, drinking or applying cosmetics). Airborne exposure levels are typically below the detection limit for lead, and if good housekeeping/personal hygiene is used, blood lead readings are at background levels.
The adhesive application involves the automated dispensing of small quantities of an epoxy resin (typically a bisphenol A-epichlorhydrin mixture) onto the PWB surface and then “picking and placing” the component and inserting it through the epoxy resin onto the PWB. The EHS hazards primarily relate to the mechanical safety hazards of the “pick and place” units, due to their automated mechanical assemblies, component shuttles on the rear of the units and potential for serious injury if appropriate guarding, light curtains and hardware interlocks are not present.
Adhesive cure and solder reflow
The components that were attached by stencil printing or adhesive application are then carried on a fixed-height mechanical conveyor to an in-line reflow furnace that “sets off” the solder by reflowing the solder paste at approximately 200 to 400°C. The components that were attached by the epoxy adhesive are also run through a furnace that is downline of the solder reflow and is typically run at 130 to 160oC. The solvent components of the solder paste and epoxy resin are driven off during the furnace process, but the lead/tin component is not volatilized. A spider-web type residue will build up in the exhaust duct of the reflow furnace, and a metal mesh filter can be used to prevent this. PWBs can occasionally get caught in the conveyor system and will overheat in the furnace, causing objectionable odours.
Fluxing
To form a reliable solder joint at the PWB surface and the component lead, both must be free of oxidation and must remain so even at the elevated temperatures used in soldering. Also, the molten solder alloy must wet the surfaces of the metals to be joined. This means the solder flux must react with and remove metal oxides from the surfaces to be joined and prevent the re-oxidation of the cleaned surfaces. It also requires that the residues be either non-corrosive or easily removable. Fluxes for soldering electronic equipment fall into three broad categories, commonly known as rosin-based fluxes, organic or water-soluble fluxes and solvent-removable synthetic fluxes. Newer, low-solids “no clean” or non-volatile organic compound (NVOC) fluxes fall into the middle category.
Rosin-based fluxes
The rosin-based fluxes are the most commonly used fluxes in the electronics industry, either as spray flux or foam flux. The fluxer may be contained either internal to the wave soldering equipment or as a stand-alone unit positioned at the infeed to the unit. As a base, rosin-based fluxes have natural rosin, or colophony, the translucent, amber-coloured rosin obtained after turpentine has been distilled from the oleoresin and canal resin of pine trees. The resin is collected, heated and distilled, which removes any solid particles, resulting in a purified form of the natural product. It is a homogeneous material with a single melting point.
Colophony is a mixture of approximately 90% resin acid, which is mostly abietic acid (a non-water soluble, organic acid) with 10% neutral materials such as stilbene derivatives and various hydrocarbons. Figure 1 provides the chemical structures for abietic and pimaric acids.
Figure 1. Abietic & pimaric acids
The active constituent is abietic acid, which at soldering temperature is chemically active and attacks the copper oxide on the PWB surface, forming copper abiet. Rosin-based fluxes have three components: the solvent or vehicle, the rosin and the activator. The solvent simply acts as a vehicle for the flux. To be effective the rosin must be applied to the board in a liquid state. This is accomplished by dissolving the rosin and activator in a solvent system, typically isopropyl alcohol (IPA) or multicomponent mixtures of alcohols (IPA, methanol or ethanol). Then the flux is either foamed onto the bottom surface of the PCB through the addition of air or nitrogen, or sprayed in a “low-solids” mixture which has a higher solvent content. These solvent components have different evaporation rates, and a thinner must be added to the flux mixture to maintain a constituent flux composition. The primary categories of rosin-based fluxes are: rosin mildly active (RMA), which are the typical fluxes in use, to which a mild activator is added; and rosin active (RA), to which a more aggressive activator has been added.
The primary EHS hazard of all the rosin-based fluxes is the alcohol solvent base. Safety hazards relate to flammability in storage and use, classification and handling as a hazardous waste, air emissions and treatment systems required to remove the VOCs and industrial hygiene issues related to inhalation and skin (dermal) exposure. Each of these items requires a different control strategy, employee education and training and permits/regulatory compliance (Association of the Electronics, Telecommunications and Business Equipment Industries 1991).
During the wave soldering process, the flux is heated to 183 to 399°C; airborne products generated include aliphatic aldehydes, such as formaldehyde. Many fluxes also contain an organic amine hydrochloride activator, which helps clean the area being soldered and releases hydrochloric acid when heated. Other gaseous components include benzene, toluene, styrene, phenol, chlorophenol and isopropyl alcohol. In addition to the gaseous components of heated flux, a significant amount of particulates are created, ranging in size from 0.01 micron to 1.0 micron, known as colophony fumes. These particulate materials have been found to be respiratory irritants and also respiratory sensitizers in sensitive individuals (Hausen, Krohn and Budianto 1990). In the United Kingdom, airborne exposure standards require that colophony fume levels be controlled to the lowest levels attainable (Health and Safety Commission 1992). Additionally, the American Conference of Governmental Industrial Hygienists (ACGIH) has established a separate threshold limit value for the pyrolysis products of rosin core solder of 0.1 mg/m3, measured as formaldehyde (ACGIH 1994). The Lead Industries Association, Inc. identifies acetone, methyl alcohol, aliphatic aldehydes (measured as formaldehyde), carbon dioxide, carbon monoxide, methane, ethane, abietic acid and related diterpene acids as typical decomposition products of rosin core soldering (Lead Industries Association 1990).
Organic fluxes
Organic fluxes, sometimes called intermediate fluxes or water-soluble fluxes, are composites that are more active than the rosin-based fluxes and less corrosive than acid fluxes used in the metal-working industries. The general active compounds of this class of fluxes fall into three groups:
These materials and other parts of the formulation, such as surfactants to assist in reducing the solder surface tension, are dissolved in polyethylene glycol, organic solvents, water or usually a mixture of several of these. Organic fluxes must be considered corrosive, but can be cleaned off easily, with no more than hot water.
Synthetic activated (AS) fluxes
Whereas rosin-based fluxes are solid materials dissolved in a solvent, AS fluxes are usually totally liquid formulas (solvent + flux). The solvent carrier is driven off during the preheating phase of wave soldering, leaving a wet and oily residue on the PWB surface, which must be cleaned off immediately following soldering. The primary attribute of AS fluxes is their ability to be removed by the use of a suitable solvent, typically fluorocarbon based. With restrictions on the use of ozone-depleting substances such as fluorocarbons (Freon TF, Freon TMS and so on), the required use of these cleaning materials has severely restricted the use of this class of fluxes.
Low-solids “no clean” or non-VOC fluxes
The need for the elimination of the post-soldering cleaning of corrosive or tacky flux residues with fluorocarbon solvents has lead to the widespread usage of a new class of fluxes. These fluxes are similar in activity to the RMA fluxes and have a solids content of approximately 15%. The solids content is a measure of viscosity and equals the ratio of flux to solvent. The lower the solids contents, the higher the percentage of solvent. The higher the solids content, the more active the flux, and the more potential for needing a post-soldering cleaning step. Low-solids flux (LSF) is commonly used in the electronics industry and typically does not require the post-cleaning step. From an environmental air-emission perspective, the LSF eliminated the need for fluorocarbon vapour degreasing of wave soldered boards, but with their higher solvent content, they increased the quantity of alcohol-based solvents evaporated, resulting in higher VOC levels. VOC air-emission levels are tightly controlled in the United States, and in many locations worldwide. This situation was addressed by the introduction of “no clean” fluxes, which are water based (rather than solvent based) but contain similar activators and fluxing rosins. The primary active ingredients are dicarboxylic acid based (2 to 3%), typically glutaric, succinic and adipic acids. Surfactants and corrosion inhibitors (approximately 1%) are also included, resulting in a pH (acidity) of 3.0 to 3.5. These fluxes virtually eliminate VOC air emissions and other EHS hazards associated with using solvent-based fluxes. The decomposition products noted in rosin-based fluxes are still applicable, and the mild pH does require that the flux-handling equipment be acid resistant. Some anecdotal evidence points to potential dermal or respiratory problems from the dried, mildly acidic dicarboxylic acids and corrosion inhibitors that may become a residue on board carriers, carts and internal surfaces of wave soldering equipment utilizing these compounds. Also, the water component of these fluxes may not get adequately evaporated prior to hitting the molten solder pot, which can lead to splattering of the hot solder.
Wave soldering
The addition of flux to the bottom surface of the PWB can be accomplished either by a fluxer located internal to the wave soldering unit or a stand-alone unit at the entry to the wave soldering unit. Figure 2 provides a schematic representation of a standard wave soldering unit with the fluxer located internally. Either configuration is used to foam or spray the flux onto the PWB.
Figure 2. Wave solder unit schematic
Preheating
The flux carriers must be evaporated prior to soldering. This is accomplished by using high-temperature preheaters to drive off the liquid components. Two basic types of preheaters are in use: radiant (hot rod) and volumetric (hot air). The radiant heaters are common in the United States and present the potential for ignition of excess flux or solvent or the decomposition of a PWB should it become immobilized under the preheater. Local exhaust ventilation is provided on the fluxer/preheater side of the wave soldering unit to capture and exhaust the solvent/flux materials evaporated during these operations.
Soldering
The solder alloy (typically 63% tin to 37% lead) is contained in a large reservoir called the solder pot, and is heated electrically to maintain the solder in a molten state. The heaters include a powerful bulk heater to do the initial melt and a smaller regulated heat supply to control the temperature thermostatically.
Successful board-level soldering requires that the design of the solder pot and recirculation pump systems continually provide a consistent “wave” of fresh solder. With soldering, the pure solder becomes contaminated with oxidized lead/tin compounds, metallic impurities and flux decomposition products. This dross forms on the surface of the molten solder, and the more dross formed, the more of a tendency for additional formation. Dross is harmful to the soldering process and the solder wave. If enough forms in the pot, it can get pulled into the recirculation pump and cause impeller abrasion. Wave solder operators are required to de-dross the wave on a routine basis. This process involves the operator straining the solidified dross from the molten solder and collecting the residues for reclaim/recycling. The process of de-drossing involves the operator physically opening up the rear access door (typically a gulf-wing configuration) adjacent to the solder pot and manually scooping out the hot dross. During this process, visible emissions are liberated from the pot which are highly irritating to the eyes, nose and throat of the operator. The operator is required to wear thermal gloves, an apron, safety glasses and a face shield and respiratory protection (for lead/tin particulate, corrosive gases (HCl) and aliphatic aldehyde (formaldehyde)). Local exhaust ventilation is provided from the interior of the wave soldering unit, but the solder pot is mechanically withdrawn from the main cabinet to allow the operator direct access to both sides of the hot pot. Once withdrawn, the local exhaust duct that is mounted in the cabinet becomes ineffective for removing the liberated materials. The primary health and safety hazards are: thermal burns from hot solder, respiratory exposure to materials noted above, back injuries from handling heavy solder ingots and dross drums and exposure to lead/tin solder residues/fine particulate during maintenance activities.
During the actual soldering process, the access doors are closed and the interior of the wave soldering unit is under a negative pressure due to the local exhaust ventilation provided on the flux and solder pot sides of the wave. This ventilation and the operating temperatures of the solder pot (typically 302 to 316°C, which is just above the melting point of solder), result in the minimal formation of lead fumes. The primary exposure to lead/tin particulate comes during the de-drossing and equipment maintenance activities, from the agitation of the dross in the pot, transfer to the reclaim vessel and clean-up of solder residues. Fine lead/tin particulate is formed during the de-drossing operation and can be released into the workroom and breathing zone of the wave solder operator. Various engineering control strategies have been devised to minimize these potential lead particulate exposures, including the incorporation of local exhaust ventilation to the reclaim vessel (see figure 3), use of HEPA vacuums for residue clean-up and flexible exhaust ducts with articulating arms to position ventilation at the hot pot during de-drossing. The use of brooms or brushes for sweeping up solder residues must be prohibited. Stringent housekeeping and personal hygiene practices must also be required. During wave solder equipment maintenance operations (which are done on a weekly, monthly, quarterly and annual basis), various components of the hot pot are either cleaned within the equipment or removed and cleaned in a locally exhausted hood. These cleaning operations may involve physically scraping or mechanically cleaning (using an electric drill and wire brush attachment) the solder pump and baffles. High levels of lead particulate are generated during the mechanical cleaning process, and the process should be performed in a locally exhausted enclosure.
Figure 3. Dross cart with vacuum cover
Inspection, touch-up and testing
Visual inspection and touch-up functions are conducted after wave soldering and involve the use of magnifying lenses/task lights for fine inspection and touch-up of imperfections. The touch-up function may involve the use of a stick-solder hand-held soldering iron and rosin core solder or brushing on a small amount of liquid flux and lead/tin wire solder. The visual fumes from the stick soldering involve breakdown products from the flux. Small quantities of lead/tin solder bead that did not adhere to the solder joint may present a housekeeping and personal hygiene issue. Either a fan adjacent to the workstation for general dilution ventilation away from the operator’s breathing zone or a more sophisticated fume exhaust system that captures the breakdown products at the tip of the soldering iron or adjacent to the operation should be provided. The fumes are then routed to an air scrubber exhaust system that incorporates HEPA filtration for particulates and activated carbon gas adsorption for the aliphatic aldehydes and hydrochloric acid gases. The effectiveness of these soldering exhaust systems is highly dependent on capture velocities, proximity to the point of fume generation and lack of cross drafts at the work surface. The electrical testing of the completed PCB requires specialized test equipment and software.
Reworking and repairing
Based on the results of the board testing, defective boards are evaluated for specific component failures and replaced. This reworking of the boards may involve stick soldering. If primary components on the PCB such as the microprocessor need replacement, a rework solder pot is used for immersing that portion of the board housing the defective component or joint in a small solder pot, removing the component and then inserting a new functional component back onto the board. If the component is smaller or more easily removed, an air vac system that uses hot air for heating the solder joint and vacuum for removing the solder is employed. The rework solder pot is housed within a locally exhausted enclosure that provides sufficient exhaust velocity to capture the flux decomposition products formed when the liquid solder is brushed on the board and solder contact made. This pot also forms dross and requires de-drossing equipment and procedures (on a much smaller scale). The air vac system does not require being housed within an enclosure, but the lead/tin solder removed must be handled as a hazardous waste and reclaimed/recycled.
Support operations—stencil cleaning
The first step in the PCB assembly process involved the use of a stencil for providing the pattern of bonding locations for the lead/tin solder paste to be squeegeed through. Typically, the stencil’s openings start to become clogged and the lead/tin solder paste residues must be removed on a per shift basis. A pre-cleaning is usually performed at the screen printer to capture gross contamination on the board, by wiping the board surface with a dilute alcohol mixture and disposable wipes. To completely remove the remaining residues a wet-cleaning process is required. In a system similar to a large dishwasher, hot water (57°C) and a chemical solution of dilute aliphatic amines (monoethanol amine) is used to chemically remove the solder paste from the stencil. Significant quantities of lead/tin solder are washed off the board and either deposited in the wash chamber or in solution in the water effluent. This effluent requires filtration or chemical removal of lead and pH adjustment for the corrosive aliphatic amines (using hydrochloric acid). Newer closed system stencil cleaners utilize the same wash solution until it is spent. The solution is transferred to a distillation unit, and the volatiles are distilled off until a semi-liquid residue is formed. This residue is then handled as a lead/tin-contaminated hazardous waste.
Computer Assembly Process
Once the final PCB is assembled, it is transferred to the systems assembly operation for incorporation into the final computer product. This operation is typically very labour intensive, with the component parts to be assembled supplied to the individual workstations on staging carts along the mechanized assembly line. The major health and safety hazards relate to materials movement and staging (fork-lifts, manual lifting), ergonomic implications of the assembly process (range of motion, insertion force required to “set” components, installation of screws and connectors) and final packaging, shrink wrapping and shipping. A typical computer assembly process involves:
The only chemicals that may be used in the assembly process involve the final cleaning of the computer case or monitor. Typically, a dilute solution of isopropyl alcohol and water or a commercial mixture of cleaners (e.g., Simple Green—a dilute butyl cellosolve and water solution) is used.
As an emerging industry, semiconductor manufacturing often has been viewed as the epitome of the high-technology workplace. Because of stringent manufacturing requirements associated with producing multiple layers of micron dimensional electronic circuitry on silicon wafers, the cleanroom environment has become synonymous with the workplace for this industry. Since certain of the hydride gases used in semiconductor manufacturing (e.g., arsine, phosphine) were recognized early as highly toxic chemicals, inhalation exposure control technology has always been an important component of wafer fabrication. Semiconductor workers are further isolated from the production process by wearing special clothing covering the whole body (e.g., gowns), hair covers, shoe covers and, frequently, facial masks (or even air-supplied breathing devices). From a practical standpoint, employer concerns for product purity have resulted, also, in worker exposure protection.
In addition to personal protective clothing, highly sophisticated systems of ventilation and chemical/gas air monitoring are used throughout the semiconductor industry to detect leaks of toxic chemical solvent vapours, acids and hydride gases at parts per million (ppm) or less. Although, from the historic viewpoint, the industry has experienced frequent worker evacuations from wafer fabrication rooms, based on real or suspected leaks of gases or solvents, such evacuation episodes have become rare events because of the lessons learned in design of ventilation systems, toxic gas/chemical handling and increasingly sophisticated air-monitoring systems with continuous air sampling. However, the increasing monetary value of individual silicon wafers (together with increasing wafer diameters), which can contain scores of individual microprocessors or memory devices, can place mental stress on workers who must manually manipulate containers of these wafers during manufacturing processes. Evidence of such stress was obtained during a study of semiconductor workers (Hammond et al. 1995; Hines et al. 1995; McCurdy et al. 1995).
The semiconductor industry had its beginnings in the United States, which has the highest number of semiconductor industry workers (approximately 225,000 in 1994) of any country (BLS 1995). However, obtaining valid international employment estimates for this industry is difficult because of the inclusion of semiconductor workers with “electrical/electronic equipment manufacturing” workers in most nations’ statistics. Because of the highly stringent engineering controls required for semiconductor device manufacturing, it is most probable that semiconductor workplaces (i.e., cleanrooms) are comparable, in most respects, throughout the world. This understanding, coupled with US government requirements for recording all significant work-related injuries and illnesses among US workers, makes the work injury and illness experience of US semiconductor workers a highly relevant issue on both a national and international scale. Simply stated, at this time there are few international sources of relevant information and data concerning semiconductor worker safety and health experience, other than those from the Annual Survey of Occupational Injuries and Illnesses by the US Bureau of Labor Statistics (BLS).
In the United States, which has collected work injury and illness data on all industries since 1972, the frequency of work-related injuries and illnesses among semiconductor workers has been among the lowest of all manufacturing industries. However, concerns have been voiced that more subtle health effects may be present among semiconductor workers (LaDou 1986), although such effects have not been documented.
Several symposia have been held concerning control technology assessment in the semiconductor industry, with several of the symposia papers dealing with environmental and worker safety and health issues (ACGIH 1989, 1993).
A limited quantity of work injury and illness data for the international semiconductor manufacturing community was derived via a special survey performed in 1995, involving cases reported for the years 1993 and 1994. These survey data are summarized below.
Work Injuries and Illness among Semiconductor Workers
With respect to international statistical data associated with work injuries and illnesses among semiconductor workers, the only comparable data appear to be those derived from a survey of multi-national semiconductor manufacturing operations performed in 1995 (Lassiter 1996). The data collected in this survey involved the international operations of US-based semiconductor manufacturers for the years 1993-94. Some of the data from the survey included operations other than semiconductor manufacturing (e.g., computer and disk drive manufacturing), although all participating companies were involved in the electronics industry. The results of this survey are presented in figure 1 and figure 2, which include data from the Asia-Pacific region, Europe, Latin America and the United States. Each case involved a work-related injury or illness which required medical treatment or work loss or restriction. All incidence rates in the figures have been calculated as numbers of cases (or lost workdays) per 200,000 worker-hours per year. If total worker-hours was not available, average annual employment estimates were used. The 200,000 worker-hours denominator is equal to 100 full-time equivalent workers per year (assuming 2,000 work hours per worker per year).
Figure 1. Distribution of incidence rates for work injuries and illnesses by world sector, 1993 and 1994.
Figure 2. Distribution of incidence rates for Injuries and illnesses with days off from work by world sector 1993 and 1994
Figure 1 depicts work injury and illness incidence rates for the various world regions in the 1993-94 survey. Individual country rates have not been included to ensure confidentiality of those participating companies which were the sole sources of data for certain countries. Hence, for certain countries in the survey, data were reported for only a single facility. In several instances, companies combined all international data into a single statistic. These latter data are listed in figure 1 and figure 2 as “Combined”.
The annual incidence of work injuries and illnesses among all workers in the international survey was 3.3 cases per 100 employees (200,000 worker-hours) in 1993 and 2.7 in 1994. There were 12,615 cases reported for 1993 and 12,368 for 1994. The great majority of cases (12,130 in 1993) were derived from US companies. These cases were associated with approximately 387,000 workers in 1993 and 458,000 in 1994.
Figure 2 presents incidence rates for lost workday cases involving days away from work. The 1993 and 1994 incidence rates were based on approximately 4,000 lost workday cases for each of the 2 years in the international survey. The international/regional range in incidence rates for this statistic was the most narrow of those measured. The incidence of lost workday cases may represent the most comparable international statistics with respect to worker safety and health experience. The incidence rate for lost workdays (days away from work) was approximately 15.4 days away from work per 100 workers for each of the 2 years.
The only detailed data known to exist concerning case characteristics of semiconductor worker injuries and illnesses are those compiled annually in the US by the BLS, involving cases with lost workdays. The cases discussed here were identified by the BLS in their annual survey for the year 1993. Data obtained from these cases appear in figure 3, figure 4, figure 5 and figure 6. Each figure compares the lost workday case experience for the private sector, all manufacturing and semiconductor manufacturing.
Figure 3. Comparative incidence of lost workdays cases1 by type of event or exposure, 1993
Figure 4. Comparative incidence of lost workday cases1 by source of injury or illness, 1993.
Figure 5. Comparative incidence of lost workday cases1 by nature of injury or illness, 1993.
Figure 6. Comparative incidence of lost workday cases by part of body affected, 1993
Figure 3 compares the lost workday case experience of US semiconductor workers in 1993 with the private sector and with all manufacturing with respect to type of event or exposure. The incidence rates for most categories in this figure were much less for semiconductor industry workers than for the private sector or all manufacturing. Cases involving overexertions among semiconductor workers were less than half the rate for all workers in the manufacturing sector. The harmful exposure category (primarily associated with exposures to chemical substances) was equivalent among all three groups.
Comparative distributions of lost workday cases according to source of injury or illness are presented in figure 4. Lost workday case incidence rates for semiconductor workers were less than those for the private sector and all manufacturing in all source categories except for cases associated with exposures to chemical substances.
Figure 5 compares lost workday case incidence rates associated with nature of injury or illness among the three groups. The rates for semiconductor workers were less than half of the rates for both the private sector and for all manufacturing in 1993. The incidence of chemical burns was slightly higher for semiconductor workers, but was very low for all three comparison groups. The incidence of carpal tunnel syndrome (CTS) among US semiconductor workers was less than half the rate for all manufacturing.
In figure 6, the distribution and incidence of cases involving days away from work is illustrated according to part of body affected. Although the incidence of cases involving body systems was low for all comparison groups, the rate for semiconductor workers was slightly elevated. All other body parts affected were much lower for semiconductor workers than for the other two comparison groups.
Epidemiological Studies of Semiconductor Workers
Concern for possible reproductive health consequences associated with employment in the semiconductor surfaced in 1983 when a female employee at the Digital Equipment Corporation’s semiconductor facility in Hudson, Massachusetts, indicated that she believed that an excess of miscarriages had occurred among employees in the facility’s cleanrooms. This allegation, coupled with an absence of internal data at the facility, led to an epidemiological study by the University of Massachusetts School of Public Health in Amherst (UMass). The study was begun in May of 1984 and completed in 1985 (Pastides et al. 1988).
An elevated risk of miscarriage was observed in both the photolithographic area and the diffusion area when compared to non-exposed workers in other areas of the facility. A relative risk of 1.75 was considered to be not statistically significant (p <0.05), although a 2.18 relative risk observed among workers in diffusion areas was significant. Publication of the UMass study led to concern throughout the semiconductor industry that a larger study was warranted to validate the observed findings and to determine their extent and possible causation.
The Semiconductor Industry Association (SIA) of the United States sponsored a larger study performed by the University of California at Davis (UC Davis) beginning in 1989. The UC Davis study was designed to test the hypothesis that semiconductor manufacturing was associated with an increased risk of miscarriage for female wafer fabrication employees. The study’s population was selected from among 14 companies which represented 42 production sites in 17 states. The highest number of sites (representing almost half of the employees in the study) was in California.
The UC Davis study consisted of three different components: a cross-sectional component (McCurdy et al. 1995; Pocekay et al. 1995); an historical cohort component (Schenker et al. 1995); and a prospective component (Eskenazi et al. 1995). Central to each of these studies was an exposure assessment (Hines et al. 1995; Hammond et al. 1995). The exposure assessment component assigned employees to a relative exposure group (i.e., high exposure, low exposure and so on).
In the historical component of the study, it was determined that the relative risk of fabrication workers, compared with non-fabrication workers, was 1.45 (i.e., 45% excess risk of miscarriage). The highest risk group identified in the historical component of the study were women who worked in photolithography or etching operations. Women performing etching operations experienced a relative risk of 2.15 (RR=2.15). In addition, a dose-response relationship was observed among women who worked with any photoresist or developer with respect to increased risk of miscarriage. These data supported a dose-response association for ethylene glycol ethers (EGE) but not for propylene glycol ethers (PGE).
Although an increased risk of miscarriage was observed among female wafer fabrication workers in the prospective component of the UC Davis study, the results were not statistically significant (p less than 0.05). A small number of pregnancies significantly reduced the power of the prospective component of the study. Analysis by exposure to chemical agent indicated an increased risk for those women who worked with ethylene glycol monoethyl ether, but was based on only 3 pregnancies. One important finding was the general support for, and not contradiction of, the findings of the historical component.
The cross-sectional component of the study noted an increase in upper respiratory symptoms primarily in the diffusion furnace and thin film groups of workers. An interesting finding was the apparent protective effects of various engineering controls related to ergonomics (e.g., footrests and the use of an adjustable chair to reduce back injuries).
Air measurements made in the wafer fabs found most solvent exposures were less than 1% of the permissible exposure limits (PEL) established by the US government.
A separate epidemiological study (Correa et al. 1996) was performed by the Johns Hopkins University (JHU), involving a group of IBM Corporation semiconductor employees in 1989. The overall miscarriage rate observed in the JHU study involving female cleanroom workers was 16.6%. The relative risk for miscarriage among female cleanroom workers with the highest potential exposure to ethylene glycol ethers was 2.8 (95% C.I. = 1.4-5.6).
Discussion of Reproductive Epidemiological Studies Involving Semiconductor Workers
The epidemiological studies were remarkable in the scope and similarity of results. These studies all produced similar findings. Each study documented an excess risk of spontaneous abortion (miscarriage) for female semiconductor wafer fabrication workers. Two of the studies (JHU and UC Davis) may indicate a causal association with exposures to ethylene-based glycol ethers. The UMass study found that the photo group (those exposed to glycol ether) had less risk than the diffusion group, which had no documented glycol ether exposure. While these studies indicate an increased risk of spontaneous abortions among wafer fabrication workers, the cause of such excess risk is unclear. The JHU study failed to document a significant role for glycol ethers, and the UC Davis study only marginally linked glycol ethers (through modelling of exposures and self-reported work practices) to reproductive effects. Little if any monitoring was performed in either study to determine exposures to glycol ethers. Following completion of these studies the semiconductor industry began switching from ethylene series glycol ethers to substitutes such as ethyl lactate and propylene series glycol ethers.
Conclusion
Based on the best available data concerning the annual incidence of work-related injuries and illnesses, semiconductor workers are at less risk than workers in other manufacturing sectors or throughout the private sector (including many non-manufacturing industries). On an international basis, it appears that work injury and illness statistical data associated with lost workday cases may be a fairly reliable indicator of the worldwide safety and health experience of semiconductor workers. The industry has sponsored several independent epidemiological studies in an attempt to find answers to questions of reproductive health consequences related to employment in the industry. Although a definitive association between observed miscarriages and exposures to ethylene-based glycol ethers was not established, the industry has begun to use alternative photoresist solvents.
Industry Overview
The electronics industry, compared to other industries, has been viewed as “clean” in terms of its environmental impact. None the less, the chemicals used in the manufacture of electronic parts and components, and the waste generated, create significant environment issues that must be addressed on a global scale due to the size of the electronics industry. The wastes and by-products derived from the manufacture of printed wiring boards (PWBs), printed circuit boards (PCBs) and semiconductors are areas of interest that the electronic industry has vigorously pursued in terms of pollution prevention, treatment technology and recycling/reclamation techniques.
To a large degree, the incentive to control the environmental footprint of electronic processes has migrated from an environmental impetus to a financial domain. Due to the costs and liabilities associated with hazardous waste and emissions, the electronics industry has aggressively implemented and developed environmental controls that have greatly reduced the impact of its by-products and waste. In addition, the electronics industry has taken a proactive approach to incorporate environmental goals, tools and techniques into its environmentally conscious businesses. Examples of this proactive approach are the phase-out of CFCs and perfluorinated compounds and the development of “environmentally friendly” alternatives, as well as the emerging “design for the environment” approach to product development.
The manufacture of PWBs, PCBs and semiconductors requires the use of a variety of chemicals, specialized manufacturing techniques and equipment. Due to the hazards associated with these manufacturing processes, the proper management of chemical by-products, wastes and emissions is essential to assure the safety of the industry’s employees and the protection of the environment in the communities in which they reside.
Table 1, table 2 and table 3 present an outline of the key by-products and wastes that are generated in the manufacturing of PWBs, PCBs and semiconductors. In addition, the tables present the main types of environmental impact and the generally accepted means of mitigation and control of the waste stream. Primarily, the wastes that are generated affect industrial wastewater or the air, or become a solid waste.
Table 1. PWB waste generation and controls
Process steps |
Hazardous |
Environmental |
Controls1 |
Material |
None |
None |
None |
Stack and pin |
Heavy/precious metals |
Solid waste2 |
Recycle/reclaim |
Drilling |
Heavy/precious metals |
Solid waste2 |
Recycle/reclaim |
Deburr |
Heavy/precious metals |
Solid waste2 |
Recycle/reclaim |
Electroless |
Metals |
Wastewater |
Chemical precipitation |
Imaging |
Solvents |
Air |
Adsorption, condensation or |
Pattern plating |
Corrosives |
Wastewater/air |
pH neutralization/air scrubbing |
Strip, etch, strip |
Ammonia |
Air |
Air scrubbing (adsorption) |
Solder mask |
Corrosives |
Air |
Air scrubbing (adsorption) |
Solder coating |
Solvents |
Air |
Adsorption, condensation or |
Gold plating |
Corrosives |
Air |
Air scrubbing (adsorption) |
Component |
Solvents |
Air |
Adsorption condensation or |
1. Use of mitigation controls depends upon discharge limits in the specific location.
2. A solid waste is any discarded material regardless of its state.
Table 2. PCB waste generation and controls
Process steps |
Hazardous |
Environmental |
Controls |
Cleaning |
Metals (lead) |
Wastewater |
pH neutralization, chemical |
Solder paste |
Solder paste (lead/tin) |
Solid waste |
Recycle/reclaim |
Adhesive |
Epoxy glues |
Solid waste |
Incineration |
Component |
Plastic tapes, reels and tubes |
||
Adhesive cure and |
|||
Fluxing |
Solvent (IPA flux) |
Solid waste |
Recycle |
Wave soldering |
Metal (solder dross) |
Solid waste |
Recycle/reclaim |
Inspection and |
Metal |
Solid waste |
Recycle/reclaim |
Testing |
Scrapped populated |
Solid waste |
Recycle/reclaim |
Reworking and |
Metal (solder dross) |
Solid waste |
Recycle/reclaim |
Support |
Metal |
Solid waste |
Recycle/incineration |
Table 3. Semiconductor manufacturing waste generation and controls
Process steps |
Hazardous |
Environmental |
Controls |
Lithography/etching |
Solvents |
Solid waste |
Recycle/reclaim/incineration |
Oxidation |
Solvents |
Solid waste |
Recycle/reclaim/incineration |
Doping |
Poison gas (arsine, |
Air |
Substitution with liquid |
Chemical vapour deposition |
Metals Corrosives |
Solid waste |
Incineration |
Metallization |
Solvents |
Solid waste |
Incineration |
Assembly and testing |
Solvents |
Solid waste |
Recycle/reclaim/incineration |
Cleaning |
Corrosives |
Wastewater |
pH neutralization |
The following are generally accepted means of mitigating emissions in the PWB, PCB and semiconductor industries. The controls of choice will vary according to engineering capabilities, regulatory agency requirements and the specific constituents/concentrations of the waste stream.
Wastewater Control
Chemical precipitation
Chemical precipitation is generally used in the removal of particulate or soluble metals from wastewater effluents. Since metals do not naturally degrade and are toxic at low concentrations, their removal from industrial wastewater is essential. Metals can be removed from wastewater by chemical means since they are not very soluble in water; their solubilities depend upon the pH, metal concentration, type of metal and the presence of other ions. Typically, the waste stream requires pH adjustment to the proper level to precipitate out the metal. The addition of chemicals to wastewater in an effort to alter the physical state of dissolved and suspended solids is required. Lime, caustic and sulphide precipitation agents are commonly used. The precipitating agents facilitate the removal of dissolved and suspended metals by coagulation, sedimentation or entrapment within a precipitate.
A result of chemical precipitation of wastewater is the accumulation of sludge. Therefore, dewatering processes have been developed to reduce the weight of the sludge by means of centrifuges, filter presses, filters or drying beds. The resultant dewatered sludge can then be sent off for incineration or landfill.
pH neutralization
pH (the hydrogen-ion concentration or acidity) is an important quality parameter in industrial wastewater. Due to the adverse effects of pH extremes in natural waters and on sewage treatment operations, the pH of industrial wastewater must be adjusted prior to discharge from the manufacturing facility. Treatment occurs in a series of tanks that are monitored for the hydrogen-ion concentration of the wastewater effluent. Typically, hydrochloric or sulphuric acid is used as neutralizing corrosives, and sodium hydroxide is used as a neutralizing caustic. The neutralizing agent is metered into the wastewater effluent to adjust the pH of the discharge to its desired level.
Adjustment of pH is often required prior to the application of other wastewater treatment processes. Such processes include chemical precipitation, oxidation/reduction, activated carbon sorption, stripping and ion exchange.
Solid Waste Control
Materials are a solid waste if they are abandoned or discarded by being disposed of; burned or incinerated; or accumulated, stored or treated before or in lieu of being abandoned (US Code of Federal Regulation 40, Section 261.2). Hazardous waste generally exhibits one or more of the following characteristics: ignitability, corrosivity, reactivity, toxicity. Depending upon the characteristic of the hazardous material/waste, various means are used to control the substance. Incineration is a common treatment alternative for solvent and metal wastes generated during PWB, PCB and semiconductor manufacturing.
Incineration
Incineration (afterburner) or thermal destruction has become a popular option in handling ignitable and toxic wastes. In many instances, ignitable wastes (solvents) are used as a fuel source (fuel blending) for thermal and catalytic incinerators. Proper incineration of solvents and toxic wastes provides complete oxidation of the fuel and converts combustible material to carbon dioxide, water and ash, thereby leaving no liabilities associated with residual hazardous waste. The common types of incineration are thermal and catalytic incinerators. The selection of the type of incineration method is dependent upon the combustion temperature, fuel characteristics and residence time. Thermal incinerators operate at high temperatures and are widely used with halogenated compounds. Types of thermal incinerators include rotary kiln, liquid injection, fixed-hearth, fluidized bed and other advanced design incinerators.
Catalytic incinerators oxidize combustible materials (e.g., VOCs) by injecting a heated gas stream through a catalyst bed. The catalyst bed maximizes surface area, and by injecting a heated gas stream into the catalyst bed combustion can occur at a lower temperature than thermal incineration.
Air Emissions
Incineration is also used in control of air emissions. Absorption and adsorption are used as well.
Absorption
Air absorption is typically used in the scrubbing of corrosive air emissions, by passing the contaminant through and dissolving it in a non-volatile liquid (e.g., water). The effluent from the absorption process is typically discharged to a wastewater treatment system, where it undergoes pH adjustment.
Adsorption
Adsorption is the adherence (by means of physical or chemical forces) of a gas molecule to the surface of another substance, called an adsorbent. Typically, adsorption is used to extract solvents from an air emission source. Activated carbon, activated alumina or silica gel are commonly used adsorbents.
Recycling
Recyclable materials are used, reused or reclaimed as ingredients in an industrial process to make a product. Recycling of materials and waste provides environmental and economic means of effectively addressing specific types of waste streams, such as metals and solvents. Materials and wastes can be recycled in-house, or secondary markets may accept recyclable materials. The selection of recycling as an alternative for wastes must be evaluated against financial considerations, the regulatory framework and available technology to recycle the materials.
Future Direction
As the demand for pollution prevention increases and industry seeks cost-effective means to address chemical use and waste, the electronics industry must evaluate new techniques and technologies to improve the methods for hazardous-materials handling and waste generation. The end-of-pipe approach has been replaced by design for the environment techniques, where environmental issues are addressed over the full life cycle of a product, including: material conservation; efficient manufacturing operations; the use of more environmentally friendly materials; recycling, regeneration and reclamation of waste products; and a host of other techniques that will assure a smaller environmental impact for the electronics manufacturing industry. One example is the large amount of water that is used in the many rinsing and other processing steps in the microelectronics industry. In water-poor areas, this is forcing the industry to find alternatives. However, it is essential to make sure that the alternative (e.g., solvents) does not create additional environmental problems.
As an example of future directions in the PWB and PCB process, table 4 presents various alternatives for creating more environmentally sound practices and preventing pollution. Priority needs and approaches have been identified.
Table 4. Matrix of priority needs
Priority need (decreasing |
Approach |
Selected tasks |
More efficient use, |
Extend life of electrolytic and |
Research to extend baths. |
Reduce solid waste generated |
Develop and promote |
Develop infrastructure to |
Establish better supplier |
Promote supplier, |
Develop a model hazardous |
Minimize the impact of |
Reduce lead solder use when |
Change specifications to accept |
Use additive processes that |
Develop simplified, |
Collaborate on projects to |
Eliminate hole smear in PWB |
Develop no-smear resins or |
Investigate alternative |
Reduce water consumption |
Develop water use |
Modify specifications to reduce |
Source: MCC 1994.
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